Mitsubishi Materials Corporation

Takashi Tamagawa

Kiyotaka Nakaya

Kenji Kubota

Yoshie Tarutani

Kazunari Maki

Shinichi Funaki

Yuki Inoue

Tooru Nishimura

An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 &#x3bc;m and not more than 5.0 &#x3bc;m and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.

Anti-corrosion terminal material, anti-corrosion terminal and electric wire end structure

In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 &#x3bc;m to 5.00 &#x3bc;m and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 &#x3bc;m to 1.00 &#x3bc;m and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.

Terminal material with silver coating film and terminal with silver coating film

A terminal material for connectors, which is obtained by sequentially laminating on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper-tin alloy layer and a tin layer in this order, and: the tin layer has an average thickness of from 0.2 &#x3bc;m to 1.2 &#x3bc;m (inclusive); the copper-tin alloy layer is a compound alloy layer that is mainly composed of CuSn, with some of the copper in the CuSnbeing substituted by nickel, and has an average crystal grain diameter of from 0.2 &#x3bc;m to 1.5 &#x3bc;m (inclusive); a part of the copper-tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 &#x3bc;m to 1.0 &#x3bc;m (inclusive) and an average crystal grain diameter of from 0.01 &#x3bc;m to 0.5 &#x3bc;m (inclusive).

Terminal material for connectors and method for producing same

Providing a tin-plated terminal material with high corrosion-prevention effect and low contact resistance, a terminal formed from the terminal material, and an electric wire terminal-end structure. Provided are a base material made of copper or copper alloy, a zinc layer made of zinc or zinc alloy formed on the base material, and a tin layer made of tin or tin alloy formed on the zinc layer: in a whole of the zinc layer and the tin layer, a tin amount per unit area is 0.30 mg/cmto 7.00 mg/cminclusive, a zinc amount per unit area is 0.07 mg/cmto 2.00 mg/cminclusive, a content percentage of zinc in a vicinity of a surface in the tin layer is 0.2% to 10% by mass inclusive, and a length proportion of low-angle grain boundaries occupied in a total length of crystal boundaries in the tin layer is 2% to 30% inclusive.

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Naka, Japan

Takashi Tamagawa