Ricoh Company, Ltd.

Takashi Seigenji

Keiichi Yoshioka

Toshikazu Yoshimizu

Koichi Fujii

Hideo Azumai

Kenji Fujita

A thermal transfer printing apparatus that comprises a thermal head, an ink transfer medium having an ink layer, a printing medium to which the ink is to be transferred, a platen for pressing the ink transfer medium together with the printing medium against the thermal head. The thermal head comprises a substrate, a plurality of heating elements disposed on a surface of the substrate close to an end of the substrate and two electrode lines connected to each of the plurality of heating elements and formed on the substrate. Each line extends from each heating element toward a direction opposite to the substrate end with respect to the heating elements. The apparatus further comprises a pulling out unit for separating and pulling out the ink transer medium from the printing medium after passing over a position of the heating elements and a direction change mechanism for changing direction of the ink transfer medium pulled out by the pulling out unit with respect to the surface of the substrate.

Thermal transfer printing apparatus with movable ink transfer pulling

A thermal head of an end-heating type for use in printers or facsmiles comprises a non-conductive substrate having upper and under plain side surfaces and front end face and mounted at the under plain said surfaces thereof on a support member. The front end face of the substrate extending between the upper and under plain side surfaces is adapted to be held in sliding contact with a recording medium such as thermo-sensitive sheet or ink transfer sheet. A plurality of spaced heat-generating resistors for forming heat-generating dots are provided on the upper plain surface of the substrate and arranged along the front end face of the substrate. Each of the heat-generating resistors has a front end which extends closely adjacent to the front end face of the substrate. Electrodes for feeding electricity to the heat-generating resistors are also provided on the upper plain side surface of the substrate. The heat-generating resistors and electrodes can be easily formed only on the upper plain side surface of the substrate by an ordinary film formation process.

Thermal head

A selectively definable semiconductor device is provided. In one form, a composite gate array includes a plurality of logic dedicated general purpose cell regions and a plurality of function dedicated cell regions each of which is disposed between the two corresponding ones of the plurality of logic dedicated general purpose cell regions, whereby each of the cell regions may be used as an interconnection region selectively. In another form, a semiconductor memory device which may be selectively defined as a ROM or a RAM by a metalization process is provided.

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Minoo, Japan

Takashi Seigenji