Toshiba Memory Corporation

Kioxia Corporation

Takashi Terada

Takeo Mori

Hisashi Kato

Takamichi Tsuchiya

Takuto Tanaka

Noriaki Koyama

According to one embodiment, a semiconductor memory device includes: a memory cell array including: a plurality of memory cells stacked above a substrate, and a plurality of word lines respectively coupled to gates of the plurality of memory cells and extending in a first direction; and a first film including a first area above the memory cell array and a second area different from the first area, and having a compressive stress higher than silicon oxide. In the first area, a plurality of first trenches extending in the first direction are aligned in a second direction that intersects the first direction. In the second area, a second trench in a mesh form is provided.

Semiconductor memory device

According to one embodiment, a semiconductor memory device includes: first interconnect layers; second interconnect layers; a first memory pillar extending through the first interconnect layers; a second memory pillar extending through the second interconnect layers; a first film provided above the first interconnect layers, having a planar shape corresponding to the first interconnect layers and extending in the first direction; and a second film provided above the second interconnect layers, separate from the first film in the second direction, having a planar shape corresponding to the second interconnect layers and extending in the first direction. The first and second films have a compressive stress higher than a silicon oxide film.

According to one embodiment, a semiconductor memory device includes a substrate; a first stacked body; a second stacked body being larger in number of stacked layers than the first stacked body, the second stacked body including a plurality of electrode layers separately stacked each other; a third stacked body being smaller in number of stacked layers than the first stacked body. The first stacked body includes a plurality of first layers separately stacked each other, and a plurality of second layers provided between the first layers. The third stacked body includes a third layer including a same material as the material of the first layers, and a fourth layer including a same material as the material of the second layers.

Growing community of inventors

Yokkaichi, Japan

Takashi Terada