Hitachi High-tech Instruments Company, Ltd.

Takashi Yoshii

Akihiro Kawai

Hideaki Fukushima

Akihiro Urakawa

The invention prevents mismounting of an electronic component caused by missetting of a component feeding unit in an apparatus. A recognition process of an electronic component is performed according to component library data stored in a RAM. According to 'normal' data as a check condition in the component library data, a recognition processing device checks whether leads indicated by group numbers '1' and &#x201c;2&#x201d; exist or not in the electronic component, on command of a CPU. When all the leads are detected, the CPU commands the recognition processing device to calculate an amount of shifting from a proper position based on an image taken by a component recognition camera, and a position and an angle of the electronic component are calculated. Next, the recognition processing device performs an absence check of leads which must not exist in the electronic component. When even one of the leads which must not exist is detected, the CPU judges the electronic component the &#x201c;lead detection error in absence check&#x201d;, so that the CPU makes the electronic component released from a suction nozzle and collected in an exhaust box.

Electronic component mounting apparatus and electronic component mounting method

A recognition camera images an electronic component, and a recognition processing unit performs recognition processing of the electronic component based on the result of the imaging. The recognition processing is performed using the component data of group 1 data, group 2 data, group 3 data, and group 4 data that are stored for the images taken in a random access memory (RAM). The group 1 data is used for lead inspection (for inspecting positioning error and bending of the lead), the group 2 data and the group 3 data are used for calculating amounts of adjustment in the X and Y directions, and the group 4 data is used for calculating the amount of adjustment in the &thgr; direction. This makes it possible to mount accurately components with pins and extrusions extruded from the molding, such as connectors, such that the pins and extrusions are accurately engaged with the holes formed in a print board.

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Ota, Japan

Takashi Yoshii