Olympus Corporation

Panasonic Corporation

Nuvoton Technology Corporation Japan

Takatoshi Igarashi

Noriyuki Fujimori

Kazuhiro Yoshida

Takuro Suyama

Satoru Adachi

Takahiro Shimohata

Ken Yamamoto

Yukiharu Makino

Katsumi Hosogai

Masashi Saito

Kazuya Matsumoto

Takanori Tanaka

Nana Akahane

Kazuaki Kojima

Kensuke Suga

Hiroshi Kobayashi

Hironobu Ichimura

Yoshiki Takayama

Fukashi Yoshizawa

Makoto Ono

Takashi Nakayama

Yoshiro Nishimura

Tomohisa Takahashi

Tomokazu Yamashita

Satoshi Nasuno

Yutaka Harada

An image pickup module includes an image pickup device having a light receiving circuit, a prism arranged on the light receiving circuit and configured to bend incident light to guide the incident light to the light receiving circuit, a stacked device that includes a plurality of semiconductor devices each having a through wiring and bonded to each other by solder, and is arranged around the light receiving circuit of the image pickup device, a resin layer stacked on an uppermost semiconductor device of the plurality of semiconductor devices of the stacked device, and a plurality of cables connected to the stacked device and having a connection portion with the stacked device covered with the resin layer.

Image pickup module and endoscope

An image pickup apparatus includes a stacked device in which a plurality of semiconductor devices respectively including a plurality of through electrodes are stacked, a first semiconductor device, among the plurality of semiconductor devices, in which thermal resistance of a through electrode is highest among the plurality of through electrodes, is disposed in front of a first surface on which a first circuit that is one of the semiconductor circuits having a largest heat generation amount is formed, the plurality of through electrodes of the first semiconductor device are conformal vias, and the plurality of through electrodes of semiconductor devices other than the first semiconductor device are filled vias.

Image pickup apparatus and endoscope

An image pickup apparatus for endoscope includes a resin member in which an outer dimension of a third main surface is equal to an outer dimension of a second main surface, an image pickup member having a light receiving surface smaller than the second main surface, and having a first external electrode on a back surface covered by the resin member, a fan-out wiring provided to extend between an inside and an outside of an extension space, the extension space being an extension of the image pickup member in an optical axis direction, a first through wiring penetrating through the resin member, and provided in the inside of the extension space, a first bonding electrode connected with the external electrode through the first through wiring and the fan-out wiring and forming the fan-out wiring provided on the third main surface, and an electric cable bonded to the first bonding electrode.

Image pickup apparatus for endoscope and endoscope

A semiconductor device includes a semiconductor substrate, a trench capacitor arranged on the semiconductor substrate, a first wiring layer, a second wiring layer, a first TSV penetrating the semiconductor substrate outside the trench capacitor, a second TSV penetrating the semiconductor substrate outside the trench capacitor, a first connecting terminal connected to the first TSV, a second connecting terminal connected to the first TSV, a third connecting terminal connected to the second TSV, and a fourth connecting terminal connected to the second TSV. A plurality of connecting terminals including the first through fourth connecting terminals are arranged dispersively over an entire area of the first wiring layer and the second wiring layer of the semiconductor device, thereby stabilizing voltage supplied to an image unit and achieving a stable image signal.

Semiconductor device, an image unit and an endoscope system

An image pickup apparatus for endoscope includes: an optical unit having an incident surface and an emitting surface; an image pickup unit adhering to the emitting surface; an interposer where the image pickup unit is bonded to a first electrode of a first main surface; and an electric cable bonded to the interposer. The image pickup unit is smaller than the optical unit and the interposer in an outer size in a direction orthogonal to an optical axis. The image pickup apparatus for endoscope further includes a heat conductive resin with which a portion among the emitting surface, the first main surface, and a side surface of the image pickup unit is filled. The first electrode extends to a position where the first electrode is brought into contact with the heat conductive resin.

Image pickup apparatus for endoscope, endoscope, and method of producing image pickup apparatus for endoscope

An endoscope includes an image pickup module, and the image pickup module includes: an image pickup device an external electrode being disposed on a back surface of the image pickup device; a wiring element provided with a through-hole passing through a first main surface and a second main surface, a first electrode on the first main surface being bonded with the external electrode; a signal cable bonded with a second electrode on the second main surface of the wiring element; and a first resin that seals a first bump bonding the first electrode and the external electrode and a second bump bonding the second electrode and the signal cable, and fills the through-hole.

Endoscope and image pickup module

An image pickup apparatus includes: a first member, in which a plurality of optical members are laminated; a second member including an image pickup device; and a third member including a spacer and a frame, a first through-hole that penetrates through the spacer and a second through-hole that has a larger sectional area in a direction that perpendicularly intersects an optical axis than a sectional area of the first through-hole and that penetrates through the frame are provided in the third member, the third member is glued to the first member, the second member is disposed in the second through-hole, and a front surface of the second member abuts on a second main surface of the spacer, and the frame is a frame body that shields light that is incident on the second through-hole from an image pickup side surface that is a side surface of the second member.

Image pickup apparatus, endoscope, and manufacturing method of image pickup apparatus

An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.

Image pickup apparatus, method of manufacturing image pickup apparatus, and endoscope

An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.

Image pickup module, fabrication method for image pickup module, and endoscope

An image pickup unit includes: an image pickup device; a device laminate in which a plurality of semiconductor devices are laminated; and a signal cable having a lead wire and a shield lead wire. The plurality of semiconductor devices have cutouts. A groove in parallel with an optical axis direction is configured on a side surface of the device laminate by a plurality of the cutouts which communicate with one another. On cutout surfaces of the semiconductor devices, side electrodes are arranged. The lead wire and the shield lead wire are housed in the respective cutouts which have diameters in accordance with respective diameters of the lead wire and the shield lead wire. The lead wire is bonded to the side electrode and the shield lead wire is bonded to the side electrode.

Image pickup unit, endoscope, and method for manufacturing image pickup unit

An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.

An imaging apparatus includes: an optical system configured to collect incident light; an imaging element including a light receiver configured to receive light input from the optical system and perform photoelectric conversion to generate an electrical signal; and an optical system adhesive layer configured to bond the optical system to a principal surface of the imaging element where the light receiver is provided. The optical system adhesive layer is a photosensitive transparent adhesive for which patterning is performed through a photolithography process and which has a function of determining a position of the optical system relative to the light receiver.

Imaging apparatus, endoscopic system, and imaging apparatus manufacturing method

An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.

An endoscope includes: an imaging unit disposed at a distal end portion of an insertion section inserted into a body of a subject; and a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section. The imaging unit includes: a solid state image sensor including a light receiving unit; a flexible circuit board electrically connecting the solid state image sensor; and a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board.

Endoscope

An imaging module includes: an image sensor; a substrate having a conductor layer and extending from the image sensor; a multi-layer substrate having therein conductor layers on the substrate; electronic components mounted on/in the multi-layer substrate; an image signal electrode pad and a drive signal electrode pad on the image sensor; an image signal cable; a drive signal cable; an image signal wiring pattern through which an image signal is transmitted from the image signal electrode pad to the image signal cable; and a drive signal wiring pattern through which a drive signal is transmitted from the drive signal cable to the drive signal electrode pad. At least one of the electronic components is embedded inside the multi-layer substrate. The image signal wiring pattern and the drive signal wiring pattern are separated into different conductor layers of the substrate and the multi-layer substrate due to the embedded electronic component.

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Ina, Japan

Takatoshi Igarashi