Sony Corporation

Nec Corporation

Oki Electric Industry Co., Ltd.

Takashi Yajima

Minehiro Tonosaki

Eisaku Kato

Ienobu Takizawa

Masakazu Yajima

Kazunao Oniki

Motosuke Ohmi

Shinya Kamagami

Mitsunori Shigeta

A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path includes a first mesh member and causes the working fluid in a vapor phase to circulate inside the vessel, the first mesh member including a through-hole larger than a mesh thereof. The liquid-phase flow path causes the working fluid in a liquid phase to circulate inside the vessel.

Heat-transporting device and electronic apparatus

A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force; a second base plate having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the working fluid, a second concavity functioning as a liquefaction chamber for liquefying the working fluid, a first ditch for transporting the vaporized working fluid, a second ditch for transporting the liquefied working fluid, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and a thermoplastic or thermosetting resin material for bonding the first and second base plates. The heat transport device can be readily manufactured by heating the first and second base plates sandwiching a thermoplastic or thermosetting resin material therebetween.

Heat transport apparatus and heat transport apparatus manufacturing method

The present invention provides a cooling device having improved cooling performance and providing higher flexibility, an electronic apparatus and an acoustic apparatus employing the cooling device, and a method for producing the cooling device. The cooling device is provided with an evaporator that is capable of cooling an object to be cooled, and a condenser that is capable of releasing to the outside heat that has been absorbed during the cooling by the evaporator. A vapor-phase conduit and a liquid-phase conduit, both of which are made of fluorocarbon resin and through which an operating medium flows, are disposed between and coupled to the evaporator and the condenser, thereby circulating the operating medium.

Cooling device, electronic apparatus and acoustic apparatus, and method for producing the cooling device

A multi-layered wiring structure includes a lower wiring having an upper surface, a first inter-level insulating layer having a first flat upper surface substantially coplanar with the upper surface of the lower conductive wiring and a recess contiguous to the first flat upper surface, a spin-on-glass layer filling the recess and having a second flat upper surface substantially coplanar with the first flat upper surface, a second inter-level insulating layer covering the first and second flat surfaces and the upper surface of the lower conductive wiring and an upper conductive wiring extending on the second inter-level insulating layer and passing through a contact hole of the second inter-level insulating layer so as to be held in contact with the lower conductive wiring, and the first and second flat upper surfaces are created through an etch-back using gaseous etchant equally etching the first inter-level insulating layer and the spin-on-glass layer, thereby creating smooth surface under the second inter-level insulating layer.

Semiconductor device having a conductor through an inter-level layer and

A novel structure of a semiconductor memory device on a silicon substrate comprising: a first area on which stacked capacitor memory cells comprising top and bottom electrodes sandwiching a dielectric film are formed; a second area including at least a contact hole in which at least a wiring layer is formed; and a plurality of inter-layer insulators extending over both the first and second areas, wherein: the a plurality of inter-layer insulators have two different total thickness between the first and second areas so that the total thickness on the first area is larger than that on the second area to thereby sufficiently reduce an aspect ratio of the at least a contact hole on the second area for allowing the wiring layer in the contact hole to have a good step coverage as well as allowing a top inter-layer insulator to have a gentle slope with a good step coverage at a boundary between the first and second areas.

Stacked capacitor semiconductor memory device and method for fabricating

In a bill examination device in which a signal pattern obtained by scanning the bill with a photo-detector or a magnetic detector is compared with a reference for testing the authenticity, the signal is subjected to differentiation or removal of a direct-current component before the comparison. The effect of the differences or offsets of the detector or its associated circuit due to manufacturing variations, temperature change, or aging, and differences in the darkness of printing or smudge on the bill is reduced, and the reliability of the authenticity test is improved.

Bill examination device

A bill discriminating device includes sensor circuitry for scanning and reading all the printed patterns of a bill to be discriminated and producing discriminated data including bill scale data, the bill scale data representing the density of the printed patterns. A data storage memory stores the discriminated data including the bill scale data from the sensor circuitry. A bill scale data selector selects the bill scale data from the discriminated data and fetches the selected bill scale data from the data storage memory. A data segmentor segments the thus selected and fetched bill scale data into a plurality of blocks of data. An arithmetic unit subjects the segmented bill scale data to an arithmetic averaging process for each block of data. A reference data storage memory stores reference data for each of a plurality of predetermined reference bills. Bill decision circuitry reads each reference data from the reference data storage memory and compares each block of the bill scale data which was subjected to an arithmetic averaging process with each reference data.

Growing community of inventors

Tokyo, Japan

Takashi Yajima