Panasonic Intellectual Property Management Co., Ltd.

Takashi Sagara

Hiroaki Fujiwara

Yuki Kitai

Hirosuke Saito

Tatsuya Arisawa

Keiko Kashihara

Akira Irifune

Hidetaka Kakiuchi

Daisuke Yokoyama

Takayuki Nakashima

Kazuei Endou

Shohei Hanazaki

Mao Yamaguchi

Lin Lin

Syunji Araki

An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25&#xb0; C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70&#xb0; C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board

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Fukushima, Japan

Takashi Sagara