Micron Technology Incorporated

Takayori Hamada

Yasuhiko Tanuma

Yuki Miura

Hiroshi Shimizu

Mamoru Nishizaki

Akeno Ito

Disclosed herein is an apparatus that includes a driver circuit including a plurality of first transistors arranged in a first direction; a control circuit including a plurality of second transistors arranged in parallel to the plurality of first transistors, each of the plurality of second transistors being coupled to control an associated one of the first transistors; and a power gating circuit arranged between the driver circuit and the control circuit, the power gating circuit being configured to supply a first power potential to each of the plurality of first transistors.

Semiconductor device equipped with column decoder circuit

An apparatus is described. The apparatus according to an embodiment includes a voltage dividing resistor circuit formed on a semiconductor substrate and including first and second resistors and first and second selector switches. The first and second resistors and the first and second selector switches are arranged with one of first and second layouts. The first layout is such that the first and second selector switches are placed between the first and second resistors. The second layout is such that the first and second resistors are placed between the first and second selector switches.

Apparatuses and methods for internal voltage generating circuits

Semiconductor devices and systems are disclosed. A semiconductor device includes a redistribution layer including a first polygonal structure for conveying a first power signal and including a first cutout region. The semiconductor device further includes a second polygonal structure for conveying a second power signal. Further, the semiconductor device includes an island polygon for conveying a third power signal and positioned within the first cutout region, wherein the island polygon does not touch the first polygonal structure.

Routing for power signals including a redistribution layer

Semiconductor devices and systems include semiconductor devices with first signal traces conveying a first power signal, second signal traces conveying a second power signal, and third signal traces conveying a third power signal. Each of the power signals are connected on a redistribution layer, a first wiring layer, and first-layer contacts. At least one of the first signal traces on the redistribution layer includes a cutout region and the third signal traces include a bypass structure on the redistribution layer and within the cutout region. The bypass structure conveys the third power signal on the redistribution layer around the first-layer contacts coupled to the first signal traces on the redistribution layer.

Growing community of inventors

Kanagawa, Japan

Takayori Hamada