Mitsubishi Electric Corporation

Takatoshi Yasui

Shoji Saito

Akira Yamamoto

Yoshikazu Tsunoda

Yuki Hata

Takahiko Murakami

Korehide Okamoto

Ryoji Murai

Katsuji Ando

The mold device according to the present invention is a mold device to resin-seal the semiconductor device including an insert electrode, and in the semiconductor device, the insert electrode is provided with an insert hole, a nut having a screw hole is disposed in the insert electrode so that the insert hole and the screw hole communicate with each other, the mold device includes a mold body into which resin is injected to resin-seal the semiconductor device, including a side of the insert electrode where the nut is disposed, and a rod-like member that is inserted into the insert hole, and the rod-like member is inserted into the screw hole of the nut through the insert hole of the insert electrode to draw the nut to the side of the insert electrode.

Mold device

An object of the present invention is to synchronize PWM between individual phases of an IPM, so that the IPM has a simplified-scale circuit. An IPM according to the present invention includes a DC-DC converter including a multi-phase arm having a plurality of phase arms connected in parallel on a secondary side, a secondary-wire-voltage detection circuit configured to detect a secondary wire voltage in each phase arm of the DC-DC converter, and a synchronization-signal generation circuit configured to generate a synchronization signal in each phase arm on the basis of the behavior of the secondary wire voltage.

Intelligent power module

Growing community of inventors

Tokyo, Japan

Takatoshi Yasui