Hamamatsu-Photonics K.k.

Takashi Tonbe

Shigeru Suzuki

Mitsutoshi Sugiya

Fumiyuki Tokura

A connection substrateincludes a base materialformed by stacking a plurality of dielectric layerstoand a plurality of through conductorsprovided penetrating through the dielectric layerstoadjacent to each other. A plurality of radiation shielding filmstoformed integrally with each of the plurality of through conductorsand separated from each other are provided at two or more interlayer parts in the dielectric layersto. A region PRof the radiation shielding film() formed integrally with one through conductorin one interlayer part projected onto a virtual plane normal to a predetermined direction and a region of the radiation shielding filmor() formed integrally with another through conductorin another interlayer part projected onto the virtual plane do not overlap each other. Accordingly, the readout circuits of an integrated circuit device can be protected from radiation, and an increase in parasitic capacitance can be suppressed.

Connection substrate

A radiation detector moduleA includes a scintillator for converting radiation made incident from a predetermined direction to light, a two-dimensional PD arrayfor receiving light from the scintillator, a connection substrateformed by stacking dielectric layersto, and mounted with the two-dimensional PD arrayon one substrate surface thereof, and an integrated circuit devicemounted on the other substrate surface of the connection substrate, and for reading out electrical signals output from the two-dimensional PD array. The integrated circuit devicehas a plurality of unit circuit regionsseparated from each other. The connection substratehas a plurality of through conductorsand a plurality of radiation shielding filmstoformed integrally with each of the plurality of through conductorsand separated from each other. Accordingly, the readout circuits of the integrated circuit device can be protected from radiation with a simple configuration.

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Hamamatsu, Japan

Takashi Tonbe