Sekisui Chemical Co., Ltd.

Sekisui Kagaku Kogyo Kabushiki Kaisha

Takashi Shinjo

Kohei Takeda

Sayaka Wakioka

Yuta Oatari

Masami Shindo

Takeshi Miyake

Tsuyoshi Hasegawa

Kenji Tsubota

Kenji Yamauchi

Yuko Kawahara

Takeshi Nakachi

Takayuki Oka

Tatsushi Hayashi

Hiroaki Takehara

Susumu Baba

Takeo Kuroda

Motoi Nagano

Masanori Matsuda

Mitsue Matsumoto

A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board

An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent

The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200&#xb0; C. for 100 hours having an adhesive force to polyimide of at least 0.8 times the initial adhesive force.

Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit board

It is an object to provide a photoreactive hot-melt adhesive composition which exhibits high adhesive strength immediately after combination of adherends and excellent bond strength after completion of curing and provides a highly durable bonded laminate. A photoreactive hot-melt adhesive composition containing:

Photoreactive hot-melt adhesive composition

Hot melt adhesive of cationic polymerizable compound, photoinitiator and phthalate diester

A toner resin composition characterized as containing a vinyl copolymer prepared principally from a styrene monomer and a (meth)acrylic ester monomer and showing peaks at least in the molecular weight range of 5,000-20,000 and in the molecular weight range of not below 500,000 when its molecular weight distribution is determined by gel permeation chromatography, 2-10% by weight of Fischer-Tropsch wax, and 0.5-5% by weight of styrenic block copolymer; and a toner incorporating the toner resin composition.

Toner resin composition and toner

Process for preparing solvent-type acrylic pressure-sensitive adhesives

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Osaka, Japan

Takashi Shinjo