Shinko Electric Industries Co., Ltd.

Seiko Epson Corporation

Hon Hai Precision Industry Co., Ltd.

Seiko Epson Corporaion

Takashi Sato

Tomoyuki Shimodaira

Yoshihisa Kanbe

Takashi Kasuga

Masahiro Isono

Kazuhisa Takeda

Seiji Tezuka

Hitoshi Kondo

Masatomo Kanamitsu

Satoshi Kaneta

Yoshitsugu Koseki

Kenjiro Ishihara

Hikaru Tanaka

Guan-Fu Huang

Midori Araya

Yasuyuki Yamaguchi

Keisuke Haba

Hajime Wada

Naruhiko Katagiri

Ruofan Tang

Hikaru Kobayashi

Naotaka Noguchi

A built-in component board includes a first insulating layer; wiring layer and a metal pad layer that are formed on the first insulating layer; a second insulating layer that is formed on the wiring layer and the metal pad layer; and a cavity that is formed on the second insulating layer and that exposes the metal pad layer. Furthermore, the built-in component board includes an electronic component that is mounted on the metal pad layer; and a filling layer that is filled in the cavity and that buries the electronic component. Furthermore, a metal used for the metal pad layer includes a metal having thermal conductivity that is lower than that of a metal used for the wiring layer.

Built-in component board, method of manufacturing the built-in component board

A wiring board includes: a wiring layer; an insulating layer laminated on the wiring layer; an opening portion penetrating through the insulating layer to the wiring layer; a recess portion formed in a surface of the wiring layer exposed from the opening portion of the insulating layer; and a conductor film formed in the opening portion of the insulating layer and the recess portion of the wiring layer, wherein the recess portion of the wiring layer includes a raised portion, which is raised higher than an outer peripheral portion of a bottom surface, at a central portion of the bottom surface.

Wiring board and manufacturing method of wiring board

An insulating layer containing fillers is formed to cover a first wiring layer. An opening portion, in which the first wiring layer is exposed, is formed in the insulating layer. A first alkali treatment, an ultrasonic cleaning treatment, and a second alkali treatment are sequentially performed on an upper surface of the insulating layer, on an inner wall surface of the opening portion, and an upper surface of the first wiring layer exposed in the opening portion. A second wiring layer electrically connected to the first wiring layer is formed by filling the opening portion by plating. The second wiring layer extends from an inside of the opening portion to the upper surface of the insulating layer.

Wiring substrate and manufacturing method thereof

A wiring substrate includes wiring layers and insulation layers alternately stacked. Via holes are formed in the insulation layers. First via wirings are formed in the via holes to electrically connect the wiring layers to one another. Through holes extend through a lowermost one of the insulation layers in a thickness direction. The lowermost insulation layer covers a lowermost one of the wiring layers. Second via wirings are formed in the through holes to define an identification mark that is identifiable as a specific shape including a character, a symbol, or a combination thereof. A lower surface of each of the second via wirings is exposed from a lower surface of the lowermost insulation layer and is flush with a lower surface of the lowermost wiring layer.

Wiring substrate and semiconductor device

A liquid ejecting head is operable to move in a first direction. A platen is opposed to the liquid ejecting head to support an object to which a liquid droplet is ejected from the liquid ejecting head and to define a gap between the liquid ejecting head and the object. The platen is formed with a groove hole to which a liquid droplet deviated from an edge of the object is disposed, and through holes formed in a bottom portion of the groove hole and arranged in the first direction. A tray member is arranged below the platen to receive liquid dropped through the through holes. A first liquid absorber is provided in the groove hole. A second liquid absorber is provided in the tray member. At least one liquid leading member extends through at least one of the through holes to lead liquid absorbed by the first liquid absorber to the second liquid absorber.

Waste liquid treating device and liquid ejecting apparatus incorporating the same

An electrical connector comprises an insulative housing having a pair of side walls upwardly extending from a base thereof, and a plurality of terminals insert molded within the housing. Each terminal comprises an end portion engaging with the corresponding side wall, a straight contact portion exposed on an inner side of the corresponding side wall, a retention portion embedded in the housing, and a solder tail outwardly extending from the housing. A method is disclosed to make the electrical connector described above.

Electrical connector and method for making the same

An active element on an insulating substrate of an electro-optical display device includes a layer of ferroelectric material as an active layer between two electrodes for each pixel in the display. The active device includes a first electrode formed on an insulating substrate, the ferroelectric layer covering the first electrode and the insulating substrate, and the second electrode disposed on the ferroelectric layer for overlapping a portion of the first electrode with the ferroelectric material therebetween. Preferably, the ferroelectric material is an organic ferroelectric material.

Driving method of active matrix display having ferroelectric layer as

Growing community of inventors

Nagano, Japan

Takashi Sato