Rohm Co., Ltd.

Nec Corporation

Nec Compound Semiconductor Devices, Ltd.

Oki Electric Industry Co., Ltd.

Oki Semiconductor Co., Ltd.

Kawasaki Microelectronics, Inc.

Takashi Ueda

Toshimichi Kurihara

Kiyohiro Isogawa

Koji Yamada

Yoshihiro Ikefuji

Masanori Fujisawa

Osamu Goto

Masamoto Tago

Yoshihiko Kobayashi

Mitsuhiko Fukuda

Masato Sakai

Takaharu Sato

Katsutoshi Nagi

Yoshiaki Nagato

Tutomu Nakamura

Chouho Yamagishi

Tomoki Nozawa

A hollow sealing structure includes a substrate, an element part provided on a first surface of the substrate, a cap that covers the element part, and a resin layer that covers the cap. The substrate includes a positioning part positioning the cap. The cap includes a fixation part being arranged at the positioning part and fixing the cap on the substrate. The resin layer is connected to the positioning part and the fixation part.

Hollow sealing structure

A semiconductor laser device includes a supporting substrate having a wiring pattern thereon; LD fixed on the surface of the supporting substrate and having a signal output section that emits signal laser light and a monitoring output section that emits monitoring laser light; and a monitoring PD. The monitoring PD includes a semiconductor substrate having a region that transmits light of the wavelength of the monitoring laser light; and a light receiving section for photoelectric conversion formed on the surface of the semiconductor substrate, one incident surface of the side surfaces of the semiconductor substrate arranged in a position to which the monitoring laser light can be made incident, the light receiving section arranged in a position higher than the monitoring output section, and a back surface of the semiconductor substrate and the wiring pattern fixed on the supporting substrate to oppose each other.

Semiconductor laser device

The lower end of a resin wall is bonded to a radiating plate, and a lead is fixed so as to extend through the resin wall. After a semiconductor chip is bonded thereto, a resin lid is put to seal the semiconductor chip. Recessed parts for burying the lower end of the resin wall are formed on the side parts of the radiating plate, and protruding parts are further provided within the recessed parts. The lead has holes formed on the package outer part and the resin wall inner part. The loading surface of the semiconductor chip is finished with silver plating, and the package exterior and the lead are plated with gold. The shape fitted to the resin wall is imparted to the resin lid, and the resin lid is further formed into a vertically plane symmetric shape.

Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof

A semiconductor device includes a first lead having an inner portion on which a semiconductor chip is mounted, a second lead having an inner portion electrically connected to the semiconductor chip via a wire and a resin package for sealing the semiconductor chip and the wire. The inner portions, the semiconductor chip and the wire are coated with a coating film formed of amorphous fluororesin.

Method of making semiconductor device

An over-sampling circuit is provided at a front stage of a digital matched filter, and a received signal is over-sampled with it. Synchronous acquisition of the received spread spectrum signal is implemented by adding the data obtained by the over-sampling, inputting it into the digital matched filter, and then performing a correlation thereon.

Receiver and receiving method in spread spectrum communication system

An LED light source includes a rectangular LED chip and a transparent resin package enclosing the LED chip. The resin package is provided with a lens portion for directing light emitted from the LED chip to the outside of the resin package. The LED chip includes two adjacent side surfaces oriented toward the lens portion.

Resin-packaged led light source

An electronic product comprises a heat radiating plate, an electronic component securely mounted on the heat radiating plate and including a high power transistor, an enveloper including a frame member securely associated with the heat radiating plate to encompass the electronic component, and a lid member securely attached to an upper opening end of the frame member, thereby accommodating and sealing the electronic component in the enveloper, and at least one electrically conductive element passing and extending through the frame member. The frame member is made of a suitable resin material, and the lid member is made of one material selected from the group consisting of a ceramic material, a metal material, and a composite material.

Electronic product with heat radiating plate

A lid-member holder is used to define envelopers encapsulating electronic components in production of hollow-package type electronic products. A plurality of lid members are temporarily held by the holder body. The lid members are arranged so as to be consistent with an arrangement of surrounding wall members, which are to be sealed with the lid members in a lump to define the envelopers, and the temporary holding of the lid members by the holder body is realized such that lid members can be separated from the lid members after the surrounding wall members are completely sealed with the lid members, without the lid members being removed from the surrounding wall members.

Lid-holding frame used in production of hollow-package type electronic products, and sealing-process using such lid-holding frame

Semiconductor device with coated semiconductor chip

In a communication device, electric circuits other than an antenna are enclosed in a shielding member made of a material that shuts off radio waves, and the antenna is enclosed by disposing in front thereof a radio wave absorbing member that attenuates radio waves in a predetermined frequency band. Thus, unnecessary electromagnetic emission is alleviated while satisfactory communication quality is secured.

Communication device

In a non-contact communication system, when an interrogator is attempting to detect that a responder is present in a range communicable therewith, the interrogator transmits a weak radio wave from its tuning circuit. The responder receives this radio wave and acquires electric power by rectifying it, but, because the electric power thus obtained is insufficient, the responder is turned on and off repeatedly at regular intervals. This causes variation in the impedance with which the tuning circuit is loaded. The interrogator, by detecting this variation in the impedance occurring at regular intervals, recognizes that the responder is present within the range communicable therewith. Only then, the interrogator transmits a radio wave strong enough to permit the responder to acquire sufficient electric power.

Non-contact communication system

An illuminator includes a first terminal, a second terminal, and a light emitting diode mounted on the first terminal and electrically connected to the second terminal. The light emitting diode includes a chip body, a lower electrode formed on a lower surface of the chip body, and an upper electrode formed on an upper surface of the chip body. The chip body includes an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer interposed therebetween. The upper electrode is formed entirely over the upper surface of the chip electrode.

Light emitting diode and illuminator using the same

Semiconductor light-emitting device

The optical encoder according to the present invention comprises an optical unit and a light controlling member. The optical unit includes a light emitter for emitting light and a light receiver for receiving the light from the light emitter. The light controlling member includes a plurality of transparent portions for passing the light from the light emitter and a plurality of nontransparent portions disposed alternately with the transparent portions for blocking the light from the light emitter. The transparent portion and the nontransparent portion are so arranged that any pair of adjacent transparent portion and nontransparent portion has a constant length in a direction of the adjacency. The optical unit and the light controlling member are movable relative to each other in a direction of arranging the transparent and the nontransparent portions. The light receiver is provided with one or any greater number of light receiver groups each including a plurality of adjacent light receiving elements arranged in a direction of the relative movement between the optical unit and the light controlling member. Each light receiver group has, in said direction of the relative movement, a length which is unequal to said constant length of the adjacent transparent portion and nontransparent portion.

Optical encoder incorporating linear light controlling member

A non-contact communication system and an interrogator used therein achieve communication of information with a responsor, regardless of whether the responsor adopts a signal superimposition system or a signal separation system. The communication system includes first and second carrier supply portions ( ), first and second carrier modulation portions ( ), first and second carrier output portions ( ), first and second carrier detection portions ( ) and a control portion ( ) using response information from the responsor to identify a system adopted by the responsor so that information is transmitted in a form matched to the identified system.

Growing community of inventors

Kyoto, Japan

Takashi Ueda