Matsushita Electric Industrial Co., Ltd.

Matsushita Electronics Corporation

Panasonic Corporation

Takashi Takata

Kenji Maeda

Takao Ochi

Yoshiyuki Arai

Shigeru Nonoyama

Hiroki Naraoka

Hajime Homma

Takeshi Kawabata

Makoto Kojima

Yuichiro Yamada

Masaki Utsumi

Fumito Ito

Masahiro Iidaka

In the manufacture of semiconductor devices, cracking of a resin member caused during cutting and defects in the external appearance are prevented.

Semiconductor device and method of manufacturing the same

Viaspenetrating a circuit substrateor a seal ringare provided on a part or the entire outer periphery of a molding semiconductor deviceor in the cut region of the circuit substrate, so that adhesion between a substrate and a coreC in the circuit substrateis improved. Therefore, it is possible to suppress the exfoliation of the circuit substrate, improving the yields.

Circuit substrate, molding semiconductor device, tray and inspection socket

A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode that is formed near the electronic component mounted on the upper surface of the substrate and that is connected to the electrode, an insulating protrusion that is provided across the upper surface of the external electrode, and a sealing resin that seals the electronic component without covering the external electrode. The upper surface of the external electrode is partitioned by the protrusion into a first area that is located on the sealing resin side and a second area that is located the side opposite to the first area. The adherence of fine particles such as flakes of the sealing resin to the external electrode is suppressed, so that a stable electric connection between the external electrode and the electric equipment can be maintained.

Card-type circuit device

A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Semiconductor device and method for fabricating the same

The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the invention include: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone; and terminals for external connection formed on the top surface of the base. The terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-claimed regions.

Printed wiring board, IC card module using the same, and method for producing IC card module

A semiconductor non-volatile memory device, has plural data storage parts which are connected in series between the source region and drain region. In such a constitution, when integrating the semiconductors, the relative area occupied by the selection gate, separation gate, source region and drain region of the area of the data storage parts may be drastically reduced, and the degree of integration of the semiconductor non-volatile memory device can be dramatically enhanced. The device also allows for setting the semiconductor substrate in a depletion state by sequentially varying the gate potential of the plural data storage parts and transferring the electric charges sequentially. By this transferring of electric charges, data write errors may be prevented.

Growing community of inventors

Shiga, Japan

Takashi Takata