Denso Corporation

Takashige Saito

Masahiro Honda

Koji Hashimoto

Ryosuke Izumi

Hiroyuki Okuhira

Toshihiko Takahata

Haruhisa Koike

Shinpei Taga

Kouji Yamamoto

Masamoto Kawaguchi

Yuuichi Ikuno

An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.

Electronic device and method for manufacturing the same

In a manufacturing method of a semiconductor device, a semiconductor chip is sealed with a resin, and then a laser is applied to remove the resin so that a part of the semiconductor chip is exposed. The semiconductor chip is made of a material that has a lower absorptivity of the laser than the resin and is not melted by the laser. The laser has a wavelength that passes through the semiconductor chip and has a lower absorptivity in the semiconductor chip than in the resin. The laser is applied to the resin from a side adjacent to one of plate surfaces of the semiconductor chip, so that the resin sealing the one of the plate surfaces is sublimated and removed and at least a part of the resin sealing the other of the plate surfaces is subsequently sublimated and removed by the laser having passed through the semiconductor chip.

Semiconductor device and method for manufacturing the same

In manufacturing a sensor device, a sensor chip having a sensing portion on a surface thereof is mounted on one surface of a substrate, and a resin having a volatile property is arranged on the surface of the sensor chip, thereby covering the surface of the sensor chip. Then, the sensor chip and the substrate are sealed by a sealing member. After that, the sealing member is cured, and the resin is heated to be vaporized so that a void is formed between a covered portion in the surface of the sensor chip, which is covered by the sealing member, and the sealing member.

Sensor device and manufacturing method thereof

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Takashige Saito