Disco Co., Ltd.

Disco Abrasive Systems, Ltd.

Takatoshi Ono

Shinji Sekiya

A dicing machine for cutting a semiconductor wafer along cutting lines arranged in a lattice pattern. The dicing machine comprises a cutting station, at least one alignment station, a cutting means disposed in the cutting station, a detecting means disposed in the alignment station for detecting the cutting lines of the wafer, and a wafer transferring means. The wafer transferring means includes two wafer supporting means and the dicing machine is capable of positioning one of the two wafer supporting means in the alignment station and performing alignment of a semiconductor wafer supported with said one of the wafer supporting means while positioning the other of the wafer supporting means in the cutting station and cutting a semiconductor wafer supported with said the other of the supporting means by the cutting means. The cutting means includes two cutting blades and a cutting blade interval setting-up means for setting up the interval of these cutting blades.

Semiconductor wafer dicing machine

An article holding apparatus provided with a plate on which an article is placed. A light transmitting opening is formed in the plate. There is provided an optical system optically connected to the light transmitting opening. Reflection light from a part of the undersurface of the article placed on the plate comes into the optical system through the light transmitting opening.

Article holding apparatus and its use

A grinding wheel that can rotate at high speed to grind flat plates is comprised of a thin conical grindstone fastened to the open end of a rotatable inverted cup, with the grinding edge projecting outwardly from and at an inclined angle with respect to the open end. The grindstone includes a cylindrical fitting part which is fastened to the inside of the cup and a conical grinding part formed by electroplating from a nickel plating solution in which super hard abrasive grains are dispersed. The grindstone can also be prepared by electrodepositing abrasive grains directly onto a flange formed at the open end of the cup.

Grinding wheel for flat plates

Grinding of flat plates is performed by using a very thin, conical grinding wheel which is attached to the open end of a revolving cup and which projects outwardly from and is inclined with respect to the cup. The peripheral cutting edge of the grinding wheel revolving at high speed is brought into contact with the work. As the grinding wheel is fed, the work is cut by the grinding wheel across its thickness and an undercut part of the work disrupts (i.e. breaks off) by itself to a desired thickness. Thick grinding is also possible if a multiplicity of the grinding wheels are placed one over another at proper intervals.

Grinding wheel for grinding the flat surface of a hard and brittle

A machining device equipped with a rotating machining tool having a blade. A blade inspecting means is provided in the machining device. The blade inspecting means comprises an emission means for emitting electromagnetic radiation and a receiving means for receiving the electromagnetic radiation emitted by the emitting means and producing a signal corresponding to the received electromagnetic radiation. The emitting means and receiving means are disposed such that the electromagnetic radiation emitted from the emitting means undergoes interference by the blade of the machining tool and the electromagnetic radiation received by the receiving means varies according to a variation in the condition of the blade.

Machining device equipped with blade inspecting means

A grinding wheel that can rotate at high speed to grind flat plates comprised of a thin conical grindstone fastened to the open end of a rotatable inverted cup, with the grinding edge projecting outwardly from and at an inclined angle with respect to the open end. The grindstone includes a cylindrical fitting part which is fastened to the inside of the cup and a conical grinding part formed by electroplating from a nickel plating solution in which super hard abrasive grains are dispersed. The grindstone can also be prepared by electrodepositing abrasive grains directly onto a flange formed at the open end of the cup.

Growing community of inventors

Nagareyama, Japan

Takatoshi Ono