Elpida Memory, Inc.

Longitude Licensing Limited

Takashi Ohba

Yoshihiro Sato

Youkou Ito

A semiconductor device comprises the following: a wiring substrate having on one side a recessed section and a plurality of connection pads; a first semiconductor chip mounted in the recessed section; a second semiconductor chip that has a plurality of electrode pads on the surface of at least one end section (in this case, both ends) and that is laminated onto the first semiconductor chip so that at least one end section (in this case, both ends) protrudes from the first semiconductor chip; a plurality of wires that mutually and electrically connect the plurality of connection pads of the wiring substrate and the plurality of electrode pads of the second semiconductor chip. One end section of the second semiconductor chip extends beyond the inner surface of the recessed section and is supported by one side of the wiring substrate.

Semiconductor device having wires connecting connection pads

An intermediate structure for semiconductor devices includes a wiring board, a plurality of semiconductor chips mounted on the wiring board, and a sealing body for collectively sealing the plurality of semiconductor chips and having a region with a different thickness.

Growing community of inventors

Tokyo, Japan

Takashi Ohba