Nippon Steel Chemical Co., Ltd.

Otis Elevator Company

Takashi Tanaka

Hisashi Watanabe

Hiroyuki Chinju

Keiji Yoshizawa

Koichi Maeda

Kaoru Okamoto

Seigo Oka

Kazuhiko Motomura

Isamu Takarabe

Masakazu Ii

Yuichi Tokuda

Mitsuru Kohno

Yoshio Tsukahara

Taeko Hayama

Hidenori Nakajima

Soichiro Kawamura

A hinge board having a hinge bending part and a rigid part includes: not less than two flexible wiring boards including a polyimide sheet layer, a conductor layer having a circuit formed on both sides or one side of the polyimide sheet layer, and a coverlay film layer covering the conductor layer; and a bonding material for bonding the flexible wiring boards. At least one of the flexible wiring boards is a flexible double-sided wiring board including the conductor layers on both sides of the polyimide sheet layer. Moreover, the flexible wiring boards are bonded to each other in the rigid part by use of the bonding material in such a manner that a space part is formed between the flexible wiring boards in the hinge bending part.

Hinge board and method for producing the same

An escalator step riser is improved by adding grooves to the cleat surfaces, and, at the same time, a skid-inhibiting function is realized at the rear edge of the step. For escalator step (), cleats () are formed with a pitch twice that of tread () on riser (). On each cleat () of the riser (), one or more grooves () are formed in the longitudinal direction. In addition, skid-inhibiting surface (), made of synthetic resin and having a prescribed width, is attached in a quick connecting/disconnecting manner on the rear edge of step (). A serrated irregular portion () is formed on the upper surface of cleats (), () of the non-slip surface ().

Step for escalator

This invention relates to a process for machining resin film for a wiring board or double-sided carrier tape which comprises forming openings in the resin film by applying a continuous-wave carbon dioxide gas laser beam which is scanned in one or two ways to the resin film or a laminate containing a layer of the resin film placed on a worktable ( ) moving in the direction nearly at a right angle to the scanning direction of the laser beam ( ). As a continuous-wave carbon dioxide gas laser beam is used for drilling holes, the operation is highly efficient and accurate and gives rigid-flex wiring boards or double-sided carrier tapes of good quality in high yield.

Processes for laser beam machining of resin film for wiring boards and manufacture of wiring boards

This invention relates to laminates in which a layer of polyimide precursors and a layer of photosensitive resins are formed one on top of another on an electric conductor such as a stainless steel foil and also to laminates consisting of a stainless steel foil and successive layers of polyimide precursors and photosensitive resins useful for the manufacture of HDD suspensions. In particular, the use of resins containing a repeating unit derivable from specific aromatic diamines and aromatic carboxylic acid dianhydrides as polyimide precursors makes it possible to fabricate an insulator of high fabrication accuracy and reliability on an electric conductor and, in addition, the laminates are useful as materials for the manufacture of HDD suspensions of an integrated circuit/wiring structure with high accuracy.

Laminates

A laminate comprising at least two layers of a photosensitive resin layer and a polyimide precursor resin layer; a process for formation of an insulating protective layer using a laminate which comprises laminating a laminate comprising at least photosensitive resin layer and a polyimide precursor resin layer on an insulating board having an exposed circuit; selectively exposing the photosensitive resin layer to active light; developing the resultant photosensitive resin layer; removing the exposed polyimide precursor resin layer by etching it with an alkaline solution using the photosensitive resin layer as a mask; removing the photosensitive resin layer; and then curing the residual polyimide precusor resin layer; and a process for preparation of a printed circuit which comprises forming a polymide precursor resin layer on an insulating board having an exposed circuit, patterning the resin layer with an alkaline solution, and then curing it. The laminate of this invention can provide extremely easily an insulating protective layer for circuits having a high processing precision and excellent in reliability on insulation. Further, a printed circuit having a high processing precision and excellent in reliability on insulation can be provided extremely easily by the processes of this invention.

Laminate for insulation protection of circuit boards

Growing community of inventors

Chiba, Japan

Takashi Tanaka