Fuji Electric Fa Components & Systems Co., Ltd.

Fuji Electric Co., Ltd.

Zeon Corporation

Ricoh Company, Ltd.

National Institute of Advanced Industrial Science and Technology

Konishiroku Photo Industry Co., Ltd.

Fuji Electric Corporate Research and Developement Ltd.

Hitachi High-tech Corporation

Takashi Tsutsumi

Hideki Daijima

Masaaki Watanabe

Shota Shiinoki

Yasuhiro Naka

Kouetsu Takaya

Koji Okubo

Yutaka Nakamura

Hironobu Ariyoshi

Kenji Fukuda

Mitsuo Okamoto

Tsuyoshi Araoka

Youichi Makifuchi

Shinsuke Harada

Takashi Nishibe

Shotaro Yokoyama

Kiziro Suzuki

Shozo Miyawaki

Kouichi Kanaya

Takayuki Saito

Noriyuki Sakuma

Yoshitaka Sasago

Aritoshi Sugimoto

Naoki Kumagai

Yasuhiko Oonishi

Takeyoshi Sekine

Kazunori Taguchi

Takumi Fujimoto

Yoshiyuki Sakai

Makoto Fujimura

Nobuyuki Mise

Masaki Miyazato

Kazuhiro Ando

Yoshiyuki Tanimoto

Takahiro Taguchi

Masami Higuchi

Yoshiyuki Sugahara

Mikio Miura

Masashi Kuno

Naoyuki Matsuo

Masahiro Motonobu

Munenori Degawa

Yumi Osaku

Yumi Ohsaku

Takashi Shizuka

The present invention aims to provide a fuel battery system improved in reliability by accurately detecting when a fuel electrode gas or an air electrode gas has leaked. A fuel battery cell according to the present invention includes a first electrode, an electrolyte membrane, and a second electrode which are layered on a support substrate. Further, at least any one of the first electrode, the electrolyte membrane, and the second electrode is electrically isolated by an insulating member to form a first region and a second region. The insulating member is disposed at a position where the insulating member does not overlap with an opening portion of the support substrate (refer to FIG.).

Fuel battery cell, fuel battery system, leak detection method

An operation coil drive device includes a drive control unit to perform control to set, for a semiconductor switching element to switch on and off the source voltage applied to an operation coil of a magnetic contactor, a larger ON/OFF time ratio for a circuit-closing control and a smaller ON/OFF time ratio for a holding control, wherein the drive control unit includes: a circuit-closing-control inductance calculation unit to calculate an inductance of the operation coil immediately after a start of the circuit-closing control; a circuit-closing-control resistance value calculation unit to calculate a direct current resistance value of the operation coil based on the calculation result; and a circuit-closing-control switching correction unit to correct the ON/OFF time ratio of the semiconductor switching element for the circuit-closing control based on the calculation result.

Operation coil drive device for magnetic contactor

A polarized DC electromagnetic device and electromagnetic contactor using same to improve assembly efficiency without size increase of the electromagnetic device. The device includes a plunger inserted through a cylindrical portion of a spool around which an excitation coil is wound and having a first armature and a second armature attached to both ends, an outer yoke attracting the first armature and the second armature, an inner yoke disposed inside the outer yoke and attracting the second armature, and a permanent magnet disposed between the outer yoke and the inner yoke. The spool includes radially protruding flange portions respectively formed at both ends of the cylindrical portion, a coil terminal attachment portion formed in the flange portion on the first armature side, and a coil terminal attached to the coil terminal attachment portion.

Polarized DC electromagnetic device and electromagnetic contactor using same

An electromagnetic contactor in which a shock-absorbing member is integrally formed in a frame. The electromagnetic contactor includes a first frame in which an operating electromagnet is disposed and coil terminals which supply power to a coil of the electromagnet is formed to project from a side surface, and a second frame in which a contact mechanism having an auxiliary contact is disposed and has power source side terminals on one end side and load side terminals on the other end side, and in the first frame and the second frame, a snap fit is formed which can attach the second frame to the first frame in both of a normal direction coupled state where the coil terminals and the power source side terminals face the same direction and a reverse direction coupled state in which the coil terminals and the load side terminals face the same direction.

Electromagnetic contactor

An electromagnetic contactor with connecting spring including: a movable core contact plate section that is inserted into a through hole formed in a movable core and comes into contact with a contact support side of the through hole; and a pair of curved plate sections each joined to either end of the movable core contact plate section and housed in connecting spring tip housing sections formed in the contact support, the sides of which opposite to a contact surface of the movable core contact plate section come into contact with the connecting spring tip housing sections. In the movable core contact plate section, a depressed section is formed in a direction crossing a longitudinal direction to bulge out to an opposite side to the contact support side is formed, and contact sections that come into contact with the through hole are formed on both ends of the depressed section.

A silicon carbide semiconductor device includes a silicon carbide semiconductor substrate of a first conductivity type, a gate insulating film provided on a front surface of the silicon carbide semiconductor substrate and including any one or a plurality of an oxide film, a nitride film, and an oxynitride film, and a gate electrode containing poly-silicon and provided on the gate insulating film. A concentration of fluorine in the gate insulating film at an interface with the silicon carbide semiconductor substrate is equal to or higher than 1&#xd7;10atoms/cm.

Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device

A resin composition comprising a binder resin (A), a phenoxy resin having a hydroxyl equivalent of 300 or more, and a cross-linking agent (C). The resin composition of the present invention preferably further comprises a photoacid generator (D). The photoacid generator (D) is more preferably a quinone diazide compound.

Resin composition

A silicon carbide semiconductor device, including a silicon carbide semiconductor substrate, and an insulating film formed on a front surface of the silicon carbide semiconductor substrate. The silicon carbide semiconductor substrate has fluorine implanted therein, a concentration of which is in a range of 2&#xd7;10/cmto 4&#xd7;10/cm. A method of manufacturing the silicon carbide semiconductor device includes providing a silicon carbide semiconductor substrate, forming an oxide film on a front surface of the silicon carbide semiconductor substrate, removing a portion of the oxide film to expose the silicon carbide semiconductor substrate, implanting fluorine ions in the front surface of the silicon carbide semiconductor substrate through the removed portion of the oxide film, removing the oxide film after the fluorine ions are implanted, and forming an insulating film on the front surface of the silicon carbide semiconductor substrate after the oxide film is removed.

A resin composition comprising a binder resin (A), a compound (B) having an acidic group or latent acidic group, an organic solvent (C), and a compound (D) having one atom selected from a silicon atom, titanium atom, aluminum atom, and zirconium atom and having a hydrocarbyloxy group or hydroxy group bonded with that atom, wherein the compound (B) is at least one type selected from the group consisting of an aliphatic compound, aromatic compound, and heterocyclic compound, and a content of the compound (B) is 0.1 to 2.5 parts by weight and a content of the compound (D) is 2.2 to 7.0 parts by weight with respect to 100 parts by weight of the binder resin (A) is provided.

Resin composition, resin film, and electronic device

A method of manufacturing a silicon carbide semiconductor device includes forming on a front surface of a silicon carbide substrate of a first conductivity type, a silicon carbide layer of the first conductivity type of a lower concentration; selectively forming a region of a second conductivity type in a surface portion of the silicon carbide layer; selectively forming a source region of the first conductivity type in the region; forming a source electrode electrically connected to the source region; forming a gate insulating film on a surface of the region between the silicon carbide layer and the source region; forming a gate electrode on the gate insulating film; forming a drain electrode on a rear surface of the substrate; forming metal wiring comprising aluminum for the device, the metal wiring being connected to the source electrode; and performing low temperature nitrogen annealing after the metal wiring is formed.

Method of manufacturing silicon carbide semiconductor device and silicon carbide semiconductor device

A silicon carbide semiconductor device, including a silicon carbide semiconductor structure, an insulated gate structure including a gate insulating film contacting the silicon carbide semiconductor structure and a gate electrode formed on the gate insulating film, an interlayer insulating film covering the insulated gate structure, a metal layer provided on the interlayer insulating film for absorbing or blocking hydrogen, and a main electrode provided on the metal layer and electrically connected to the silicon carbide semiconductor structure.

The DC operated polarized electromagnet includes a spool around which an excitation coil is wound and that has a central opening, a plunger having first and second armatures, fitted individually, an outer yoke enclosing opposing side faces of the spool so as to attract the first armature, an inner yoke arranged on the inner side of the outer yoke so as to attract the second armature, and permanent magnets arranged between the outer yoke and the inner yoke, and reduces magnetoresistance by setting the thickness of the outer yoke thicker than the thickness of the inner yoke so that convergent magnetic flux in the plunger is diverted into the outer yoke.

DC operated polarized electromagnet and electromagnetic contactor using the same

A radiation-sensitive resin composition comprising a binder resin (A), a radiation-sensitive compound (B), a tetrafunctional or lower functional epoxy-based cross-linking agent (C) having an epoxy equivalent of 450 or less and a softening point of 30&#xb0; C. or less, and an aralkyl phenol resin (D) is provided. According to the present invention, it is possible to provide a radiation-sensitive resin composition able to give a resin film high in adhesion to a metal layer and excellent in developability and low hygroscopicity.

Radiation-sensitive resin composition and electronic device

On a silicon carbide semiconductor substrate, heat treatment is performed after one layer or two or more layers of an oxide film, a nitride film, or an oxynitride film are formed as a gate insulating film. The heat treatment after the gate insulating film is formed is performed for a given period in an atmosphere that includes Hand HO without including O. As a result, hydrogen or hydroxyl groups can be segregated in a limited region that includes the interface of the silicon carbide substrate and the gate insulating film. The width of the region to which the hydrogen or hydroxyl groups is segregated is from 0.5 nm to 10 nm. In such a manner, the interface state density can be lowered and high channel mobility can be realized.

Silicon carbide semiconductor device and manufacturing method of silicon carbide semiconductor device

The electromagnetic contactor includes a first frame in which an operation electromagnet is mounted; a second frame in which a contact mechanism is mounted; and a snap-fit section that is made up of a fitting protruding section and a hook section formed to one and the other of the first and second frame, respectively, the hook section fitting to the fitting protruding section. The hook section has a flexible projecting plate section formed in a projecting manner to an open end of either the first or second frame and a fitting section formed at a tip of the flexible projecting plate section, the fitting section fitting to the fitting protruding section. The flexible projecting plate section is provided with elasticity that fits the fitting section to a base side of the fitting protruding section in accordance with progress of wear between the fitting section and the fitting protruding section.

Electromagnetic contactor having snap-fit section coupling frames

Growing community of inventors

Tokyo, Japan

Takashi Tsutsumi