Nippon Telegraph and Telephone Corporation

Ntt Electronics Corporation

Toyota Jidosha Kabushiki Kaisha

Takashi Yamada

Takashi Goh

Shinji Mino

Yusuke Nasu

Motohaya Ishii

Hiroyuki Imanishi

Yuichiro Ikuma

Akira Himeno

Masayuki Okuno

Takeshi Kitagawa

Shunichi Souma

Yoshiyuki Doi

Mitsuhiro Nada

Ken Tsuzuki

Hiroshi Yamazaki

Kengo Horikoshi

Yohei Okamoto

Yuriko Kawamura

Keita Nishimoto

Hiroyuki Ishii

Naoki Fujiwara

Tetsuya Bono

Manabu Yoshino

Takashi Saida

Junichi Kani

Tsuyoshi Maruo

Hiroo Suzuki

Katsumi Iwatsuki

Manabu Oguma

Kiyofumi Kikuchi

Hideaki Matsuzaki

Shunichi Soma

Kota Asaka

Hiroshi Terui

Yohei Sakamaki

Shunsuke Kanai

Akimasa Kaneko

Takahiko Shindo

Kimikazu Sano

Fumihiro Ebisawa

Tomoyo Shibazaki

Masashi Tadokoro

Takao Fukumitsu

Atsushi Murasawa

Yuichi Kikuchi

Yukio Toyoshima

Manabu Kubota

Hisao Yoshinaga

Toshikiyo Tanaka

Takeaki Mochida

Akiyuki Takeda

Jun-Ichi Kani

One aspect of the present invention is a optical main signal processing node apparatus including: an input port for inputting an optical multiplexed with signals pertaining to a plurality of services from an optical transmission path; an output port for outputting an optical signal multiplexed with signals pertaining to a plurality of services to an optical transmission path; a optical main signal processer configured to perform optical main signal processing on an optical signal input from the input port; and a path switch configured to switch a path of the optical signal input from the input port to one of a first path for guiding the optical signal to the output port and a second path for guiding the optical signal to the optical main signal processer.

Optical main signal processing node apparatus and control method of optical main signal processing node apparatus

An optical module is provided with a columnar protrusion over the entire pickup area (EP) for automatic suction by a mounting device at the center of the upper surface of a fiber holding carrier. The protrusion secures a dedicated pickup area (EP) on a top surface. When an extra length of an optical fiber extending from an optical device is routed and held between a pair of wall portions, the extra length including a tip portion is held in a storage area of the fiber holding carrier by a restoring force caused by being pressed against the wall portions.

Optical module

An optical circuit module in which an optical fiber array and an optical circuit substrate are connected, the optical fiber array including a groove substrate in which a groove for optical fiber alignment is formed, a pressing plate stacked on and bonded to the groove substrate, and an optical fiber bonded to and fixed in the groove of the groove substrate, and the optical circuit substrate including an input/output waveguide. In a connection surface of the optical circuit module, an area of a common portion in a cross section of the optical circuit substrate and the pressing plate is larger than an area of a common portion in a cross section of the optical circuit substrate and the groove substrate.

Optical circuit module

An optical fiber array includes a V-groove substrate in which a V-groove for optical fiber alignment is formed, a pressing plate laminated and bonded on the V-groove substrate, and an optical fiber bonded and fixed in the V-groove of the V-groove substrate, wherein a distance between the optical fiber and the V-groove is less than 20 μm.

Optical fiber connection structure

In a pipe structure in which an optical fiber passes, miniaturization of the optical module in the longitudinal direction of the optical fiber is prevented. In the optical module according to the present invention, a holding structure of the optical fiber necessary to adopt the pipe structure is moved to a cover extension unit of the package. The optical fiber is adhered and fixed to the cover extension unit protruding from the cover body unit of the package to ensure protection of the optical fiber, and the optical waveguide chip is disposed to be closer to an inner wall of a side surface of the package. By disposing the optical waveguide chip to be close to the inner wall of the package as much as possible and reducing the mounting area in the package to the utmost, it is possible to realize miniaturization of the entire optical module.

An optical module according to the present invention includes: an optical device including an optical waveguide chip; an optical fiber block bonded to and arranged on an end face of the optical waveguide chip; an optical fiber that has one end optically connected to the optical waveguide chip via the optical fiber block; an optical fiber holding mechanism for holding the other end of the optical fiber; and an optical fiber carrier. The optical fiber is arranged while being curved from the optical fiber carrier toward the optical fiber block in a U-shape, and a wall structure is formed on the surface of the carrier while being adjacent to the optical fiber at, for example, a position on the outer side of the U-shaped curve of the optical fiber position at which the wall structure reduces a normal force of the optical fiber.

There is provided an optical fiber array that can be easily optically connected to cores of optical waveguides on a connection counterpart substrate without requiring a complicated fabrication process to the connection counterpart substrate and laborious diffusing fusion of the cores. In an array, coating-removed exposed portions of fibers are attached to grooves that are provided on a lower substrate in order to position the optical fibers. Further, the exposed portions are pressed by a lid. Coated portions of the fibers are placed on a flat surface of a concave portion that is provided on the substrate to form a step with the grooves in a state where the exposed portions are attached. Front end parts of the exposed portions of the fibers each have a light collecting portion that collects light beams passing through an inside of the corresponding fiber to reduce an MFD. The light collecting portions are lens-shaped portions that are formed by cutting and are used for optical alignment with the cores of the optical waveguides.

Optical fiber array and connecting method thereof

An object is to improve crosstalk between ports while keeping an interposer circuit small. In an interposer circuit that includes a first surface connected to an optical circuit, a second surface that is connected to a fiber block and is located opposite to the first surface in parallel with the first surface, and a plurality of connection waveguides connected to a plurality of input/output waveguides included in the optical circuit and a plurality of input/output fibers included in the fiber block, the connection waveguides each have a straight shape, and an angle (θ) formed between the first surface and each of the connection waveguides is the same as an angle (φ) formed between the second surface and each of the connection waveguides.

Interposer circuit

A communication apparatus includes a packet reception unit; a packet transmission unit; and a processing sequence control unit that controls a processing sequence, and the processing sequence control unit includes a packet holding unit; function instances for respective function files including groups of procedures and groups of variables; an instance information management unit that holds instance information including function instance identifiers identifying the function instances, procedure identifiers identifying the procedures belonging to the function instances, and memory addresses of the procedures; an execution sequence information management unit that holds execution sequence information that associates the function instance identifiers, the procedure identifiers, return values of the procedures, and procedures belonging to function instances that are to be executed next; and a function execution unit that, on the basis of the execution sequence information and the instance information, calls a procedure, executes a process on the communication packet, and executes the next process depending on a return value.

Communication apparatus and communication method that control processing sequence of communication packet

A method for manufacturing a monolithically integrated semiconductor optical integrated element comprising a DFB laser, an EA modulator, and a SOA disposed in a light emitting direction, comprising the step of forming a semiconductor wafer on which the elements are two-dimensionally arrayed and aligned the optical axes; cleaving the semiconductor wafer along a plane orthogonal to the light emitting direction to form a semiconductor bar including a plurality of the elements arranged one-dimensionally along a direction orthogonal to the light emitting direction such that the elements adjacent to each other share an identical cleavage end face as a light emission surface; inspecting the semiconductor bar by driving the SOA and the DFB laser through a connection wiring part together; and separating out the semiconductor bar after the inspection to cut the connection wiring part connecting the electrode of the SOA and the DFB laser to isolate from each other.

Semiconductor integrated optics element and production method therefor

A fiber module (B) according to the present disclosure includes an input-side optical fiber (), an output-side optical fiber (), a ferrule () in which the input-side optical fiber and the output-side optical fiber are insertable in both ends and a groove () is formed in a direction orthogonal to a longitudinal direction (D) in the middle of the longitudinal direction, a dielectric multilayer film filter () inserted in the groove, and an input-side GI fiber () and an output-side GI fiber () joined by fusion to respective terminal portions of the input-side optical fiber and the output-side optical fiber. The dielectric multilayer film filter is interposed between an end surface () of the input-side GI fiber and an end surface () of the output-side GI fiber in the longitudinal direction.

Fiber module

In a nest MZI modulator in which each arm includes a child MZI, the power consumption is reduced. The hybrid integrated-type nest MZI modulator of the embodiment 1a is configured so that, instead of placing a relative phase adjusting section in a parent MZI, a bias electrode Bias 90&#xb0; in which an electric field is applied in the same direction to the polarization direction in both of the upper and lower arms is placed in each child MZI (see FIG.B). The bias electrode Bias 90&#xb0; provided in each child MZI constitute the entirety of a relative phase adjusting section. The optical signals are subjected to a phase change after the output from the child MZI (see FIG.A), because such relative phase adjusting section can subject the optical signals of the upper and lower arms of the child MZI to a shift change in the same direction, respectively.

Advanced-format optical modulator with low power consumption and low-loss characteristics

In an optical component configured to fix to a mount an optical device chip in which waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component () comprises an optical device chip () including an LN waveguide (), a first PLC waveguide (), a second PLC waveguide (), and a fiber alignment member (), a mount (), and optical fibers (). Each of connection faces between the first PLC waveguide and the fiber alignment member is configured as an tilted structure, and each of connection faces between the LN waveguide, and the first and second PLC waveguides is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.

Optical component

Disclosed is an optical modulator which substantially lowers loss and has little attenuation in the intensity of an optical signal after modulation. The optical modulator includes a 1&#xd7;2 RZ pulse carver wherein optical phase shifters used for modulation are arranged along two arm waveguides held between a 1&#xd7;2 coupler and a 2&#xd7;2 coupler, two interferometric modulators connected respectively to two output ports of the 2&#xd7;2 coupler, and a 2&#xd7;1 coupler for combining the outputs of the interferometric modulators.

Optical modulator

An optical modulator having a high stability is provided. In the optical modulator according to the present invention, a phase modulation by an electro-optic effect is made on an optical substrate of an electro-optic material while the setting of an operating point by a thermal-optic effect is made on a planar lightwave circuit (PLC) substrate of quartz, silicon, or the like. Such configuration can suppress the influence of thermal drift or the like because no heat is applied directly to the optical substrate of the electro-optic material. In addition, breakage and warpage of the substrate due to heat are also mitigated. Further, quartz used for the PLC has a low thermal conductivity, approximately one-fifth of that of the LN substrate (approximately 1 W/(m&#xb7;K)), and therefore, a desired phase difference can be maintained with a low power consumption, and thus, the operating point becomes stabilized.

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Atsugi, Japan

Takashi Yamada