Nsk Corporation

Takashi Sunaga

Noboru Kaneko

Osamu Miyoshi

Ryoichi Suzuki

Takaaki Sekine

Shigeru Shimakawa

Teruyoshi Kogure

Masakazu Morimoto

Takahiro Tsubaki

Tomohiro Miura

Tadayoshi Osakabe

Nobuaki Kogure

Yuri Shimizu

Shigeru Simakawa

An electric drive device and an electric power steering device that reduce temperature increase of a magnetic sensor are provided. The electric drive device includes: an electric motor; an electronic control device including a magnet at an anti-load side end of a shaft to control drive of the electric motor, and a circuit board on the anti-load side of the shaft on an extended line in an axial direction of the shaft; first coil wiring connecting the first coil groups of the electric motor to the circuit board; and second coil wiring connecting the second coil groups of the electric motor to the circuit board. Each of the first and second coil wiring includes a first portion projecting in a direction intersecting the axial direction of the shaft to the outside of the housing, and a second portion projecting outside the housing from the first portion toward the circuit board.

Electric drive device and electric power steering device

An electric power steering apparatus that enables more precise estimation of a coil temperature by considering a heat transfer phenomenon between a control substrate and a poly-phase coil in addition to a heat transfer phenomenon between respective phases of the coil. The apparatus includes a control substrate that controls a poly-phase motor, a temperature sensor that detects a substrate temperature of the control substrate and a coil temperature estimating section that estimates coil temperatures of respective phases of the poly-phase motor by a motor current of the phase and the substrate temperature based on a heat transfer phenomenon between the respective phases that is caused by a difference in temperature between coils of the respective phases and a heat transfer phenomenon between the coil and the control substrate.

Electric power steering apparatus

A terminal connection component including press-fit terminals and terminal metal-fittings. The press-fit terminals have a plate shape in which a taper is disposed at one tip, and the terminal metal-fittings also have a plate shape in which a fitting section is disposed at one end side. The fitting sections of the terminal metal-fittings have a first hole part and a second hole part from the one end in parallel. The tips of the press-fit terminals are press-fitted and are connected to the fitting sections of the terminal metal-fittings, and a portion between the first hole part and the second hole part of the fitting section, which serves as an elastic deformation section, is elastically deformed in a thickness direction of the press-fit terminal and biases the press-fit terminal so that the press-fit terminals are surely press-fitted to the fitting sections of the terminal metal-fittings.

Terminal connection component, and terminal connection structure between control unit using the same and motor

An electronic part mounting heat-dissipating substrate which includes lead frames of wiring pattern shapes formed by conductor plate and an insulating memberwhich is provided between the lead frames, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frameH is used for a large current signal and the thin lead frameL is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.

Electronic part mounting heat-dissipating substrate

Controller of motor for power steering

An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.

An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape.

A power semiconductor module that comprises plural arrangements of power semiconductor elements comprising a power semiconductor bare chip which one electrode portion thereof is connected to a metal plate which at least one external connecting terminal is formed and other external connecting terminals which are electrically connected to other electrode portions of the power semiconductor bare chip, and that are contained in a same package, comprises wherein the power semiconductor elements are basically same outline, electrodes of the bare chip of the power semiconductor elements are mutually connected between the power semiconductor elements with a metal connector or a wiring, and the package is a resin mold package that seals the power semiconductor elements with an electrical insulating resin.

Power semiconductor module and electric power steering apparatus using the same

A resistance welding device is provided with a moving distance measuring section for measuring distances between conductors to be joined before and after joining and evaluating joining quality based on the distances, and a projection including a base and a projecting surface is provided to the conductor to be connected in order to easily secure a distance between the conductors after the joining.

Resistance welding device and resistance welding method

To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.

Semiconductor module

To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module () includes substrate () made of metal, an insulating layer () formed on the substrate (), a plurality of wiring patterns (to) formed on the insulating layer (), a bare-chip transistor () mounted on a wiring pattern () via a solder (); and a metal plate connector () jointing an electrode (S, G) of the bare-chip transistor () and a wiring pattern () via a solder (). The metal plate connector () has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.

A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width Wof the electrode jointing portion in a direction perpendicular to one direction is smaller than the width Wof the substrate jointing portion in the direction perpendicular to the one direction.

A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode.

A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector () includes plural pin-shaped terminals () arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member () configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals () at a predefined pitch.

Multipolar connector

There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.

Growing community of inventors

Tokyo, Japan

Takashi Sunaga