Sanyo Electric Co., Ltd.

Sanyo Semiconductor Co., Ltd.

Semiconductor Components Industries, LLC

Takaya Kusabe

Sadamichi Takakusaki

Hideki Mizuhara

Yusuke Igarashi

Mayumi Nakasato

Motoichi Nezu

Noriaki Sakamoto

Naoki Tanahashi

Fumio Horiuchi

Masahiko Mizutani

Tsuyoshi Hasegawa

Yoshinari Sakuma

Toru Imaizumi

A light-emitting diode driver circuit includes: a first-rectifier circuit to output a first-rectified voltage; a transformer including primary and secondary coils and an auxiliary coil inductively coupled to the primary or secondary coils, the primary coil being applied with the first-rectified voltage; a transistor connected in series to the primary coil; a second-rectifier circuit to output a second-rectified voltage obtained by rectifying a voltage generated in the auxiliary coil; a capacitor to be charged with the second-rectified voltage; and a control circuit to control on and off of the transistor based on a charging voltage of the capacitor so that the charging voltage becomes equal to a predetermined voltage, the secondary coil outputting a voltage that varies with a frequency corresponding to a frequency of the first-rectified voltage and that corresponds to a turns ratio between the primary and secondary coils, as a voltage for driving a light-emitting diode.

Light-emitting diode driver circuit and lighting apparatus

A lighting device including a metal substrate to prevent temperature rise of LED chip is offered. The lighting device includes the metal substrate, an anode or cathode electrode of the LED chip disposed on the metal substrate, brazing materials connecting the LED chip and the metal substrate, and a groove formed in the anode or cathode electrode. Forming the groove can prevent an occurrence of a crack in the brazing materials. Also, a lighting device includes the metal substrate, an anode and cathode electrode of the LED chip disposed on the metal substrate and brazing materials connecting the LED chip and the metal substrate. Further, a slit is formed in the metal substrate between the anode and cathode electrode. Forming the slit in the metal substrate can prevent an occurrence of a crack in the brazing materials.

Lighting device and method of manufacturing the same

To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.

Methods for manufacturing device mounting board and circuit substrate

Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board

Provided are a hybrid integrated circuit device in which fine patterns can be formed while current-carrying capacitances are ensured, and a method of manufacturing the same. The hybrid integrated circuit device of the present invention includes conductive patterns formed on a front surface of a circuit substrate and circuit elements electrically connected respectively to the conductive patterns. The conductive patterns include a first conductive pattern and a second conductive pattern formed more thickly than the first conductive pattern. The second conductive pattern includes a protruding portion protruding in a thickness direction thereof.

Circuit device and method of manufacturing the same

To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, after the resin sealed body containing a circuit device is formed on a top surface of the supporting substrate. Therefore, manufacture of a circuit device having no substrate becomes possible and it realizes a thinner and lighter circuit device with improved heat dissipation. Moreover, since sealing with a sealing resin can be performed on the supporting substrate, warps, caused by the differences in thermal expansion coefficients between the sealing resin and conductive patterns and between the sealing resin and circuit components, can be prevented. Hence, it becomes possible to prevent flaking of conductive patterns from the substrate and a poor contact between the conductive patterns and a metal thin wire, and consequently to manufacture a highly reliable circuit device.

Method of manufacturing circuit device

Growing community of inventors

Gunma, Japan

Takaya Kusabe