Sony Corporation

Renesas Technology Corp.

Hitachi, Ltd.

Hitachi Keiyo Engineering Co., Ltd.

Sony Kabushiki Kaisha

Other

Hitachi Ulsi Engineering Corp.

Renesas Electronics Corporation

Sony Computer Entertainment Inc.

Hitachi Engineering Co., Ltd.

Hitachi Ulsi

Takashi Totsuka

Hirotaka Nishizawa

Tamaki Wada

Takashi Tsunehiro

Michiaki Sugiyama

Jun Kitahara

Kenji Osawa

Junichiro Osako

Yosuke Yukawa

Junji Horikawa

Kunihiro Katayama

Mitsuharu Ohki

Tomoo Mitsunaga

Keiichi Tsutsui

Takeshi Suzuki

Yoshitaka Aoki

Takeshi Wada

Kenichi Kaki

Yasunobu Kato

Hajime Yamagami

Tsunehiro Tobita

Ryuichi Hattori

Yukihiro Seki

Hiroyuki Shioya

Takashi Kikuchi

Takao Okubo

Shigeru Kadowaki

Masamichi Kishi

Manabu Saito

Yosio Takaya

Nagamasa Mizushima

Noboru Oya

Rui Yamada

Takayuki Tamura

Motoyasu Tsunoda

Toru Owada

Takahiro Ishii

Hidetoshi Nagano

Shinya Iguchi

Taku Yokoyama

Takeshi Asahi

Shigehiro Shimada

Kyoko Nakamura

Anil Hirani

Tomotaka Ogino

Yuichi Abe

Makoto Kawamura

Yasushi Akao

Ikuya Kawasaki

Akira Yamada

Junichi Maruyama

Kenji Ohsawa

Ryoichi Imaizumi

Kenichiro Nakamura

Haruji Ishihara

Shinya Ishii

Junichi Tsukamoto

Norikazu Hiraki

Hideaki Bando

Yoshihiro Manabe

Hidehiro Hirase

Naosuke Asari

John Zeiss

Kaoru Hagiwara

Takao Shimada

Shinichi Sawamura

Jean-Luc Nougaret

Kazunori Yamawaki

Tetsuya Masuda

An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip () is mounted on a card substrate (), and plural connection terminals () are exposed. The connection terminals are connected to predetermined external terminals () of the semiconductor integrated circuit chip, first overvoltage protection elements () connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors () connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.

IC card with terminals for direct access to internal components

A content sharing system and content importance level judging method are provided. The content sharing system provides an importance level of arbitrary content is individually judged with respect to users and a notice message valuable for a user is appropriately notified to a client or the outside tool. Further, an access user is able to set the disclosure level of access record of a user accessed the content. In the content sharing system, an importance level of content of multimedia data on a server shared with clients of a plurality of users is judged, in which the importance level of the content with respect to each user is individually calculated by interpreting existing data or a user environment, the client condition is judged, a notice rule setting is changed in accordance with the client condition or an instruction from the client, and a notice message is issued to an appropriate address based on the calculated importance level and a notice rule of the content.

Content sharing system and content importance level judging method

Polygonal data input in a first step is subjected to evaluation in which all edges of the polygon data are ranked in importance on the basis of a volume change caused by removal of that edge. The edges are sorted on the basis of an evaluation value in a third step. In a fourth step, the edge of a small evaluation value is determined to be an edge of a small influence on the general shape and is removed. In a fifth step, a new vertex is determined from the loss of vertex by the edge removal. In a sixth step, a movement of texture coordinates and a removal of the texture after the edge removal are executed on the basis of the area change of the texture due to the edge removal by a predetermined evaluating function. In a seventh step, by repeating the processes in the second to sixth steps, a polygon model approximated to a desired layer can be obtained.

Computer animation generator

Nonvolatile memory apparatus

To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.

IC card module

IC card with bonding wire connections of different lengths

IC card

A card tray to be mounted to a memory card can make the memory card mountable in a card slot for memory cards conforming to standards different from those to which the memory card conforms. The card tray has a main body and a recessed mount section. The recessed mount section is formed such that the holder of a second memory card can be mounted to one of the major surfaces of the main body. A memory-card-mounted body is produced when the second memory card is mounted to the recessed mount section. The card tray is configured such that, when the first memory card is placed on the memory-card-mounted body with the left and right edges thereof aligned with each other, the contact pieces of the first memory card and the contact pieces of the second memory card have longitudinally overlapping parts and transversally overlapping parts as viewed from above.

Card tray

Memory card

In a memory card with a newly-added module for performing data communication, data communication is stably performed without receiving a noise effect. As an embodiment of the present invention, a memory cardhas a thin-plate-shaped holding member, a memory sectionprovided as buried in the holding member, plural first connection pieces-connected to the memory section, a data communication sectionprovided as buried in the holding member, and two connection piecesconnected to the data communication section. The two second connection piecesare disposed at the end of a row part Ron which only the plural first connection pieces-are aligned. One first connection piecepositioned at the end of the row part Ris a ground terminal. That is to say, in the plural first connection pieces-, the first connection pieceadjacent to the second connection pieceis a ground terminal.

An IC card module includes first external connecting terminals and second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10). The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals include signal terminals electrically separated from one another.

This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.

Growing community of inventors

Machida, Japan

Takashi Totsuka