Bridgestone Corporation

Renesas Technology Corp.

Bridgestone Tire Company Limited

Hitachi Hybrid Network Co., Ltd.

Takashi Yokoi

Masayuki Ohayashi

Jumei Harada

Masami Kikuchi

Yukihiko Hoso

Keiji Yamamoto

Kyoichi Takahashi

Nobuhiro Matsudaira

Takahisa Shizuku

Yoshikatsu Sakai

Wataru Seki

Yukio Aoike

Katsuhiro Kobayashi

A bead wire has a composition of Mn: 5-35 at % and Al: 5-20 at % and the remainder being Fe and inevitable impurities, in which a steel structure is an austenite single-phase structure, and achieves weight reduction and high ductility without reducing strength.

Lightweight and excellent ductile bead wire, method for producing the same and lightweight tire

The present invention provides electronic parts for amplifying high frequency power capable of expanding a dynamic range of an output power detection circuit, obtaining a continuous detection output having no inflexion point from a low region of output power to its high region and thereby improving controllability of the output power. In a wireless communication system which controls output power of a high frequency power amplifier, based on an output power detection signal and a signal indicative of an output level, an output power detection circuit is provided with a multi-stage configured amplifier which amplifies a high frequency signal taken out via a coupler and capacitive elements. Further, a plurality of detection circuits which detect outputs of amplifiers of respective stages, and a detection circuit which detects the high frequency signal without passing through the multi-stage configured amplifier are provided. One obtained by combining the outputs of these detection circuits is inputted to an error amplifier for generating an output power control signal, as the output power detection signal to thereby generate a control signal for the high frequency power amplifier.

Electronic parts for high frequency power amplifier and wireless communication device

A seismic isolation apparatus features damping characteristics equivalent to or better than prior art, without burdening the environment. In this seismic isolation apparatus, a cylindrical cavity portion is formed at the middle of an outer side laminated body, which has a form in which respective pluralities of resiliently deformable rubber rings and metal rings for maintaining rigidity are alternately laminated. A helically formed coil spring is disposed in this cavity portion so as to be snugly fitted. An inner side laminated body, which has a form in which respective pluralities of resiliently deformable rubber plates and metal plates for maintaining rigidity are alternately laminated, is disposed at an inner peripheral side of the coil spring.

Seismic isolation apparatus

A semiconductor integrated circuit effectively makes use of wiring channels of wiring formed by a damascene method. When first cells are used, since the Mpower source lines are laid out at positions spaced away from a boundary between the cells, the power source lines are not combined in laying out a semiconductor integrated circuit. As a result, the width of the power source lines is not changed. Accordingly, an interval between the line and a line which is arranged close to the line, determined in response to a line width of the lines, can satisfy a design rule; and, hence, the reduction of the wiring channels can be obviated, whereby the supply rate of the wiring channels can be enhanced, and, further, the integrity of a semiconductor chip can be enhanced.

Semiconductor integrated circuit including a first region and a second region

Semiconductor integrated circuit

To ensure the connectability of wiring lines in a semiconductor device having terminals or reservoirs, plural terminals of a cell, which constitutes the semiconductor device, are each formed in a shape having a length corresponding to two or more lattice points. The terminals are arranged so that one or more lattice points are interposed between adjacent terminals. Among the terminals, as to terminals that are adjacent to each other in their shorter direction, it is allowable for them to partially overlap each other in their shorter direction. In this state, second-layer wiring lines are connected to the terminals via through holes, whereby reservoirs can be generated at the terminals, respectively.

Method of manufacturing a semiconductor device

A semiconductor integrated circuit effectively makes use of wiring channels of wiring formed by a damascene method. When first cells are used, since the M1 power source lines are laid out at positions spaced away from a boundary between the cells, the power source lines are not combined in laying out a semiconductor integrated circuit. As a result, the width of the power source lines is not changed. Accordingly, an interval between the line and a line which is arranged close to the line, determined in response to a line width of the lines, can satisfy a design rule; and, hence, the reduction of the wiring channels can be obviated, whereby the supply rate of the wiring channels can be enhanced, and, further, the integrity of a semiconductor chip can be enhanced.

Arrangement of wiring lines including power source lines and channel wirings of a semiconductor integrated circuit having plural cells

An apparatus for forming an annular member simply with high accuracy, for example, a side tread and bead filler having a height in the radial direction comparatively larger than its thickness as a constituent member of a tire. A material, for example, a soft and fragile raw rubber at a high temperature is directly extruded through a mouthpiece of an extruder onto a rotating disc-like lower mold so as to adhere onto it. The lower mold is able dividable into plural lower mold segments. An arcuately curved extruded material is formed on the lower mold in this manner. The extruded material is not deformed during being cooled because it is strongly restrained by the receiving surface of the lower mold on which the material adheres. The extruded material is then cut along the divided lines of the lower mold segments. Lower mold segments thus having arcuately extruded materials, respectively, are then transferred to a restoration position and gathered together to form the original lower mold. Thereafter, ends of the arcuately extruded materials are joined with each other to form an endless annular member.

Annular member forming apparatus

A method for forming an annular member simply with high accuracy, for example, a side tread and bead filler having a height in the radial direction comparatively larger than its thickness as a constituent member of a tire. A material, for example, a soft and fragile raw rubber at a high temperature is directly extruded through a mouthpiece of an extruder onto a rotating disc-like lower mold so as to adhere onto it. The lower mold is able dividable into plural lower mold segments. An arcuately curved extruded material is formed on the lower mold in this manner. The extruded material is not deformed during being cooled because it is strongly restrained by the receiving surface of the lower mold on which the material adheres. The extruded material is then cut along the divided lines of the lower mold segments. Lower mold segments thus having arcuately extruded materials, respectively, are then transferred to a restoration position and gathered together to form the original lower mold. Thereafter, ends of the arcuately extruded materials are joined with each other to form an endless annular member.

Annular member forming method

A variable contour rubber extruder comprises a rotary driving roller, a main body forming therein an eccentric arc chamber with the rotary driving roller, and a movable mouth piece forming with a barrel surface of the rotary driving roller an opening of variable sectional area for extruding rubber material. The movable mouth piece comprises a center piece movable toward and away from the barrel surface of the rotary driving roller and a pair of side pieces overlapping the center piece and slidably adjustable in directions in parallel with an axis of the rotary driving roller.

Variable contour rubber extruder

A rotary roll-type rubber extruder including a roll having an outer cylindrical surface rotatively driven by driving means, a housing having a stationary concave surface spaced from and in opposition to the rotating outer cylindrical surface of said roll between a pair of sidewalls close to the outer cylindrical surface of the roll to form a define chamber with the roll, and a mouthpiece detachably secured to the housing to form a defined extruding opening with the roll at an outlet of the defined chamber. The concave surface of the housing is determined such that pressure gradients at mouthpieces are within a quadrilateral area having four corners corresponding to pressure gradients 65 and 150 kg/cm.sup.3 at a 1 mm opening mouthpiece and pressure gradients 11 and 23 kg/cm.sup.3 at a 5 mm opening mouthpiece in a graph having an ordinate in logarithm showing the pressure gradients ##EQU1## and an abscissa in logarithm showing heights mm of openings of the mouthpieces.

Rotary roll-type rubber extruder

An adjustable extrusion die assembly forming part of an extruder for an elastic material, comprises: a stationary die member having an end surface; a plurality of movable die members positioned in side-by-side relationship to one another and slidably contacted with one another, the movable die members respectively having end surfaces opposing to and spaced apart from the end surface of the stationary member, the end surfaces of the stationary and movable die members defining in combination an extrusion opening through which the elastic material is to be extruded, the movable die members being individually movable toward and away from the end surface of the stationary die member with respect to one another so as to vary the distances between the end surface of the stationary die member and the end surfaces of the movable die members; a guide member having formed therein a guide slit having the movable die members guided therein; and a plurality of link members each interconnecting two adjacent movable die members.

Growing community of inventors

Kodaira, Japan

Takashi Yokoi