Teijin Limited

Teijin Carbon Europe Gmbh

Renesas Electronics Corporation

National Institute of Advanced Industrial Science and Technology

The University of Tokyo

Takaya Suzuki

Toru Kaneko

Yosuke Nakamura

Hidekazu Yoshikawa

Hironori Kawamoto

Shuhei Yoshida

Takashi Ipposhi

Hiroaki Kuwahara

Jun-ichi Sugiyama

Noriaki Saitou

Miki Horikawa

Hiroaki Zushi

The present invention provides a thermosetting resin composition characterized by comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.

Thermosetting resin composition, film adhesive, prepreg, and production method thereof

An object of the present invention is to provide a carbon fiber which exhibits excellent strength development rate when used in a composite material. The present invention that solves the problems is a carbon fiber which simultaneously satisfies the following formulae (1) and (2):&#x2264;3&#x2003;&#x2003;(1)TS&#xd7;&#x3e;6.0&#xd7;10&#x2003;&#x2003;(2)

Carbon fiber bundle, prepreg, and fiber-reinforced composite material

The problem of the present invention is to provide a carbon fiber manufacturing device in which fiber to be carbonized is irradiated with microwaves and thereby heated, wherein the carbon fiber manufacturing device is compact and capable of performing carbonization at atmospheric pressure without requiring an electromagnetic wave absorber or other additives or preliminary carbonization through external heating. This carbon fiber manufacturing device () includes: a cylindrical furnace () comprising a cylindrical waveguide in which one end is closed, a fiber outlet () being formed in the one end of the cylindrical waveguide and a fiber inlet () being formed in the other end of the cylindrical waveguide; a microwave oscillator () for introducing microwaves into the cylindrical furnace (); and a connection waveguide () having one end connected to the microwave oscillator () side and the other end connected to one end of the cylindrical furnace ().

Carbon fiber manufacturing device and carbon fiber manufacturing method

The present invention realizes the miniaturization of a semiconductor device. On a first insulation film, an island-like semiconductor layer and a second insulation film which surrounds the semiconductor layer are formed, and resistance elements (for example, poly-silicon resistance elements) which are formed of a conductive film are arranged to be overlapped to an upper surface of the semiconductor layer in plane.

Semiconductor device and a method of manufacturing the same

Growing community of inventors

Bunkyo-ku, Japan

Takaya Suzuki