Tdk Corporation

Nec Corporation

Japan Aviation Electronics Industry, Limited

Takashi Ohtsuka

Yuichiro Okuyama

Kenichi Yoshida

Takeshi Oohashi

Kazuhiro Yoshikawa

Hajime Kuwajima

Hideyuki Ono

Hikaru Kouta

Hisaya Takahashi

Tomoya Hanai

Yuichi Koreeda

Daisuke Kawasaki

Hitoshi Yamaguchi

Kyung-Ku Choi

Tatsuo Namikawa

Mikio Oda

Isao Kanada

Yoshihiro Shinkai

Yusuke Ariake

Kaichiro Nakano

Jun Sakai

Noboru Yoshida

Takuya Hasegawa

Tomonaga Nishikawa

Shinya Sudo

Suguru Tamai

Shinichiro Toda

Manabu Yamatani

Tomotaka Ishida

Arihide Noda

Yusuke Oba

Wataru Ohtsu

Daiki Kusunoki

Yu Fukae

An electronic component includes: a conductive pattern provided on the main surface of a substrate and constituting a lower electrode; a dielectric film that covers top and side surfaces of the conductive pattern; and a conductive pattern stacked on the top surface of the conductive pattern through the dielectric film and constituting an upper electrode. A part of the dielectric film that is parallel to the main surface of the substrate is removed at least partly. Partially removing a part of the dielectric film that is parallel to the main surface of the substrate allows stress relaxation. This prevents peeling at the interface between the lower electrode and the dielectric film.

Electronic component having the dielectric film not covers a corner part of the lower electrode

Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.

Electronic component configured to relax internal stresses due to changes in temperature and manufacturing method of the same

Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.

Electronic component and manufacturing method therefor

Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

Electronic component and its manufacturing method

An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.

LC composite component

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

Provided is a lithium ion secondary battery having high energy density and excellent cycle characteristics. The present invention relates to a negative electrode for a lithium ion secondary battery comprising: (i) a negative electrode mixture layer comprising a negative electrode active material and a negative electrode binder and (ii) a negative electrode current collector, wherein the negative electrode active material comprises an alloy comprising silicon (Si alloy), the Si alloy is crystalline and has a median diameter (D50 particle size) of 1.2 &#x3bc;m or less, and an amount of the negative electrode binder based on the weight of the negative electrode mixture layer is 12% by weight or more and 50% by weight or less.

Negative electrode for lithium ion secondary battery and lithium ion secondary battery comprising the same

Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

Electronic component

An LC composite component includes a non-magnetic substrate, a magnetic layer with magnetism, capacitors, inductors, and core parts with magnetism. The non-magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the non-magnetic substrate. The inductors and the capacitors are disposed between the first surface of the non-magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the non-magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core parts is 1.0 or more times the thickness of the magnetic layer in a direction perpendicular to the first surface of the non-magnetic substrate, and each of the magnetic layer and the core parts contains magnetic metal particles and resin.

A negative electrode active material constituting a lithium ion secondary battery having high energy density and excellent cycle characteristics, and a negative electrode and a lithium ion secondary battery comprising the same are provided. The present invention relates to a negative electrode active material comprising graphite particles and crystalline silicon particles, wherein a median diameter of the crystalline silicon particles is 0.7 &#x3bc;m or less, and a weight ratio of the crystalline silicon particles to the total weight of the graphite particles and the crystalline silicon particles is 1 wt % or more and 25 wt % or less.

Negative electrode active material and lithium ion secondary battery using the same

Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.

Multilayer wiring structure and its manufacturing method

In a photoelectric conversion/connection device () including an optical element (), a mounting board () on which the optical element is mounted, and an optical connector () which is connected to the mounting board so as to be optically connected to the optical element, the optical connector () is arranged on a surface () opposite to a mounting surface () of the mounting board () and the optical element () is exposed. The photoelectric conversion/connection device () includes a motherboard () having a main surface () and an electric connector () to be mounted on the main surface of the motherboard. The electric connector () is detachably connected to the mounting board ().

Photoelectric conversion/connection device

The invention provides an electronic component and a manufacturing method thereof that can achieve an improved adhesion strength when the electronic component is solder-mounted onto an external substrate and can thereby obtain considerably improved electric properties and reliabilities, etc. An electronic component, which is a capacitor, has: a circuit elementformed on a substrate; an electrode layerconnected to the circuit element; passivation layersandthat cover the electrode layer; and terminal electrodesandconnected to the electrode layervia via-conductors Va and Vb formed through the passivation layersand, the terminal electrodesandbeing formed to cover the side wall of the passivation layersand. Since the pad electrodesandare formed so as to cover the passivation layersandacross their uppermost surfaces and side walls, the area of contact between the pad electrodesandand the solder for solder-mounting increases, and the capacitorcan consequently exhibit an improved adhesion strength.

Electronic component and manufacturing method thereof

Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules () are arranged on a periphery of an LSI () electrically connected to an electric wiring board (), and liquid cooling mechanisms () are respectively placed on the LSI () and the optical modules (). The plurality of optical modules () may be arranged only on a surface of the electric wiring board () where the LSI () is mounted, only on a surface opposite to the surface where the LSI () is mounted, or on both the same surface as and the opposite surface to the surface where the LSI () is mounted.

Optical interconnection device

The invention provides an electronic component and a manufacturing method thereof that: can allow electronic components to be mounted on an external substrate at a higher density than before; can adjust the height (level) of a terminal electrode as required and desired, thereby solving problems that would occur in the inspection of the conventional electronic components; and can also improve the yield in the mounting of electronic components, thereby achieving increased productivity. A capacitor, which is an electronic component, has: a first upper electrodeformed above a substrate; a first seatand a second seatwhich are formed adjacent to the first upper electrode; passivation layersandthat cover the first upper electrodeand the first and second seatsand; and a terminal electrodeformed above the first and second seatsandand connected to the first upper electrodevia via-conductors Va and Vc which are formed through the passivation layersandrespectively.

Growing community of inventors

Tokyo, Japan

Takashi Ohtsuka