Panasonic Intellectual Property Management Co., Ltd.

Takatoshi Abe

Tomoaki Sawada

Shingo Yoshioka

Tomohiro Fukao

Kyosuke Michigami

Susumu Fukushima

Hiroharu Inoue

Koji Kishino

Makoto Takashiro

Andy Behr

A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.

Fiber sheet, and layered body, circuit board and electronic board using same

Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.

Stretchable circuit board

An aspect of the present invention relates to a conductive resin composition containing an epoxy resin, a curing agent, and a conductive powder, in which a loss modulus of a dried product or semi-cured product of the conductive resin composition at 170° C. is 0.1 MPa or more and 15 MPa or less.

Conductive resin composition, circuit board fabricated using conductive resin composition, and method of manufacturing circuit board

A circuit mounted article to be fixed to a fabric is provided and includes a circuit board having flexibility, an electronic component mounted on a fabric facing face side, which faces the fabric, of the circuit board, and further a reinforcing portion to be used for fixing of the circuit mounted article to the fabric on the fabric facing face side of the circuit board.

Circuit mounted article and device

A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.

Stretchable laminate, material for stretchable device, and stretchable device

The present invention relates, in one aspect, to a thermosetting resin composition including an epoxy resin, an isocyanate resin, a polyrotaxane resin, and a curing agent, wherein the isocyanate resin includes a hexamethylene skeleton and at least one selected from a biuret skeleton, an isocyanurate skeleton, an allophanate skeleton, a neopentyl skeleton, a butylene skeleton, and a dicarboxyl skeleton in a structure thereof.

Thermally curable resin composition and film obtained therefrom

A stretchable circuit board includes a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material. The land part is formed of a patterned metal foil, or a printed product of an electroconductive ink containing metal particles. The stretchable base material has a tensile modulus at 25&#xb0; C. room temperature of 0.5 MPa to 0.5 GPa.

Elastic circuit board and patch device in which same is used

One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

Resin composition, and resin film, metal foil with resin, metal clad laminate, wiring board, and circuit mount component using same

A conductive composition is provided and at least includes an acrylic resin and a conductive powder, wherein the acrylic resin at least contains a polymer unit (A) of a (meth)acrylate having an epoxy group and a polymer unit (B) of a (meth)acrylate having an isobornyl group, and an amount of the polymer unit (B) is 5.0 parts by mass or more and 50.0 parts by mass or less based on 100 parts by mass of the acrylic resin.

Conductive resin composition and conductive structure using same

The present application relates to a circuit board for use in electronic components. Specifically, the present application relates to a stretchable circuit board including a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material.

A sheet-shaped stretchable structure including stretchable resin sheets laminated together is provided. A conductive layer may be disposed at least at one of several positions. For example, the conductive layer may be disposed between any two adjacent ones of the laminated stretchable resin sheets. The conductive layer may be disposed on a top surface of an uppermost one of the laminated stretchable resin sheets. Further, the conductive layer may be disposed on a bottom surface of a lowermost one of the laminated stretchable resin sheets, and a via hole.

Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure

The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate (&#x3b1;), as measured in a prescribed extension-restoration test, are as follows: 20%&#x2264;R&#x2264;95% and 0%&#x2264;&#x3b1;&#x2264;3%.

Resin composition and film using same

A sheet-shaped stretchable structure used as an electronics element has a stretch of not less than 10% and includes a plurality of laminated stretchable resin sheet, and at least one hollow is provided between at least one of pairs of two adjacent ones of the laminated stretchable resin sheets.

A conductive film includes a film substrate and a conductive layer formed on at least one surface of the film substrate. The film substrate and the conductive film have elongation of 10% or more. Ten-point average roughness Rz of the surface of the film substrate on at least a conductive layer side is 0.05 to 0.5 &#x3bc;m, and an average interval Sm of unevenness is 0.1 to 1 &#x3bc;m.

Conductive film, and touch panel, display, touch sensor, and solar cell using the same

The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate &#x3b1;, as measured in a prescribed extension-restoration test, are as follows: 20%&#x2264;R&#x2264;95% and 0%&#x2264;&#x3b1;&#x2264;3%.

Growing community of inventors

Osaka, Japan

Takatoshi Abe