Dai Nippon Printing Co., Ltd.

Takayasu Komatsu

Akira Makita

Hirofumi Hideshima

Takuya Ogio

Daisuke Hashimoto

Yutaka Matsumoto

Hiromitsu Ochiai

Shunji Miyakawa

Toshimu Watanabe

Koji Fujiyama

The present invention provides a shadow mask having an improved resistance to an impact such as vibration or dropping so as to keep a constant quality of a color cathode-ray tube. The object is achieved by a shadow mask in which throughholes are formed, each of the throughholesandhaving a rear side hole portionorthrough which an electron beam enters and a front side hole portionorthrough which the electron beam is emitted so as to form a beam spot having a prescribed shape on a surface to be irradiated; wherein, each of the throughholesandhas a ridge portionorformed by intersection of a taper surfaceorof the rear side hole portionorand a taper surfaceorof the front side hole portionor; the taper size T represented by a value a half the difference between the hole width S at endorof the front side hole portionorand the hole width Q at the ridge portionoris within a range of from 30 to 40% of the thickness t of the shadow mask; and the ridge portion is formed at a sectional height of up to 35 &#x3bc;m from the endof the rear side hole portionor

Shadow mask for a cathode ray tube

A shadow mask is formed from a plate member comprising an outer frame portion, a body portion of a shadow mask having an outer peripheral line formed through an etching process and a plurality of connection portions through which the body portion of the shadow mask is supported by the outer frame portion. The shadow mask is formed from the plate member by removing the outer frame portion from the body portion of the shadow mask. In this process, a break portion is formed to the shadow mask by removing the outer frame portion so as to be recessed inward from the outer peripheral line of the shadow mask.

Shadow mask, plate member therefor and method of manufacturing shadow mask

A process of forming a high-definition pattern by etching is provided. A photosensitive resin layer is formed on a metal substrate material having a center line-average surface roughness Ra of up to 0.10 &mgr;m and a maximum surface roughness Rmax of up to 1.0 &mgr;m to form a resist pattern. Then, the photosensitive resin layer provided on the metal substrate material is exposed to light to form a resist pattern. Finally, etching is carried out to form a pattern on the metal substrate material.

Etching substrate material, etching process, and article obtained by etching

In an apparatus and method for forming an applied layer of a photosensitive resin on a large glass substrate for an LCD color filter, a substrate (S) is suctioned and held by a movable holder (8) with a main surface thereof to be processed oriented downward. The movable holder (8) is at an angle of inclination (.theta.) to the horizontal and is capable of moving along a guide rail (7). An application head (H) having an upward-pointing linear slit (13) through which an application liquid is supplied is provided below a region through which the substrate (S) moves supported by the holder (8). When the substrate (S) having a constant clearance (I.sub.2) with the application head (H) is moved diagonally upward, an application liquid bead (B) is formed between the slit (13) and the downward-pointing main surface of the substrate (S), by surface tension. The application liquid bead (B) is moved gradually diagonally downward along the main surface of the substrate to form an application layer (Ra). A meniscus (L.sub.2) of the application liquid bead (B) facing the higher side of the substrate (S) has a height dimension (h.sub.2) that is greater than that of a meniscus (L.sub.1) thereof facing the lower side of the substrate, and the height dimension of the meniscus on the higher side of the substrate (S) is made to be sufficiently larger than the thickness of the application liquid layer. This suppresses the generation of shear forces caused by differences in tension force within the application liquid bead (B) created by unevenness in the substrate surface, and thus a uniform applied layer can be formed stably and at a high usage efficiency of application liquid, without being affected by unevenness in the main surface of the substrate.

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Tokyo-to, Japan

Takayasu Komatsu