Mitsubishi Electric Corporation

Takaya Noguchi

Akira Okada

Norihiro Takesako

Hajime Akiyama

Kinya Yamashita

Yoshiyuki Ueda

Yoshinori Ito

Yuji Ebiike

Koichi Mochizuki

Masaki Ueno

Yasushi Hisaoka

Koichi Takayama

Yoshikazu Ikuta

Kosuke Hatozaki

Shunichi Kawakami

Takayuki Shirotori

Sumito Ogata

A semiconductor test apparatus includes a chuck top on which a semiconductor wafer is mounted, and contact probes that contact measurement points of semiconductor chips formed on the semiconductor wafer, the chuck top includes a conductor that contacts a lower surface of the semiconductor wafer, a mounting table arranged below the conductor, and a first vacuum tube and a second vacuum tube connected to the mounting table, the conductor has a plurality of suction holes that are arranged in a spiral form in top view, in the mounting table, a flow pass communicating with the plurality of suction holes and having a spiral form in top view, the first vacuum tube is connected to an inner circumference portion of the flow pass, and the second vacuum tube is connected to an outer circumference portion of the flow pass.

Semiconductor test apparatus and semiconductor test method

A semiconductor manufacturing apparatus includes: a sheet separation jig having contact with a rear surface of a sheet which is a surface of the sheet on a side opposite to a front surface of the sheet, wherein the sheet separation jig includes therein a plurality of support blocks each having a first suction hole formed for sucking the rear surface of the sheet and a single driving plate connected to the plurality of support blocks so that the plurality of support blocks can move in a first direction as a direction away from the sheet with a time difference, and the plurality of support blocks are disposed in the sheet separation jig along a second direction, as a direction of a separation of the semiconductor device from the sheet, intersecting the first direction.

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

An object is to provide a technique capable of creating a precise measurement condition in a facilitated manner relating to an electrical characteristic inspection for a semiconductor device. An electrical characteristic inspection device includes a storage unit configured to store a measurement condition of the semiconductor device being an inspection subject, a control unit configured to read out the measurement condition corresponding to inspection contents to be executed from the storage unit, an inductive inductance control circuit unit configured to set inductive inductance for the semiconductor device, and a floating inductance control circuit unit configured to set floating inductance for the semiconductor device. Based on the measurement condition read out from the storage unit, the control unit is configured to adjust the inductive inductance by controlling the inductive inductance control circuit unit, and adjust the floating inductance by controlling the floating inductance control circuit unit.

Electrical characteristic inspection device for semiconductor device and electrical characteristic inspection method for semiconductor device

A semiconductor test apparatus includes: a power supply; a high-voltage wire connecting high-voltage terminals of a plurality of semiconductor devices which are objects to be tested to a high-voltage side of the power supply; a low-voltage wire connecting low-voltage terminals of the semiconductor devices to a low-voltage side of the power supply; first switches connected in series to the semiconductor devices respectively, each of the first switches having one end connected to the low-voltage side of the power supply via the low-voltage wire and other end connected to the low-voltage terminal; second switches connected to the semiconductor devices respectively, each of the second switches having one end connected to the high-voltage terminal and other end connected to the low-voltage terminal; and a control circuit controlling the first switches and the second switches.

Semiconductor test apparatus, semiconductor device test method, and semiconductor device manufacturing method

Provided is an evaluation apparatus of a semiconductor device suppressing a discharge occurring in a part of a semiconductor device at a time of evaluating its electrical characteristics. The evaluation apparatus of a semiconductor device includes a stage to support a semiconductor device; a plurality of probes located above the stage; an insulating body having a frame shape to surround the plurality of probes and located above the stage; and an evaluation part injecting a current into the semiconductor device via the plurality of probes. The insulating body includes a tip portion having flexibility and facing the stage. The tip portion includes, in one side surface of the tip portion, a contact surface to come in contact with the semiconductor device by a deformation of the tip portion toward an inner side or an outer side of the frame shape.

Evaluation apparatus of semiconductor device and method of evaluating semiconductor device using the same

An evaluation apparatus for a semiconductor device includes: a chuck stage that has a surface on which a plurality of probe holes are formed and sucks a semiconductor device; and a plurality of in-chuck probes that have first ends which are inserted into the respective probe holes, and second ends which protrude from the surface of the chuck stage, and come into contact with an arrangement surface of the semiconductor device arranged in the chuck stage, wherein a height protruding from the surface of the chuck stage of at least one of the in-chuck probes is different from a height protruding from the surface of the chuck stage of the other in-chuck probe.

Evaluation apparatus for semiconductor device and evaluation method for semiconductor device

Provided is a technique capable of preventing occurrence of partial discharge. An evaluation apparatus includes a probe disposed on an undersurface of an upper component; a sidewall part disposed on the undersurface of the upper component and enclosing sides of the probe; and a first gas supplying part. The first gas supplying part is capable of supplying a gas to a to-be-measured object that is placed on a stage when the sidewall part comes in proximity to the stage, and to a space enclosed by the stage, the sidewall part, and the upper component when the sidewall part is in contact with the stage.

Evaluation apparatus and evaluation method

Provided is a probe position inspection device that can inspect with ease and higher precision a position of a probe included in a semiconductor evaluation apparatus. The probe includes an inspection magnetic field producing part that produces a magnetic field corresponding to a contact point with a subject semiconductor apparatus. The probe position inspection device includes: a base part having a front surface that can be contacted by the probe, and including a plurality of magnetic field sensors placed in a plane parallel to the front surface, each of the magnetic field sensors sensing the magnetic field produced by the inspection magnetic field producing part; and an output part electrically connected to the magnetic field sensors, the output part outputting, based on the magnetic field, a signal corresponding to each of the magnetic field sensors.

Device and method for inspecting position of probe, and semiconductor evaluation apparatus

A probe position inspection apparatus capable of inspecting the position of contact portions of respective probe tips easily and accurately, an apparatus for inspecting a semiconductor device, and a method of inspecting a semiconductor device are provided. The probe position inspection apparatus includes a transparent plate, a camera for taking an image of one surface of the transparent plate, and a pressure passive member covering the other surface of the transparent plate. The tip of a probe for use in evaluation of a semiconductor device is pressed against the other surface of the transparent plate, with the pressure passive member therebetween. The probe position inspection apparatus further includes an image processor for processing the image taken by the camera to detect the position of the probe in the plane of the transparent plate.

Probe position inspection apparatus, semiconductor device inspection apparatus and semiconductor device inspection method

A base having electrical conductivity and a plate shape for a semiconductor device evaluation jig has a front surface which includes a mount region where a semiconductor device is to be mounted. In this mount region, the base has a through hole extending through the base. A temperature detecting element is attached to the base. An electrode pad is electrically connected to the temperature detecting element and formed in the front surface side.

Semiconductor device evaluation jig, semiconductor device evaluation apparatus, and semiconductor device evaluation method

A probe position inspection apparatus which incorporates a rotatable internal prism is attached to a supporting unit for supporting semiconductor device, thus making it possible to accurately inspect in-plane positions of tips of probes in a short time and also making it possible to adapt the probe position inspection apparatus to a double-sided prober.

Evaluation apparatus and probe position inspection method

A measuring apparatus includes a measuring unit for measuring an electrical characteristic of a measurement object by applying an electrical signal, and a discharge detection unit connected to the measuring unit, the discharge detection unit obtaining an electrical signal value that is the value of the electrical signal applied to the measurement object, wherein if the electrical signal value is smaller than a predetermined reference value, the discharge detection unit issues a discharge alarm to the outside when a difference value between the electrical signal value and the reference value becomes larger than a predetermined first comparison value after the difference value becomes smaller than the first comparison value, and wherein the reference value is set equal to or larger than the maximum of the electrical signal value when no electric discharge occurs.

Measuring apparatus

A measuring apparatus includes a stage on which an object to be measured is placed, an insulating base plate, a probe fixed on the insulating base plate, a measuring unit which measures an electrical characteristic of the object to be measured through the probe, a side wall part having such a shape as to surround the probe and smaller in width than the stage, and a supply tube through which an insulating liquid is supplied, wherein when an electrical characteristic of the object to be measured is measured, the stage, the side wall part and the insulating base plate form a measurement region surrounding the object to be measured, and the insulating liquid is applied from the supply tube to the object to be measured in the measurement region.

Measuring apparatus and measuring method utilizing insulating liquid

A semiconductor evaluation apparatus includes a jig for evaluation and a probe substrate. The jig for evaluation is provided such that a plurality of semiconductor devices can be placed thereon. The probe substrate is provided so as to face the jig for evaluation, and includes a contact probe. The jig for evaluation includes a plurality of housing portions divided by a frame portion such that the plurality of semiconductor devices can be separately placed on the plurality of housing portions, respectively. The semiconductor evaluation apparatus is configured such that the contact probe can be brought into contact with a plurality of elements in the state where a space is provided by bringing the frame portion and the probe substrate in proximity to each other. In this space, each of the plurality of semiconductor devices is placed between a corresponding one of the plurality of housing portions and the probe substrate.

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Tokyo, Japan

Takaya Noguchi