Mitsubishi Denki Kabushiki Kaisha

Takashi Takahama

Hiroyuki Nakajima

Kunito Sakai

Kyoichi Shibayama

Sadamu Matsuda

Fumihiko Sato

Seiji Oka

Michio Futakuchi

Satoru Hayashi

Fumiyuki Miyamoto

Takumi Kikuchi

Akinobu Tamaki

Yasushi Yamamoto

Einosuke Adachi

Mitsuhiro Nonogaki

Toshio Isooka

Kikuo Sakita

Yoshihiro Maruyama

Tutomu Kazama

A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.

Composition of phenolic resin-modified epoxy resin and straight chain

Epoxy resin composition, epoxy resin cured material, and laminated sheet

A resin composition for laminate, which comprises 100 parts by weight of a composition (B), from 0.5 to 10 parts by weight of dicyandiamide and from 1 to 100 parts by weight of a linear polymer, said composition (B) comprising (i) a composition (A) comprising from 20 to 80 parts by weight of a polyfunctional epoxy compound of the formula: ##STR1## wherein R is H or CH.sub.3 and n is an integer of from 0 to 5, and from 80 to 20 parts by weight of an epoxy compound having two epoxy groups in one molecule, and (ii) an aromatic diamino compound incorporated in the composition (A) in such an amount that its active hydrogen is from 0.3 to 0.8 equivalent per equivalent of terminal epoxy groups.

Composition of polyepoxy compounds, linear polymer and aromatic diamine

Printed circuit boards with busbars for providing large current interconnections are disclosed. The printed circuit board 6 has through holes through each of which a cylindrical fixture member 12 having a top nut portion 12b extends to be secured to the board 6 by means of the bottom flange 12p and the radial outward extension 12a formed by a pressing or caulking step. Each one of the leads 4 of circuit elements 3 has a pin-shaped end portion having a male thread 4a formed thereon which engages with the nut portion 12b of a fixture member, wherein the pin-shaped portion 4a of each lead extends through a through hole formed in the busbars 1 so that the busbars 1 are securely held between the fixture members 12 and the stoppers (radial extensions) 4b formed at the base of the pin-shaped portions 4a of the leads 4. Alternatively, the busbars 1 are held between two radial outward extensions 12a and 12A of each one of the fixture member (FIG. 5), or are held together with the board 6 between the flange 12p and the radial extension 12a thereof (FIG. 9). The busbars may be bent and deformed to realize a three-dimensional busbar interconnection pattern (FIG. 10).

Printed circuit board with busbar interconnections

A method of producing a semiconductor device having a light transparent window, includes: a process of die bonding a chip onto a lead frame; a process of attaching a wall surrounding a picture element to either of the external contour surface of the surface of the chip or the light transparent window surrounding the picture element; a process of inserting the chip and the light transparent window into a metal mold in such a manner that an empty closed space is produced between the chip and the light transparent window via the wall; and a process of plastic molding the device except for the light transparent window by filling resin into the metal mold and making the resin hardened.

Method of producing a semiconductor device having a light transparent

A semiconductor device and a method for manufacturing a semiconductor device of a type having a resin package and a window in the package such as a quartz glass window transparent to ultraviolet rays. A semiconductor chip is bonded onto a surface of a die pad of a lead frame. A softened resin is then extruded from the opposite surface of the die pad through gaps between the die pad and the leads with the extrusion being carried out in an inert gas atmosphere. An inner package member is thus formed surrounding the semiconductor chip. An outer package member, made of a thermosetting resin having a weight ratio of resin to filler less than that of the inner package, is molded around the chip assembly and inner package.

Method of resin encapsulating a semiconductor device

A semiconductor device includes an electronic component in a hollow portion provided between two packing members each comprising a laminated structure. A laminated structure has a metallic layer and an insulating layer. The laminated structure can further have a reinforcing layer. One end surface of the laminated structure is an insulating layer. The insulating layers of these laminated structures oppose each other with peripheral portions thereof hermetically connected, so that the hollow portion containing the electronic component is airtight. A metallic layer is formed of a metal such as aluminum or an alloy thereof, an insulating layer is formed of organic material and the like and a reinforcing layer is formed of a fiber, a thermosetting resin, a thermoplastic resin and the like. The electronic component contained in the hollow portion is positioned to avoid contact with the packing members. The electronic component is electrically connected to the exterior through lead wires interposed between the contact surfaces of the two packing members.

Semiconductor device

Semiconductor device and manufacturing method therefor

A process for preparing an insulation wire wherein the wire is dipped into a water dispersion synthetic resin and a resin layer is formed thereon by electrodeposition, and then the wire is immediately treated in a hot water or steam bath to co-melt colloidal particles of the resin in the resin layer, whereby the water in this resin layer is forced to move to the surface so that the water content may be kept at a minimum. The water on the resin layer is removed by blowing air thereacross and a vapor of a film-forming agent is then applied to the wire at high wire running speeds before the resin layer is cured in a heating furnace.

Process for preparing insulation wire

Coated products are prepared by electrodepositing a varnish from a water dispersion onto a conductive substrate; dipping said coated substrate into hot water so that the varnish is treated with said hot water; and thereafter treating said varnish coating with compressed steam. An apparatus for preparing such coated products comprises an electro-deposition vessel, a hot water vessel and a compressed steam treating device for improving the leveling of the coagulated electro-deposited film, whereby a continuous film having desired properties is formed without using an organic solvent.

Apparatus for preparing an electrocoated product

Coated products are prepared by electrodepositing a varnish from a water dispersion onto a conductive substrate; dipping said coated substrate into hot water so that the varnish is treated with said hot water; and thereafter treating said varnish coating with compressed steam.

Growing community of inventors

Amagasaki, Japan

Takashi Takahama