Konica Minolta, Inc.

Konica Minolta Opto, Inc.

Wako Pure Chemical Industries, Inc.

Konica Minolta Advanced Layers, Inc.

Takashi Washizu

Takuji Hatano

Hiroshi Hirayama

Yoshikazu Tanaka

Atsushi Takahashi

Yoshihito Taguchi

Naoki Shimizu

Takehiko Goshima

Takuya Ishigai

Toshinori Takimura

Yoshiyuki Masuda

Hitoshi Adachi

This orthosis manufacturing system is designed to manufacture an orthosis to be fitted on a human body and provided with: an orthosis modeling data generation unit () for generating orthosis modeling data (D) for the orthosis on the basis of three-dimensional data (D) of the human body generated by measuring the shape of a portion of the human body to which the orthosis is to be fitted, a model shape data (D) for the orthosis, and manufacture history data (D) relating to other orthoses manufactured in the past; and an orthosis formation unit () for three-dimensionally forming the orthosis on the basis of the modeling data (D).

Orthosis manufacturing system, system for generating correction data for manufacturing orthosis, and orthosis manufacturing method

Disclosed is a manufacturing method for a light emitting device including a light emitting element and a wavelength converting part which converts light emitted from the light emitting element into light of another wavelength. The manufacturing method includes a first step and a second step. The first step is a step of applying onto the light emitting element and drying a first liquid mixture in which phosphor and plate-like particles are dispersed in polyhydric alcohol having a valence of two or more to form a phosphor layer. The second step is a step of applying onto the phosphor layer and firing a second liquid mixture in which a translucent ceramic precursor is dispersed in a solvent to form the wavelength converting part.

Manufacturing method for light emitting device and phosphor mixture

A flow path groove is formed in the surface of at least one of two resin substrates; the two resin substrates are joined with the surface in which the flow path groove is formed facing inward; a through-hole having a substantially round cross section is formed in either one of the two resin substrates such that the through-hole connects with the flow path groove from the surface opposite the surface where the two resin substrates join; protruding parts, which protrude in the direction of thickness of the resin substrates and are disposed enclosing the through-hole, are formed in the surface on the opposite side; a space, which has a substantially round cross-sectional shape concentric with the through-hole and has depth in the same direction as the direction of thickness of the resin substrates, is formed in the joined surfaces when the protruding parts are projected from the direction substantially perpendicular to the joined surfaces; and the correlation of fc&#x3e;fa is satisfied when the edges on the base end side of the through-hole are projected onto the joined surfaces from a substantially perpendicular direction, where the diameter on the base end side of the through-hole is fa and the diameter on the end edge side of the space touching the joined surfaces is fc.

Microchip

A microchip having a substrate, a cover member joined to one surface of the substrate, and a flow path formed on at least one of joined surfaces of the substrate and the cover member, wherein the microchip includes: a well which is an first opening for communicating into the flow path with a surface opposite to the joined surface of the substrate and is arranged on the substrate; and a chimney which is a member arranged so as to project from the surface opposite to the joined surface of the substrate and has an second opening which communicating into the well, wherein a liquid rise prevention section is formed in the chimney to prevent the liquid from rising to a top portion of the chimney.

A light-emitting device () is provided with a metal part () atop a planar LED substrate (), and an LED element () is disposed atop the metal part (). A glass substrate () is provided to an upper surface of the LED element (), and a wavelength conversion part () is formed on an upper surface of the glass substrate (). The wavelength conversion part () comprises a light-transmissive ceramic layer formed by heating a mixture containing a phosphor, an organometallic compound, a layered silicate mineral, an inorganic particulate, an organic solvent, and water.

Light-emitting device and method for manufacturing same

Disclosed are a light emission device comprising an LED element and a wavelength conversion section, the LED element emitting light of a specific wavelength and the wavelength conversion section converting the light emitted from the LED element to light of a specific wavelength, featured in that the wavelength conversion section is composed of a ceramic layer which has been formed employing, as a raw material, polysilazane containing a phosphor and inorganic fine particles with a particle size smaller than the phosphor.

Light emission device

Disclosed are an optical element assembly comprising a base member in which occurrence of cracks in the base member upon cutting can be prevented and a method of manufacturing an optical unit. The optical element assembly comprises a base member and a plurality of lens members, wherein at least the base member of the optical element assembly is composed of an acryl resin having an alicyclic structure which is a polymer of a monomer represented by the following formula (1) in which linkage groups Rand Rlie between an atomic group A and ROCO and between an atomic group A and OCOCR, respectively.HC&#x2550;CRCOO&#x2014;(R)-A-(R)&#x2014;OCOCR&#x2550;CH&#x2003;&#x2003;(1)

Optical element assembly and method of manufacturing optical unit

A wavelength conversion element, including: a substrate; and a ceramic layer formed on the substrate, the ceramic layer being obtained by sintering a ceramic precursor; wherein the ceramic precursor is a compound selected from the group composed of alkoxysilane and a compound having a plurality of siloxane structures; a phosphor and particles of an oxide are mixed with the ceramic precursor; the phosphor has particle diameters within a range of from 1 &#x3bc;m to 50 &#x3bc;m and a concentration of the phosphor in the ceramic layer is equal to or more than 40 wt % and less than 95 wt %; and the particles of the oxide have primary particle diameters within a range of from 0.001 &#x3bc;m to 30 &#x3bc;m and a concentration within a range of from 0.5 wt % to 20 wt % in the ceramic layer.

Growing community of inventors

Hino, Japan

Takashi Washizu