Lintec Corporation

National Institute of Advanced Industrial Science and Technology

Takashi Sugino

Hideo Senoo

Osamu Yamazaki

Yoshitomo Ono

Maki Hironaga

Kazuhiro Takahashi

Kiichiro Kato

Akinori Sato

Yasukazu Nakata

Sou Miyata

Atsushi Hozumi

Tomonori Shinoda

Chihiro Urata

Tomio Hatanaka

Satoshi Kawada

Shunsaku Node

Yutaka Nanashima

Haruya Yamada

Takaji Sumi

Kazumi Ito

An electrically peelable pressure sensitive adhesive composition, which contains an acrylic polymer (A), a (poly)alkylene polyol (B) having a number average molecular weight of no greater than 2000, and an ammonium salt (C), has a high adhesiveness before voltage application, but the adhesiveness can decrease effectively by voltage application for a short time.

Electrically peelable adhesive composition and electrically peelable adhesive sheet, and method for using electrically peelable adhesive sheet

Provided is an antifouling composition including a tetrafunctional silane-based compound (A) having a specified structure, a trifunctional silane-based compound having a specified structure, and at least one metal catalyst (C) selected from the group consisting of a titanium-based catalyst, an aluminum-based catalyst, a tin-based catalyst, and a zinc-based catalyst, the antifouling composition satisfying the following relational expression (1).1.5&#x2264;&#x2264;2+1&#x2003;&#x2003;Expression (1): In the expression, x indicates the carbon number of an alkyl group that is selected for Rin the formula (b) representing the silane-based compound (B) and indicates a number of 4 to 22; and y indicates a blending amount ratio (A)/(B) in a molar ratio of the silane-based compound (A) to the silane-based compound (B).

Anti-fouling composition, and anti-fouling sheet

Provided is an antifouling sheet having an antifouling layer formed of an antifouling layer-forming composition containing a specific tetrafunctional silane compound (A) and a specific trifunctional silane compound (B) wherein the content of the component (B) is 8 to 90 mol % relative to 100 mol % of the component (A), and the antifouling layer is a layer formed by drying and curing a coating film formed of the antifouling layer-forming composition, in an ammonia atmosphere. Also provided is a method for producing the antifouling sheet. The antifouling sheet is provided with an antifouling layer having good surface state and curability, has a large slip acceleration for water droppings, thereby having excellent water repellency that makes water droplets slip off instantly, and has excellent interlayer adhesiveness.

Antifouling sheet and method for producing same

A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder polymer component.

Sheet to form a protective film for chips

A process for producing semiconductor chips having a protective film on the back surface includes the steps of: providing a sheet to form the protective film having a release sheet and a protective film-forming layer formed on a detachable surface of the release sheet, wherein the protective film-forming layer includes a thermosetting component, an energy ray-curable component and a binder polymer component; adhering a protective film-forming layer of the sheet to form the protective film onto a back surface of a semiconductor wafer having circuits on its surface; curing the protective film-forming layer by irradiation with an energy ray, and thereafter, further conducting the additional steps of (in any order): detaching the release sheet from the protective film-forming layer; further curing the protective film-forming layer by heating; and dicing the semiconductor wafer together with the protective film-forming layer with respect to each circuit.

Process for producing semiconductor chips having a protective film on the back surface

A process for producing a resin-sealed semiconductor device having high reliability which is produced more easily and efficiently without voids, the process comprising the steps of: (a) providing a semiconductor wafer having circuits on a surface; (b) applying a resin sheet composed of a support and an adhesive resin layer releasable from the support, on the circuit surface of the semiconductor wafer, and fixing an outer periphery of the resin sheet with a ring frame; (c) cutting the semiconductor wafer and the resin layer by each circuit to form chips; (d) picking up each chip together with the resin layer from the support; (e) mounting each chip on a predetermined position of a chip mounting substrate through the resin layer; and (f) firmly bonding the chip on the chip mounting substrate so as to achieve conduction between the chip and the chip mounting substrate.

Process for producing a semiconductor device

An adhesive tape comprising a base and, superimposed thereon, an adhesive layer, this adhesive layer comprising an adherent component (A), an epoxy resin (B), a thermally active latent epoxy resin curing agent (C), an energy radiation polymerizable compound (D) and a photopolymerization initiator (E), wherein either or both of the epoxy resin (B) and energy radiation polymerizable compound (D) have a dicyclopentadiene skeleton in its molecule or molecules thereof. The resultant adhesive tape has an adhesive layer which provides reduced water absorption of an adhesive curing product and which enables a lowering of the elastic modulus thereof during thermocompression bonding.

Adhesive tape

There is disclosed a process for producing a resin-sealed type electronic device which comprises forming a dam frame on edge and side portions of a substrate loaded with a single or a plurality of electronic elements so as to encompass the electronic elements by sticking down a pressure sensitive adhesive sheet to the substrate, pouring a resin for sealing in the inside of the dam frame, and heat-curing the poured resin. The process dispenses with an intricate production step or a long time in forming the dam frame, thus enabling forming of the same with a minimized number of production steps and in the shortest amount of time possible.

Process for producing resin-sealed type electronic device

The present invention provides a sheet to form a protective film for chips, which can be readily formed into a highly uniform protective film on a back surface of chip, and which, even if minute scratches are formed on the back surface of chip as a result of mechanical grinding, can eliminate adverse effects resulting from the scratches. The sheet to form a protective film for chips of the present invention comprises a release sheet and a protective film forming layer formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting or energy ray-curable component and a binder polymer component.

Process for producing semiconductor chips

A process for producing a semiconductor device, including the steps of forming grooves of a cut depth smaller than the thickness of a wafer; sticking a surface protective sheet onto the wafer surface; grinding the back of the wafer to divide the wafer into individual chips; adhering a dicing/die bond sheet onto the back of the wafer; peeling the surface protective sheet from the wafer surface to thereby expose the adhesive layer of the dicing/die bond sheet through each space between individual chips; cutting the dicing/die bond sheet; detaching the individual chips from the base of the dicing/die bond sheet; and bonding the individual chips through the adhesive layer of the dicing/die bond sheet to a given substrate.

Process for producing semiconductor device

A process for producing a semiconductor device comprising the steps of providing a wafer having a surface furnished with semiconductor circuits and a back; forming grooves of a depth smaller than the thickness of the wafer, said grooves extending from the wafer circuit surface; sticking a surface protective sheet onto the wafer circuit surface; grinding the back of the wafer so that the thickness of the wafer is reduced, resulting in division of the wafer into individual chips with spaces therebetween; sticking a pressure sensitive adhesive sheet onto the ground back of the wafer, pressure sensitive adhesive sheet comprising a base and, superimposed thereon, an energy radiation curable pressure sensitive adhesive layer; exposing the energy radiation curable pressure sensitive adhesive layer to an energy radiation; and peeling the surface protective sheet from the wafer circuit surface.

An adhesive composition comprising a pressure sensitive adhesive component (A), a thermosetting adhesive component (B) and a compound (C) obtained by addition/condensation reaction of a polysiloxane oligomer with a silane coupling agent. This composition is excellent in storage stability and can bond metals, etc. with large bonding strength. Further, sheeting thereof enables simplifying bonding steps.

Adhesive composition and adhesive sheet

An adhesive sheet for wafer setting, comprising a wafer setting part composed of an expansible film and an adhesive layer for wafer setting and a marginal part outside the wafer setting part,

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Kawaguchi, Japan

Takashi Sugino