Fujitsu Frontech Limited

Renesas Technology Corp.

Kabushiki Kaisha Toshiba

Hitachi, Ltd.

Fujitsu Frontech Systems Limited

Nec Corporation

Tdk Corporation

Jfe Steel Corporation

Hitachi Ulsi Systems Co., Ltd.

C.uyemura Co., Ltd.

Takemoto Yushi Kabushiki Kaisha

Renesas Eastern Japan Semiconductor, Inc.

Kokan Mining Co., Ltd.

Takashi Wada

Satoshi Hayashi

Tomoyuki Tamahashi

Atsushi Ando

Akira Yamada

Shohei Koizumi

Takuji Ide

Eiji Niihara

Shunichiro Fujioka

Mitsue Ueno

Chuichi Miyazaki

Shoichi Deguchi

Katsuo Takahashi

Atsushi Yamaguchi

Kazunari Suzuki

Hiroyuki Fukuda

Yuji Tanaka

Kaoru Suzuki

Hiroshi Maki

Toshio Ishii

Kazunori Onoguchi

Tsuyoshi Abe

Mitsuo Kinoshita

Hiroshi Hattori

Hayato Minamishin

Hiroshi Honma

Noriyuki Oroku

Minoru Yagi

Takashi Kikuchi

Tomoko Higashino

Mutsumi Watanabe

Hitoshi Odashima

Naoki Nakata

Shinji Koseki

Toshihiro Shiotsuki

Yoshiyuki Miwa

Tatsuya Shimamura

Noriyuki Ooroku

Tomoo Takahashi

Katsuhiro Takebayashi

Katsuhiko Ohara

Tatsuro Nakamura

Toru Mita

Hiroyuki Mitsufuji

Seiko Nara

Chiaki Yoshizawa

Tatsushi Sugiyama

Eitaro Shidara

Tetsuya Odaka

Ryoka Niikuni

Kiyotaka Yagesawa

Shinji Katsumaru

Yasuhiro Motohashi

A paper sheet handling apparatus includes: a first facing section and a second facing section that are disposed to face each other across an insertion/take-out space; a partition section that is disposed between the first and second facing sections so as to be capable of moving in a facing direction in which the first and second facing sections face each other, forms, within the insertion/take-out space, an insertion space between the partition section and the first facing section, and forms, within the insertion/take-out space, a take-out space between the partition section and the second facing section. The partition section includes a movable member provided at a leading end portion of the partition section on an insertion/take-out port side and capable of moving toward each of the first facing section and the second facing section.

Paper sheet handling apparatus

A paper sheet handling apparatus includes: a partition portion that forms an insertion space into which a paper sheet is inserted from an insertion port with a first opposing portion, and forms a taking-out space from which the paper sheet is taken out from the insertion port with a second opposing portion; and a conveyor that conveys the paper sheet left in the taking-out space in a state of protruding toward the taking-out space from a first opening portion of the first opposing portion and a second opening portion of the partition portion. The partition portion includes a second shutter that openably closes the second opening portion, and a second shutter opening/closing unit that opens the second opening portion by opening the second shutter in conjunction with an operation in which the partition portion moves to the remaining banknote conveyance position.

In a centering mechanism and a paper sheet handling apparatus including the centering mechanism, a centering unit conveys a paper sheet in a pinched state, and centers a position of the paper sheet in a width direction orthogonal to a conveyance direction of the paper sheet by inclining with respect to the conveyance direction. In addition, the paper sheet is delivered to a downstream side conveyance unit from the centering unit in a state in which the centering unit pinches the paper sheet, and the downstream side conveyance unit conveys the paper sheet while pinching the paper sheet at pinch pressure stronger than pinch pressure at which the centering unit pinches the paper sheet.

Centering mechanism and paper sheet handling apparatus

A paper sheet stacking device includes: a conveyance mechanism that conveys paper sheets; a stacking mechanism including a stacking space in which the paper sheets, which are conveyed by the conveyance mechanism, are stacked, a first space regulating member that moves in a thickness direction of the paper sheets in the stacking space, a support member that extends in the moving direction of the first space regulating member and supports one side of the paper sheets in the stacking space, and a second space regulating member that is provided to face the support member and moves in a direction toward and away from the support member; and a controller that controls the stacking mechanism. The controller controls a position of the second space regulating member in accordance with an outer dimension of the paper sheets that are conveyed into the stacking space by the conveyance mechanism.

Paper sheet stacking device and method for controlling paper sheet stacking device

A conveyance route switching mechanism and a paper sheet handling apparatus that includes the conveyance route switching mechanism include a driving source, a gate, a first gear, and an internal gear. The driving source includes a driving shaft. The gate includes a gate shaft, and a blade that is provided on the gate shaft, and switches conveyance routes of paper sheets. The first gear is provided on the gate shaft. The internal gear meshes with the first gear. According to rotation of the driving shaft, the gate shaft rotates on an axis of the gate shaft, and revolves with the driving shaft as a rotation center while the first gear meshes with the internal gear.

Conveyance route switching mechanism and paper sheet handling apparatus

A paper sheet handling apparatus includes a handling section and a plurality of housing units. The handling section includes an upstream conveyance mechanism and a validation section. The upstream conveyance mechanism conveys paper sheets. The validation section validates paper sheets conveyed by the upstream conveyance mechanism. The housing units each include a downstream conveyance mechanism and a housing section. The downstream conveyance mechanism conveys paper sheets conveyed from the handling section. The housing section houses therein paper sheets conveyed by the downstream conveyance mechanism. Each of the housing units can be coupled to another one thereof via the downstream conveyance mechanisms, and a group of the downstream conveyance mechanisms, which are coupled together, is coupled to a group of the housing sections in a manner that allows the group of the downstream conveyance mechanisms to integrally pivot with respect to the group of the housing sections.

A paper sheet handling apparatus has a pickup roller, a stage, a pressure sensor, and a measuring unit. For each feeding process, in which the pickup roller feeds paper sheets until the pressure detected by the pressure sensor becomes less than a predetermined set value, the stage presses paper sheets against the pickup roller until the pressure detected by the pressure sensor reaches another set value. The pickup roller operates at a feeding speed of a first speed if a calculated feeding value is less than a threshold, and operates at a feeding speed of a second speed that is slower than the first speed if the calculated feeding value is equal to or greater than the threshold, the calculated feeding value being calculated based on: the amount of movement of the stage measured by the measuring unit; and the number of paper sheets fed by the feeding process.

A batch annealing furnace includes a coil support base on which an end face of a coil is mounted and that supports the coil with an axis of the coil being upright, an inner cover that covers an entire body of the coil mounted on the coil support base, and a cooling pipe that extends downward from the upper part of the inner cover to a cavity of the inner peripheral part of the coil mounted on the coil support base and cools the coil from the inner surface side by passing a coolant through the inside of the cooling pipe.

Batch annealing furnace for coils

According to one embodiment, an image processing apparatus includes a resolution increasing module and a moving-image improving module. The resolution increasing module performs, on receipt of a first video signal with first resolution, super resolution conversion on the first video signal to obtain a second video signal with second resolution that is higher than the first resolution by estimating an original pixel value from the first video signal and increasing pixels. The resolution increasing module also performs first correction on the second video signal obtained by the super resolution conversion. The moving-image improving module configured to perform, on the second video signal subjected to the first correction, second correction except for a correction process included in the first correction.

Image processing apparatus and image processing method

To improve the reliability and yield of a thin-type semiconductor device as used for a stack-type flash memory, the semiconductor device is manufactured by upheaving each of semiconductor chips (semiconductor devices) obtained by dicing a semiconductor wafer on an adhesive sheet from a backside via the adhesive sheet using an upthrow jig to which ultrasonic vibration is applied so as not to break through the adhesive sheet, and by picking up each semiconductor chip.

Semiconductor device and its manufacturing method

A method of manufacture of a semiconductor device can speedily peel extremely thin chips which are laminated to an adhesive tape without generating cracks or chippings. In this regard, the head of a vibrator is brought into contact with a back surface of an adhesive tape to which a plurality of semiconductor chips are laminated. By applying longitudinal vibrations having a frequency of 1 kHz to 100 kHz and an amplitude of 1 &#x3bc;m to 50 &#x3bc;m, the chip is peeled from the adhesive tape. In applying the longitudinal vibrations to the adhesive tape, a tension in a horizontal direction is applied to the adhesive tape.

Method of manufacturing a semiconductor device

An anti-bonding agent for blast furnace slag or its grading adjusted slag which includes one or more polymers having a main constituent unit shown byby a greater molar percentage than any other constituent unit where M is hydrogen atom, alkali metal such as sodium, alkali earth metal, ammonium or organic amine is used in an amount of 0.002-0.3 weight parts for 100 weight parts of such blast furnace slag or its grading adjusted slag, and may be applied as an aqueous solution with concentration of 1.5-10 weight %.

Anti-bonding methods for blast furnace slag or its grading adjusted slag

A contact collect is provided to prevent damage to the top surface of a semiconductor chip at the time of die bonding the semiconductor chip. A protection tape is pasted to the top surface of the semiconductor chip before die bonding of the semiconductor chip is executed by pressing the back surface (underside) of the semiconductor chip sucked and securely held by the contact collect against respective chip-mounting regions of a multi-wiring board. The contact collect is, for example, substantially cylidrical in outside shape, and a bottom part (suction head) thereof is made of soft synthetic rubber, etc. The protection tape pasted to the top surface of the semiconductor chip prevents the top surface of the semiconductor chip from directly contacting with the contact collect even at the time of vacuum suction by pressing the suction head of the contact collect against the top surface of the semiconductor chip.

A semiconductor device according to the invention is provided with square first semiconductor chip and second semiconductor chip laminated with each one main surface opposite, a supporting lead a part of which is arranged between one main surface of the first semiconductor chip and one main surface of the second semiconductor chip and a resin sealing body that seals the first semiconductor chip, the second semiconductor chip and the supporting lead and is characterized in that the respective one main surfaces of the first semiconductor chip and the second semiconductor chip are bonded to a part of the supporting lead via an adhesive layer and a part of the supporting lead is formed so that it has smaller width than the respective sides of the first semiconductor chip and the second semiconductor chip.

Semiconductor device and a method of manufacturing the same

A finite element model of the environment of electrodeposit coating is prepared by a simulation method, change of an electric field in an electrolytic cell for the case of electrodeposit coating is simulated, the distribution of currents then flowing through individual parts of a finite element model of a to-be-coated object is obtained, the electric variables of currents flowing through the respective surfaces of the finite elements of the to-be-coated object are obtained and accumulated according to the current distribution, the thickness of an electrodeposition coating film is calculated as h&equals;&Sgr;K I C.E.&Dgr;t/&rgr; if the cumulative electric variable is higher than a deposition starting electric variable such that a fixed concentration is attained by OH or H .

ELECTRODEPOSITION COATING FILM THICKNESS CALCULATING METHOD, RECORDING MEDIUM STORED WITH FILM THICKNESS CALCULATING PROGRAM AND READABLE BY MEANS OF COMPUTER, AND ELECTRODEPOSITION COATING FILM THICKNESS SIMULATION APPARATUS

Growing community of inventors

Tokyo, Japan

Takashi Wada