Other

Nsk Corporation

Kawasaki Steel Corporation

Unisia Jecs Corporation

Fuji Electric Co., Ltd.

Jfe Steel Corporation

Sumitomo Heavy Industries, Ltd.

Kansei Corporation

Kabushiki Kaisha Koden Seisakusho

Unisa Jecs Corporation

Takashi Yoshimura

Masashi Fujinaga

Mitsumasa Iijima

Yasuo Hatai

Satoshi Uenosono

Shigeru Unami

Shin Koizumi

Hiroyuki Amma

Naomichi Nakamura

Takayuki Matsumoto

Hiroyuki Anma

Hiroshi Takishita

Takeshi Aiba

Jun Nishino

Hidefumi Ito

Takeshi Ebina

Yoshiteru Kondo

Sigeru Ryugo

Hiroshi Takeda

Koji Yokoe

A workpiece supporting device () includes a base stand (), a shoe () which is disposed on at least one place in a circumferential direction of a workpiece () that is rotationally driven using a rotary drive device () and is in sliding contact with a circumferential surface of the workpiece (), and a supporting body () which supports the shoe () with respect to the base stand (). The supporting body () includes a compliant structure portion (a leaf spring ()) which tilts the shoe () in accordance with tilting of the workpiece () with respect to the base stand ().

Workpiece supporting device, processing device, processing method, method for manufacturing bearing, method for manufacturing vehicle, and method for manufacturing mechanical device

A laser annealing method for a semiconductor device, includes: a first step of adding an impurity to a semiconductor substrate; and a second step of irradiating a region to which the impurity is added with a pulsed laser beam a plurality of times to anneal the semiconductor substrate. In the second step, a first region of a portion of the region to which the impurity is added is irradiated with the pulsed laser beam, and after a predetermined time interval, a second region adjacent to the first region is irradiated with the pulsed laser beam. The predetermined time interval is larger than a pulse interval of the pulsed laser beam.

Laser annealing method for semiconductor device, semiconductor device, laser annealing method, control device of laser annealing apparatus, and laser annealing apparatus

The present invention prevents the occurrence of variation in the lead of a threaded section of a machined article () resulting from the effects of thermal expansion of the machined article () during machining. A thermal expansion amount that relates to the axial direction of the machined article () during machining is measured by measurement means (), history information for the thermal expansion amount that relates to the machined article () during machining is obtained from the result of the aforementioned measurement, and a control unit () determines the relative rotational speed of a rotary drive shaft () or the feeding speed of an axial feeding device () with respect to the next machined object () that is to be machined on the basis of the history information for the thermal expansion amount of the machined object () that has been machined.

Machining method for a threaded section and machining device

In a preliminary molding step, a metallic powder mixtureobtained by blending an iron-based metal powderwith graphitesuch that the graphite is present in an amount of preferably not less than 0.1% by weight, more preferably not less than 0.3% by weight, is compacted into a preformhaving a density of not less than 7.3 g/cm. In a provisional sintering step, the preformis provisionally sintered at a predetermined temperature to form a metallic powder-molded bodyhaving a structure in which the graphite remains along a grain boundary of the metal powder. In a re-compaction step, the metallic powder-molded bodyis re-compacted into a re-compacted body. In a re-sintering step, the re-compacted bodyis re-sintered to obtain a sintered body. In a heat treatment step, the sintered bodyis heat-treated to obtain a heat-treated sintered body Accordingly, in accordance with the present invention, there are provided a re-compacted body produced from a metallic powder-molded body having an excellent deformability which is suitably applied to the production of machine parts exhibiting high mechanical properties due to the use of sintered metal, and a sintered body produced from the re-compacted body as well as a process for the production thereof.

Metallic powder-molded body, re-compacted body of the molded body, sintered body produced from the re-compacted body, and processes for production thereof

A sintered iron-based powder metal body with lower re-compacting load and having a high density and a method of manufacturing an iron-based sintered component with fewer pores of a sharp shape and having high strength and high density.

Iron-based sintered powder metal body, manufacturing method thereof and manufacturing method of iron-based sintered component with high strength and high density

Metallic powder molding material and its re-compression molded body and sintered body obtained from the re-compression molded body and production methods thereof

A method of forging a raw material for sintering and forging. The method comprises the steps of: (a) compacting metallic powder containing iron as a main component and graphite to obtain a compact having a predetermined density; (b) sintering the compact at a temperature ranging from 700 to 1000&deg; C. to form a sintered compact having a texture in which graphite is retained at grain boundary of metal powder; (c) compressing the sintered compact from two directions to obtain a compressed sintered compact; and (d) extruding the compressed sintered compact upon pressing the compressed sintered compact from the two directions in a manner that a pressure in one of the two directions is reduced relative to a pressure in the other of the two directions to accomplish extrusion forging.

Method of forging raw material for sintering and forging

Sintered powder metal bodies and process for producing the same

An optical distance measuring equipment in which light from a light emission element is transmitted to an object through a light transmission lens, and light reflected on the object is received by a light reception element through a light reception lens so that a distance to the object is measured on the basis of light transmitting timing and light receiving timing. In the optical distance measuring equipment, a lens holding member for disposing the light transmission lens and the light reception lens substantially at the same distance relative to the light emission element and the light reception element respectively is provided in front of a light transmission/reception board on which the light emission element and the light reception element are installed.

Optical distance measuring equipment

Growing community of inventors

Kanagawa, Japan

Takashi Yoshimura