Matsushita Electric Industrial Co., Ltd.

Takashi Sasaki

Hiroyuki Miyake

Yuzuru Inaba

Ken Takahashi

Takao Naito

Naoichi Chikahisa

Hitoshi Nakahira

Akira Iizuka

Toshiyuki Kinou

Osamu Ikeda

Eiichiro Terayama

Nobuyasu Nagafuku

Masaru Nonomura

Toshihiro Abe

Kuniyo Matsumoto

Naoithi Thikahisa

The quantity of supply heat of heated gas is controlled so that a supply heat quantity of the heated gas when no heat treatment of solder or the like is needed is made smaller than a supply heat quantity of the heated gas when heat treatment of solder or the like is needed, reducing consumption power when no heat treatment is needed for a board.

Heating device and heating method

The object of the present invention is to provide an apparatus and a method for applying a viscous fluid whereby a constant application diameter is achieved through a simple operation without a Tact loss while a surface of a member to be applied can be less damaged. An adhesive application member ( ) having a screw portion ( ) inserted therein is rotated by a rotating device ( ), so that a nozzle stopper ( ) of the adhesive application member is prevented from interfering with a wiring pattern on a face of a circuit board. Moreover, the screw portion is rotated synchronously as well when the adhesive application member is rotated, thereby preventing the adhesive from being discharged out from the nozzle in consequence to the rotation of the adhesive application member. An application diameter can hence be uniformed. The rotation of the screw portion is controlled in accordance with a viscosity of the adhesive, thus achieving the application in a required application diameter through a simple operation.

Apparatus and method for applying viscous fluid

An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each tables and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

Method and apparatus for application of adhesive

A method and apparatus for applying an electronic component adhesive with a minimum length of time for setting a proper application condition. Variation of application shapes of each type of the adhesive is monitored under various different application conditions and its resultant data is saved. When a desired application shape is inputted, the application nozzles are automatically controlled to apply desired doses of the adhesive under an optimum application condition which is defined by retrieving the data previously stored. Also, various different application shapes for bonding respective electronic components may be determined and saved in advance, so that a proper application condition can be automatically determined by retrieving the data on the application shapes when a desired electronic component is selected.

Method and apparatus for applying an electronic component adhesive

An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each table, and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

A screen printing machine in which a squeegee is driven to form a film of solder on a board through a screen, includes an automatic squeegeeing angle setter which includes a squeegeeing angle adjuster for adjusting a squeegeeing angle of the squeegee and a squeegeeing angle detector for detecting the angle thereof to set the squeegeeing angle of the squeegee by the squeegeeing angle adjuster based on a detection of the squeegeeing angle detector, an automatic pressing amount setter which includes a squeegee pressing amount adjuster for adjusting a squeegee pressing amount caused by the squeegee and a squeegee pressing force detector for detecting a squeegee pressing force to set the pressing amount in consideration of a change in height resulting from a change of the angle of the squeegee by the squeegee pressing amount adjuster based on a detection of the squeegee pressing force detector, and an automatic balancing amount setter which includes a pressing amount balance adjuster for adjusting a balance of the pressing amount of the squeegee to set the balance of the pressing amount of the squeegee by the pressing amount balance adjuster based on a detection of the pressing force detector.

Automatic squeegee angle and pressure adjusting means

A screen printing apparatus includes a stage for positioning a substrate thereto, a screen plate positioned above the stage, a squeegee, positioned above the screen plate, for printing material to be printed on the substrate, an adjusting means for adjusting a movement range of the squeegee with respect to the substrate, a surface state-recognizing means for recognizing a surface state of the screen plate after the material is printed on the substrate, and a control means for processing information obtained by the surface-recognizing means and operating the adjusting means so as to adjust the movement range of the squeegee to the substrate.

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Yamanashi, Japan

Takashi Sasaki