Tdk Corporation

Takaya Ishigaki

Masanori Yamamoto

Takashi Kamiya

Taisuke Ahiko

Masatoshi Ishikawa

Yuji Aiba

Shunji Itakura

Akira Sasaki

Hiroshi Yagi

Hiroki Sato

Ryo Kobayashi

Kaoru Kawasaki

Yasunori Chiba

Masatoshi Ito

Ryuji Hosogaya

Takashi Abe

Hideki Yokoyama

Yasushi Izumibe

Tetuji Maruno

Yoshimi Yodokawa

Shintarou Kon

Kamiya Takashi

Eizou Tsunoda

Shigehiko Shirai

Minoru Kanzaki

Makoto Morita

Wataru Takahara

Hiraku Harada

Yoshikazu Fujishiro

A process of producing a ceramic electronic component comprises external electrodes having first electrode layers containing at least a noble metal, cuprous oxide, and glass ingredient electrically connected to internal electrodes comprising a noble metal. As the ceramic electronic components, for example, a multi-layer ceramic capacitor, multi-layer varistor, multi-layer dielectric resonator, multi-layer piezoelectric element, etc. may be mentioned.

Process for producing a ceramic electronic component

A ceramic substrate having two side surfaces in a lengthwise direction and two side surfaces in a widthwise direction intersecting each other. The ceramic substrate also includes at least one flat surface in a thicknesswise direction. Internal electrode films are embedded in the ceramic substrate with film surfaces thereof extending roughly parallel to the flat surface of the ceramic substrate. External electrodes are each provided on the flat surface of the ceramic substrate toward one of the two ends of the ceramic substrate in the lengthwise direction, are electrically continuous with the internal electrode films and are formed over distances and from the two side surfaces in the widthwise direction.

Chip-type electronic component

A method of manufacturing a ceramic capacitor relates to a ceramic capacitor having metal plate terminals that absorb thermal stress and mechanical stress caused by flexure of the substrate. A ceramic capacitor element is provided with terminal electrodes at the two side end surfaces facing opposite each other. The metal plate terminals are each connected to one of the terminal electrodes at one end thereof, are each provided with a folded portion in a middle area and a terminal portion to be connected to the outside toward the other end from the folded portion.

Method of manufacturing a ceramic capacitor

A multilayer capacitor having a hexagonally-shaped capacitor body, a first internal electrode arranged therein, and a second internal electrode arranged below the first internal electrode separated by a ceramic layer. The capacitor body is provided with a first through-hole electrode passing through the second non-contact hole, of the second internal electrode and electrically connected to the first internal electrode and a second through-hole electrode passing through the first non-contact hole of the first internal electrode and electrically connected to the second internal electrode in columnar shapes extending to intersect the internal electrodes. The first through-hole electrode is electrically connected to the first external electrodes arranged in island shapes at the upper and lower flat portions. The second through-hole electrode is electrically connected to the second external electrodes arranged in island shapes at the surfaces of the capacitor body.

Multilayer ceramic capacitor

A ceramic electronic component comprising external electrodes having first electrode layers containing at least a noble metal, cuprous oxide, and glass ingredient electrically connected to internal electrodes having a noble metal. As the ceramic electronic components, for example, a multi-layer ceramic capacitor, multi-layer varistor, multi-layer dielectric resonator, multi-layer piezoelectric element, etc. may be mentioned.

Ceramic electronic component having electronic component containing cuprous oxide

Chip-type electronic component having external electrodes that are spaced at predetermined distances from side surfaces of a ceramic substrate

The present invention relates to a ceramic capacitor having metal plate terminals that absorb thermal stress and mechanical stress caused by flexure of the substrate. A ceramic capacitor element is provided with terminal electrodes at the two side end surfaces facing opposite each other. The metal plate terminals are each connected to one of the terminal electrodes at one end thereof, are each provided with a folded portion in a middle area and a terminal portion to be connected to the outside toward the other end from the folded portion.

Ceramic capacitor

An unbaked ceramic layer is formed by applying a ceramic paste on to an organic flexible supporting body. First target marks are formed on the flexible supporting body before or after this process. Then, the positioning for printing electrodes is performed based upon information obtained through image processing of the first target marks, to print the electrodes on the unbaked ceramic layer. With this, a manufacturing method for ceramic electronic components that can minimize positional misalignment in electrode patterns is provided.

Manufacturing method and manufacturing apparatus for ceramic electronic

A multi-layer electronic part, such as a multi-layer ceramic capacitor, which comprises internal electrodes stacked alternately with layers of a dielectric material containing at least 50 wt % of lead in terms of PbO and external electrodes connected to the internal electrodes, the external electrodes each comprising a baked electrode layer connected to the internal electrodes; a plating layer having solderability; and a metal particle-containing electrode layer comprising a thermosetting resin and metal particles, between the baked electrode layer and the plating layer, the metal particle-containing electrode layer having a thickness of from 5 to 200 .mu.m, the metal particle-containing electrode layer being disposed between the baked electrode layer and the plating layer.

Multi-layer electronic part having external electrodes that have a

According to the present invention, ceramic electronic components are produced by a process which includes the steps of forming an unbaked ceramic layer on a surface of an organic flexible supporting body by applying a ceramic paste, the surface having an area that is given a peeling treatment and areas that are not given the peeling treatment; forming first target marks on the flexible supporting body; and positioning and priming electrodes on the unbaked ceramic layer, based upon information obtained through image processing of the first target marks.

The invention decreases crosstalk due to capacitive coupling between through type capacitor elements in a multilayer through type capacitor array. On dielectric sheets between electrodes, which constitute a multi capacitor array, through-holes filled with conductive materials are formed, where a central conductor is not present. By electrically connecting conductive materials filled in the through-holes, electrostatic shielding is provided between the through type capacitor elements. Electrical connection is achieved through conductive layers formed outside or inside the through type capacitor elements.

Multilayer through type capacitor array

Growing community of inventors

Tokyo, Japan

Takaya Ishigaki