Mitsubishi Denki Kabushiki Kaisha

3m Innovative Properties Company

Other

Denso Corporation

Mitsubishi Electric Corporation

Agilent Technologies, Inc.

Renesas Technology Corp.

Mitsubishi Electric Semiconductor Software Co., Ltd

Rion Company Ltd.

Takashi Yamasaki

Jun Fujita

Sachie Kuroda

Kenichi Gohara

Takashi Nagasaka

Tameharu Ohta

Hideo Matsui

Shin Chaki

Yasutomi Asai

Takaaki Yoshioka

Kunihiro Sato

Hideki Minami

Shinya Terao

Tadahiko Komatsu

Hiroshi Sasahara

Kenichi Kidokoro

Yukio Fuzisawa

Takehiro Furukawa

Shoichi Nakagawa

Yoshiaki Shimojo

A high-frequency power amplifier includes: a semiconductor substrate; transistor cells separated from each other and located on the semiconductor substrate; and testing electrodes respectively connected to individual transistor cells, wherein an electrical signal and power to individually operate each corresponding transistor cell are supplied to each transistor cell, independently, from outside, using the testing electrodes.

High-frequency power amplifier and method for manufacturing the same

There is provided a moisture-reactive composition comprising a moisture-reactive organometallic compound, and a polymer having a carboxyl group at the end of a main chain or a side chain. A moisture-absorbing film formed of the moisture-reactive composition is also provided. An organic electroluminescent device comprising the moisture-reactive composition is also provided wherein a laminate is formed by interposing an organic luminescent material layer made of an organic material between a pair of electrodes facing each other, and a structure shields the laminate from the outside air, and drying means are arranged in the structure, wherein the drying means is formed of the moisture-reactive composition.

Moisture-reactive composition and organic electroluminescent device

Disclosed herein is a moisture-reactive composition having a moisture-reactive polysiloxane having a main chain and one or more side chains, wherein the main chain and/or the one or more side chains has a group represented by the formula: &#x2014;MXY; and wherein M is selected from the group consisting of a multivalent metal atom, B, and P&#x2550;O; X is a hydrogen atom, a substituted or nonsubstituted alkyl, alkenyl or alkoxy group; Y is a substituted or nonsubstituted alkoxy, siloxy, carboxyl, or diketolate group; m is from 1 to 3; and n is from 0 to 2.

Moisture-reactive composition and organic electroluminescent element having same

A composition usable as a moisture absorbent for an organic electroluminescence device. A photocurable hygroscopic composition comprising (a) a moisture-reactive organic metal compound, (b) a (meth)acrylate, (c) a carboxyl group-containing polymerizable monomer, and (d) a photopolymerization initiator. The proportion of the moisture-reactive organic metal compound (a) is from 5 to 70 wt % based on the entire composition, and the proportion of the carboxyl group-containing polymerizable monomer (c) is from 0.1 to 50 mol % based on the moisture-reactive organic metal compound (a).

Photocurable hygroscopic composition and organic EL device

An organic electroluminescence device having a substrate on which a first electrode is provided on the surface and including at least one projection. A functional layer is provided so as to cover the projection, and a second electrode is formed on that functional layer. A cross-sectional contour of an end of a surface of the projection contacting the functional layer is a shape satisfying a predetermined relationship.

Organic electroluminescence device and method of production of same

A setting value is initially stored in a comparison and coincidence register. Thereafter, a value of a count signal is incremented in a base timer while resetting the value of the count signal to zero each time the value of the count signal reaches a prescribed value. A coincidence signal set to '1' is output from the comparison and coincidence register each time the setting value agrees with the value of the count signal, and a clock signal is produced in an RS flip-flop according to the coincidence signal. A data transmission is performed each time the coincidence signal is received in a transmission shift register. On a reception side, the clock signal is received, and the data is received according to the clock signal. Therefore, in cases where a desired setting value is stored in the comparison and coincidence register, the repetition period of the data transmission and reception can be freely changed. Also, the timer function of the base circuit is, as it is, used to transmit or receive data, the number of elements required in the data input and output device can be reduced in hardware.

Clock selection circuit for selecting between an external clock and a clock generated by comparing a count value with a setting value

To enable the measurer to easily verify the parameter correction conditions, the correction conditions for the parameters measurable by the measurement device are concurrently displayed on the screen of the measurement device related to the ports used in the parameter measurement. The rows and columns are the receive ports and send ports. The symbol F and the symbol R indicate the type of calibration method applied to the parameters measured by the ports specified in the matrix.

Display method of parameter correction conditions and recording medium on which program to display parameter correction condition is recorded

An electroacoustic transducer comprises a carrier portion, a diaphragm supported by the carrier portion, an electrode portion opposed to the diaphragm at a predetermined interval, and a housing accommodating the diaphragm and the electrode portion, wherein the carrier portion has a saucer-like shape, at the bottom surface of which a plurality of upstanding posts are provided, and wherein the upper surface of the periphery of the carrier portion and the upper end surfaces of the posts are in the same plane, the diaphragm is bonded to the surface of the periphery of the carrier portion and the end surfaces of the posts, and the electrode portion is fixed to the end surfaces of the posts which are covered by the diaphragm with spacers interposed therebetween.

Electroacoustic transducer

A microcomputer is realized having a built-in SIO which is able to correspond to a LAN which requires strict timing control and also correspond to a high speed serial communication. A counter supplies.a clock signal for data shift to an SIO register which performs serial-parallel conversion and vice versa. Two D flip-flop circuits detect the rise of an SRDY signal, an input signal expressing the start of transmission, and give the counter a reset signal.

Microcomputer having built-in serial input-output circuit

A wiring board for flip-chip-mounting in which a conductor layer is provided in a portion under the semiconductor element-mounting surface of the ceramic insulating board, the electrically conducting layer being electrically independent from the wiring pattern that is flip-chip-connected. The insulating board is effectively suppressed from deforming such as from warping or undulating. In particular, the semiconductor element-mounting surface exhibits a high degree of flatness. Therefore, the wiring board exhibits a high junction reliability at the flip-chip-connected portions, and is very useful as a semiconductor package or as a hybrid integrated circuit that is used in various electronic devices being mounted on the vehicles.

Wiring board for flip-chip-mounting

Via portions are formed in a first green sheet for a first layer of a laminated substrate. Then, conductive lands are formed on a surface of the first green sheet and a wiring pattern is formed on a back face of the first green sheet to be connected to the conductive lands through the via portions. The thus formed first green sheet is joined to a second green sheet having via portions therein so that the wiring pattern of the first green sheet contacts the via portions of the second green sheet. In this case, by forming the wiring pattern on the back face of the first green sheet, lamination slippage of the wiring pattern caused by lamination of the first and second green sheets can be prevented.

Method for manufacturing ceramic laminated substrate

An internal clock synchronizing circuit capable of solving a problem involved in a conventional high speed microcomputer system in that it takes a long time to establish clock synchronization between system component circuits of the microcomputer system. The internal clock synchronizing circuit includes a clock generator for generating an internal clock signal by dividing an original clock signal; a clock comparator for comparing the internal clock signal with a reference clock signal; a compared result holding circuit for holding, in synchronism with the original clock signal, a compared result signal output from the clock comparator; and a clock switching circuit for switching supply of the original clock signal to the clock generator in response to the compared result signal held in the compared result holding circuit.

High-speed internal clock synchronizing method and circuit

A package body holding an acceleration sensor circuit therein has signal electrodes and four dummy electrodes insulated from the signal electrode on a mounted surface thereof. The signal electrodes are electrically connected to the sensor circuit element. The mounted surface of the package body has chamfered portions on verge portions thereof, and auxiliary electrodes are formed on the chamfered portions to be integrally connected to the signal electrodes. The thus constructed package body is mounted on a circuit board by a reflow method using a solder paste so that the signal, dummy, and auxiliary electrodes are connected to a wiring pattern on the circuit board through solder portions. In this process, the solder paste on the dummy electrodes in a fused state generate an internal pressure to retain a clearance between the package body and the circuit board. As a result, the thickness of the solder portions between the package body and the circuit board can be secured, and reliability at a mounted state is improved.

Surface mount type package unit and method for manufacturing the same

A microcomputer or a one-chip computer has address pins and data pins provided separately, and when a specified control signal is provided, the address pins act as multiplex pins for address and data signals. Further, a combination of bits for address signals and bits for data signals to be provided to the multiplex pins are changed according to a width of an external bus. For example, the data bits D.sub.i are combined with the address bits A.sub.i, as used previously. Further, the data bits D.sub.i-1 are combined with the address bits A.sub.i by shifting by one bit with respect to the address bits. One of the two types of the combination can be selected. If the microcomputer has 16-bit address pins, it can be connected to 8-bit memories having independent address and data pins, while it can also be connected to 8-bit peripherals having multiplex pins without using an external circuit for separating address and data signals.

Microcomputer having multiplexable input-output port

A DMA control system continuously grants permission to access the I/O device and memory to continue data transfer in a cycle steal mode when there is a continuous stream of DMA requests from a number of I/O devices by producing a logical sum of the DMA requests.

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Tokyo, Japan

Takashi Yamasaki