Fuji Photo Film Company, Limited

Showa Denko K.k.

Nec Corporation

Fujifilm Corporation

Sony Corporation

Showa Denko Kabushiki Kaisha

Kabushiki Kaisha Bandai

Showda Denko K.k.

Nikkan Industries Co., Ltd.

Mitsubishi Heavy Industries Limited

Takashi Shoji

Takekazu Sakai

Hideo Watanabe

Satoshi Noda

Masataka Watabe

Takeo Kuramoto

Yasunori Ohta

Naoto Iwakiri

Masaaki Konno

Naoyuki Nishino

Atsushi Suzuki

Yutaka Yoshida

Toshitaka Agano

Tsutomu Kimura

Keiji Tsubota

Hayato Wakabayashi

Naoki Kawazu

Hiroyuki Watanabe

Yuji Ohara

Toru Itakura

Shumpeita Torii

Takumi Oka

Noboru Arai

Kiyoshi Kondou

Kazuhiro Sato

Kazuo Hakamata

Yoshiaki Sakamoto

Takeshi Asano

Futoshi Yoshida

Masahiro Komatsu

Yoshiaki Takeuchi

Norihiro Nikai

Nobutaka Shimamura

Kenji Tajima

Yoshinori Shibuya

Hitoshi Amita

Masakazu Murase

Tohru Kikawada

Masakazu Nakajo

Tadatoshi Kurozumi

Hiroshi Kushima

Shigenori Tsuruga

Takenori Tomita

Yuuki Yamagata

Motoaki Takahashi

Tomoya Oikawa

Hiroshi Horikawa

Tatsuyuki Nishimiya

Nobuki Oka

Toshiki Kainuma

Yuji Kurachi

Tetsuo Kubota

Masashi Akamatsu

Ayako Nishioka

Yoshio Kudo

Isamu Taguchi

Ryoichi Yoshimura

Daigo Ezuka

Shoji Harada

Noriyuki Shimizu

Hisao Seto

Naoaki Oishi

Shunsuke Nagasaki

Noriko Murase

Tadanori Kawamura

Kenichi Yamagishi

Kenji Ochiai

Shinsaku Dobashi

Tetsuya Usui

The present technology relates to an image pickup element, a control method, and an image pickup device which realize easier and more diversified data output. In one aspect of the present technology, a plurality of signal lines for transmitting a pixel signal read from a pixel is allocated to each column, and different reading modes of the pixel signals are respectively allocated to the signal lines of each column. Regarding each column of the pixel array connected to the pixel corresponding to the mode, the pixel signal is read from the pixel connected to the signal line corresponding to the reading mode of the pixel signal in the mode, and the read pixel signal is transmitted via the signal line. The present technology is applied to, for example, an image pickup element and an image pickup device.

Image pickup element, control method, and image pickup device

The present invention has been made in consideration of the above-described situation, and provides a method of producing a circuit board that can bond a component to be mounted without slanting the component, and simplify the steps. The method of producing a circuit board includes forming a first adhesive layer by applying a first adhesiveness-imparting compound on the surface of terminal portions of a circuit board; attaching a core body on the first adhesive layer of the terminal portions; forming a second adhesive layer by applying a second adhesiveness-imparting compound on the surface of the core body; attaching first solder particles on the second adhesive layer of the surface of the core body; and forming a solder layer on the surface of the core body by melting the first solder particles.

Method of producing circuit board

Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container.

Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board

Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.

Disclosed herein is a solid-state imaging device including: a plurality of common pixel sections arranged in a matrix form so that pixel signals of a plurality of photoelectric conversion elements arranged in the same row can be output; a plurality of row address lines used to select some of the photoelectric conversion elements in each row; and a scan section that allows for the pixel signals of the plurality of photoelectric conversion elements to be output through addressing adapted to select the plurality of row address lines one at a time in sequence, in which the plurality of row address lines are connected to the plurality of photoelectric conversion elements arranged in the same row in each of the common pixel sections so that the scan section can individually select the plurality of photoelectric conversion elements arranged in the same row in each of the common pixel sections during addressing.

Solid-state imaging device and imaging device

There is provided a radiographic imaging device including: a radiation detector; a switching power supply; a storage section; a reading section; and a control section that controls the switching power supply so as to implement switching control and cause electricity to be accumulated in the storage section at a time when charge is not being read by the reading section, and stop switching control at a time when charge is being read by the reading section.

Radiographic imaging device

A portable radiographic imaging device includes an operation unit, a controller, and an execution unit. The operation unit is operated when a target function is selected from plural different functions relating to radiographic image capturing. When a first condition, that expresses that a predetermined region has been placed at a predetermined placement portion, is established, the controller carries out control such that a function that should be effective when the first condition is established is selected. When a second condition, that expresses that the predetermined region is not placed at the placement portion, is established, the controller carries out control such that a function that should be effective when the second condition is established is selected. When the operation unit is operated, the execution unit executes a function that is controlled by the controller to be selected.

Portable radiographic imaging device and radiographic imaging system

A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the printed wiring board so as to melt the solder to thereby form a solder circuit. The solder powder is placed in a vessel. The printed wiring board having the electrode whose surface has been imparted with tackiness is placed in the vessel. The vessel is tilted to thereby deposit the solder powder on the tackiness-imparted area.

Production method of solder circuit board

A radiation image signal output control method in which distance information that indicates a distance between a radiation image detection cassette and a receiving unit is obtained by a distance information obtaining means, and wireless signals are controlled by an output control means to be outputted from the radiation image detection cassette if the distance indicated by the distance information obtained by the distance information obtaining means is less than or equal to a predetermined value, and not to be outputted therefrom if the distance is greater than the predetermined value.

Radiation image signal output control method and apparatus

A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.

Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board

A method for the deposition of a soldering powder to an electronic circuit board includes the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering powder to the resultant sticking part in a liquid body. The method can further include the steps of heating the substrate, thereby fusing the soldering powder, and forming a solder circuit.

Method for production of electronic circuit board

A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the printed wiring board to melt the solder to form a solder circuit. The characteristic feature of this method is that the tackiness-imparted printed wiring board is kept in a liquid, etc at not more than 10&#xb0; C. before attaching the solder powder.

Method of producing conductive circuit board

A radiation detector includes a substrate, a lower electrode disposed on the substrate, a radiation detecting layer formed on the upper surface of the lower electrode, an upper electrode formed on the upper surface of the radiation detecting layer, a protection layer which is formed on the upper electrode, whose end portion extends to an end surface of the substrate and which covers the upper electrode, and a reinforcement member which is formed from the lower surface of the substrate to the surface of the protection layer and which covers the end portion of the protection layer.

Radiation detector

High frequency offset component information is previously acquired from a solid-state radiation detector. Low frequency offset component information is acquired from the solid-state radiation detector before an operation for recording image information on the solid-state radiation detector is performed. The image signal, which has been outputted from the solid-state radiation detector having been subjected to the operation for recording the image information, is corrected in accordance with offset information, which is constituted of the high frequency offset component information and the low frequency offset component information. The image signal is thus capable of being corrected quickly and accurately such that offset components are removed from the image signal.

Radiation image information detecting method and apparatus

Growing community of inventors

Kaisei-machi, Japan

Takashi Shoji