Yazaki Corporation

Dowa Metaltech Co., Ltd.

National Institute of Advanced Industrial Science and Technology

Takaya Kondo

Hideki Endo

Akira Sugawara

Hiroto Narieda

Hirotaka Kotani

Yuta Sonoda

Yuya Kishibata

Jyun Toyoizumi

Tadahisa Sakaguchi

Yoshitaka Ito

Junya Shinohara

Ryuji Sugizaki

Jun Toyoizumi

Nobuhisa Kaneko

Yasuhiro Fukuyama

Provided is a method of manufacturing an electric wire with terminal formed by connecting a first core exposed portion of an electric wire to a metal terminal having a box portion that is formed by processing a single conductive board into a box shape and has an opening in which a counterpart terminal is inserted, and a spring inside the box portion. After laser-welding opposed portions where parts of the single conductive board forming the box portion are opposed to each other, applying ultrasonic vibration to a second core exposed portion of the electric wire is executed.

Method of manufacturing electric wire with terminal and electric wire with terminal

A deterioration degree diagnosis device includes a measurement unit and a diagnosis unit. The measurement unit measures an impedance related to a contact resistance of an electrical connection portion by measuring an AC voltage between metal members and an AC current flowing between the metal members in a state where an AC signal of a predetermined frequency is applied to an electric circuit that connects two metal members in contact via the electrical connection portion. The diagnosis unit diagnoses a deterioration degree of the electrical connection portion based on a reactance component value in the impedance measured by the measurement unit.

Deterioration degree diagnosis device and deterioration degree diagnosis method for electrical connection portion

A tin-plated product contains: a substrateof copper or a copper alloy; an underlying layerof nickel which is formed on the surface of the substrate; and an outermost layercontaining tin, the outermost layerbeing formed on the surface of the underlying layer, the outermost layerbeing composed of a copper-tin alloy layerof a large number of crystal grains of a copper-tin alloy, tin layersof tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layersof a copper-nickel-tin alloy, each of the tin layersbeing formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layersbeing arranged on the side of the underlying layerin the copper-tin alloy layerso as to be apart from each other.

Tin-plated product and method for producing same

There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layeris formed on a substrateof copper or a copper alloy so as to have a thickness of 0.1 to 1.5 &#x3bc;m by electroplating, a tin-copper plating layercontaining tinmixed with a copper-tin alloyis formed thereon so as to have a thickness of 0.6 to 10 &#x3bc;m by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layeris formed thereon so as to have a thickness of 1 &#x3bc;m or less by electroplating if necessary.

In order to promote the adhesion of a crimp terminal () to an aluminum electric wire () by virtue of crimping to thereby realize an improvement in electric connecting performance, the thickness of tin plating applied to an inner surface of a conductor crimping portion () of the crimp terminal () is set to be in the range from 2.1 &#x3bc;m to 5.0 &#x3bc;m, and then, the conductor crimping portion () is crimped to a conductor () of the aluminum electric wire ().

Method for crimping terminal to aluminum electric wire

Growing community of inventors

Shizuoka, Japan

Takaya Kondo