Fujitsu Corporation

Takashi Shiotani

Akio Maeda

Yasuki Sakurai

Michiharu Itou

Toshiya Kishida

Sadayuki Miyata

Yasuhiro Ichihara

Fumitake Suzuki

Keizo Sakamoto

Jun Ojima

A manufacturing method for an optical waveguide device. The manufacturing method includes the steps of forming an optical waveguide in a substrate having an electro-optic effect, forming an SiOfilm on the substrate, forming Si films on the SiOfilm, the lower surface of the substrate, and at least a part of the side surface of the substrate to thereby make a conduction between the Si film formed on the SiOfilm and the Si film formed on the lower surface of the substrate. The manufacturing method further includes the steps of applying a photoresist to the Si film formed on the SiOfilm, patterning the photoresist so that a portion of the photoresist corresponding to the optical waveguide is left, forming a groove on the substrate along the optical waveguide by reactive ion etching, and removing the photoresist and the Si films.

Optical waveguide device and manufacturing method therefor

A manufacturing method for a planar lightwave circuit device. A lift-off mask layer is formed on a planar lightwave circuit composed of cores and a cladding. The lift-off mask layer is next exposed to light by using a mask having a plurality of first patterns respectively corresponding to the cores and a plurality of second patterns each formed on at least one side of each first pattern in spaced relationship therewith. A wiring pattern material layer is next deposited on the lift-off mask layer exposed above, and the lift-off mask layer is next stripped off to thereby form a plurality of real patterns respectively corresponding to the first patterns and a plurality of dummy patterns respectively corresponding to the second patterns, from the wiring pattern material layer.

Planar lightwave circuit device and manufacturing method therefor

A laser diode module including a laser diode assembly having a laser diode and a holder, a lens-fiber assembly having a lens and an optical fiber fixed in a given positional relationship, and a sleeve. The lens-fiber assembly includes a casing having a first hole and a second hole offset from the first hole. The lens is inserted and fixed in the first hole, and a ferrule in which the optical fiber is embedded is press-fitted with the second hole. The ferrule has a slant polished first end and a second end projecting from an end surface of the casing by a given distance. The lens and the ferrule are fixed in the casing so that a given distance is defined between the lens and the first end of the ferrule.

Laser diode module and assembling method therefor

A receptacle type optical module including a lead frame having a plurality of leads, an L-shaped block mounted on the lead frame and having a through hole, a ferrule inserted and fixed in the through hole of the L-shaped block and having an optical fiber, a carrier mounted on the L-shaped block and having a wiring pattern, and an optical element mounted on the carrier. The optical module further includes a GRIN lens fixed to an end face of the ferrule and having a spherical end face adjacent to the optical element, a transparent resin for sealing an optical coupling portion between the optical element and the GRIN lens, and a resin molded package for encapsulating all of the lead frame, the L-shaped block, the ferrule, the carrier, and the optical element except a part of the lead frame and a part of the ferrule.

Receptacle type optical module and production method therefor

A silicon base optical waveguide manufacturing method including the steps of preparing a silicon wafer having a plurality of embedded optical waveguides, performing first-stage dicing of the silicon wafer to form a cut groove by using a first resin diamond blade having a thickness t , and performing second-stage dicing of the silicon wafer along the cut groove to polish an end face of each optical waveguide by using a second resin diamond blade having a thickness t greater than the thickness t . The second resin diamond blade includes diamond abrasive grains having a grain diameter of 2 &mgr;m or less, and the relation between the thicknesses t and t is set to t &plus;0.01 mm&lE;t &lE;t &plus;0.05 mm.

Resin diamond blade and optical waveguide manufacturing method using the blade

An optical multiplexer/demultiplexer module including a first ferrule assembly having a first sleeve and a first ferrule inserted and fixed in the first sleeve, the first ferrule having first and second optical fibers; a first element fixed to the first ferrule assembly, the first element having a first lens and a bandpass filter; and a second element fixed to the first element, the second element having a wedge plate for optical path correction, the wedge plate being formed of glass. The optical multiplexer/demultiplexer module further includes a third element fixed to the second element, the third element having a second lens; and a second ferrule assembly fixed to the third element, the second ferrule assembly having a second sleeve and a second ferrule inserted and fixed in the second sleeve, the second ferrule having a third optical fiber.

Optical multiplexer/demultiplexer module and production method therefor

An optical module receives light traveling through an optical fiber in two ways. A coupler is provided in a case member and is attached to an end surface of a ferule having the optical fiber. The coupler allows light of a first wavelength to pass therethrough along a first optical axis of the optical fiber and reflects light of a second wavelength so that reflected light travels along a second optical axis perpendicular to the first optical axis. A light emitting element is provided so as to be located on one of the first and second optical axes. A light receiving element is provided so as to be located on the other one of the first and second optical axes.

Growing community of inventors

Kawasaki, Japan

Takashi Shiotani