Sumitomo Electric Industries, Limited

Matsushita Electric Works, Ltd.

Toyo Kohan Co., Ltd.

Japan Tobacco Inc.

Riken Corporation

Panasonic Electric Works Co., Ltd.

Ckd Corporation

Sumitomo Electric Printed Circuits, Inc.

Japan Superconductor Technology Inc.

Panasonic IP Management Co., Ltd.

Takashi Yamaguchi

Tatsuoki Nagaishi

Masaya Konishi

Kotaro Ohki

Genki Honda

Hajime Ota

Tatsuhiko Yoshihara

Hironao Okayama

Hitoshi Ogawa

Mikihiro Yamashita

Kouji Nanbu

Keizo Ganse

Akira Kaneko

Takeshi Fukuda

Koji Nakamura

Masayuki Kouketsu

Tsuyoshi Nishizawa

Akihiro Ito

Kazuhiko Hayashi

Etsushi Muramatsu

Kazuya Ohmatsu

Kenji Masuda

Masamichi Yamamoto

Masanobu Yamasaki

Teppei Kurokawa

Takeshi Yamana

Yoshihiko Isobe

Kenji Motoi

Fumio Taniguchi

Takashi Koshiro

Izumi Mihara

Yoshinori Yanagisawa

Yasunori Ueda

Aya Watanabe

Takumi Adachi

Kyouichirou Nakatsugi

Kotaro Yanagi

Hideki Tanaka

Mamoru Hamada

Shoichi Sagawa

Matsuki Yamamoto

Takashi Yukawa

Masahiro Takatani

Tetsushi Ogawa

Fumito Shimoma

Kazuya Ohmastu

Shigeki Kawakami

Michihiro Kimura

A superconductive wire according to an embodiment of the present disclosure includes a first member and a second member. The first member includes a first substrate made of a conductive material, a first intermediate layer made of a conductive material and disposed on the first substrate, and a first superconductive layer made of a superconductive material and disposed on the first intermediate layer. The second member includes a second substrate made of a conductive material, a second intermediate layer made of a conductive material and disposed on the second substrate, and a second superconductive layer made of a superconductive material and disposed on the second intermediate layer. The first member and the second member are stacked along a thickness direction of the superconductive wire so that the first superconductive layer and the second superconductive layer face each other. The first superconductive layer is electrically connected to the second superconductive layer.

Superconductive wire, stacked superconductive wire, superconductive coil and superconductive cable

A persistent current switch includes a superconducting wire including a substrate and a superconducting layer disposed on the substrate, and a heater. The superconducting wire includes a surface including a first portion and a second portion that are disposed apart from each other along a longitudinal direction of the superconducting wire. The first portion and the second portion face each other. The heater is sandwiched between the first portion and the second portion.

Persistent current switch and superconducting device

A superconducting wire according to one embodiment of the present disclosure includes: a substrate having a first surface and a second surface; a superconducting layer having a third surface and a fourth surface; and respective coating layers. The second surface is opposite to the first surface. The fourth surface is opposite to the third surface. The superconducting layer is disposed on the substrate such that the third surface faces the second surface. The respective coating layers are disposed on the first surface and the fourth surface. Adhesion strength between the substrate and the coating layer disposed on the first surface is lower than adhesion strength between the superconducting layer and the coating layer disposed on the fourth surface.

Superconducting wire and superconducting coil

A superconducting wire includes a substrate and a superconducting material layer. The substrate includes a first main surface and a second main surface opposite to the first main surface. The superconducting material layer is disposed on the first main surface. Along at least a part of the superconducting wire in a direction in which the superconducting wire extends, the superconducting material layer is disposed to cover a side surface of the substrate in a width direction of the substrate and cover at least a part of the second main surface. A thickness of the superconducting material layer located on the first main surface varies along the width direction. A maximum thickness of the superconducting material layer located on the second main surface is smaller than a maximum thickness of the superconducting material layer located on the first main surface.

Superconducting wire

The present invention relates to a novel method for producing a triazolopyridine compound or a salt thereof having a PHD inhibitory action and useful for treating or preventing diseases caused by decreased production of EPO, or the like. The present invention provides a method for producing 2-({[7-hydroxy-5-(2-phenylethyl)-[1,2,4]triazolo[1,5-a]pyridin-8-yl]carbonyl}amino)acetic acid comprising a step of reacting Compound [VI]: wherein R, Rand Rare as defined in the specification, or a salt thereof.

Method for producing triazolopyridine compound

A superconducting coil according to the present disclosure includes: a substrate having a first surface and a second surface; a superconducting layer having a third surface and a fourth surface; respective stabilization layers; and respective protective layers. The second surface is opposite to the first surface. The fourth surface is opposite to the third surface. The superconducting layer is disposed on the substrate such that the third surface faces the second surface. The respective stabilization layers are disposed on the first surface and the fourth surface. The respective protective layers are disposed on the stabilization layers. Adhesion strength between each of the stabilization layers and each of the protective layers is lower than strength of the superconducting layer.

A superconducting wire includes a multilayer stack and a covering layer (stabilizing layer or protective layer). The multilayer stack includes a substrate having a main surface and a superconducting material layer formed on the main surface. The covering layer (stabilizing layer or protective layer) is disposed on at least the superconducting material layer. A front surface portion of the covering layer (stabilizing layer or protective layer) located on the superconducting material layer (front surface portion of the stabilizing layer or upper surface of the protective layer) has a concave shape.

An oxide superconducting wire includes an oriented metal substrate, an intermediate layer formed on the oriented metal substrate, and an oxide superconducting layer formed on the intermediate layer. The oriented metal substrate has an in-plane orientation &#x394;&#x3d5; of 7&#xb0; or less. The intermediate layer is formed of a single layer.

Oxide superconducting wire

A superconducting wire includes: a substrate having a first main surface and a second main surface opposite to the first main surface; and a superconducting material layer disposed on the first main surface of the substrate. The superconducting material layer is disposed to cover at least a part of a side surface of the substrate in a width direction of the substrate.

A superconducting wire includes a main body portion, a substrate, and a cover portion. The main body portion includes a first main surface and a second main surface located opposite to the first main surface, and includes a superconducting material portion. The substrate supports the second main surface of the main body portion. The cover portion is formed at least on the first main surface of the main body portion. In the cover portion, surface roughness in a central portion in a width direction of the superconducting wire is smaller than surface roughness at an end portion in the width direction.

A method produces a coil sheet from an initial coil sheet in which a conductor layer, a thermally resistant insulating layer, a thermosetting, uncured adhesive layer, and a base layer are stacked in this order. The method includes a first cutting step of cutting the conductor layer into a predetermined shape through etching, and a second cutting step of cutting, after the first cutting step, the insulating layer and the adhesive layer into the predetermined shape through etching.

Coil sheet production method, and coil production method

A service providing method using a server that controls an electronic device from a terminal through a network, includes a first registration step of registering first path information indicating a connection relationship between the electronic device and a relay, and user information indicating an owner of the electronic device, which are transmitted from the terminal, in association with each other; a path acquisition step of acquiring second path information indicating a connection relationship between the electronic device and the relay, from service information transmitted from the electronic device; a service information acquisition step of acquiring service information that the electronic device holds; a comparison step of comparing the first path information with the second path information; and a providing step of providing the service information to the terminal, if the comparison result is inconsistent, in the comparison step.

Service provision method

An oxide superconducting thin film wire includes a metal substrate, a laminate, and a Cu stabilizing layer. The metal substrate includes a supporting base material and a conductive layer located on the supporting base material. The conductive layer includes a Cu layer serving as an internal layer and a biaxially orientated surface layer. The laminate includes a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer stacked on the metal substrate in this order from the metal substrate. The Cu stabilizing layer is formed so as to surround the laminate and the metal substrate. At least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate.

Oxide superconducting thin film wire and method for producing same

The present invention relates to a method of producing a substrate, including the steps of preparing a substrate having a nickel layer formed on a copper layer through plating, subjecting the nickel layer to thermal treatment at 800-1000&#xb0; C., and epitaxial-growing an intermediate layer on the nickel layer, after the step of subjecting the nickel layer to thermal treatment. According to the present invention, there can be provided a substrate that allows the orientation and flatness at the surface of a nickel layer to be improved, and a method of producing the substrate.

Method of producing substrate and superconducting wire

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Osaka, Japan

Takashi Yamaguchi