Kokuyo Co., Ltd.

Nuvoton Technology Corporation Japan

Takashi Ohashi

Hideto Shima

Takeshi Imamura

Oki Sato

Masaaki Hirako

Kenji Maehara

Hiroto Katsuda

A semiconductor device includes: a semiconductor layer; first and second vertical MOS transistors provided in the semiconductor layer; a metal layer connected to and in contact with an entire surface on a back face side of the semiconductor layer; and a support bonded to a back face side of the metal layer via an adhesive. In a plan view, the support is larger in area than the semiconductor layer and encompasses the semiconductor layer. A thickness of the support is greater than a thickness of the semiconductor layer. In a cross-sectional view, a height of the adhesive along a lateral face of the semiconductor layer does not reach a top face of the semiconductor layer. In the cross-sectional view, a semiconductor chip resulting from excluding the support and the adhesive from the semiconductor device is in a curved shape that projects in a direction toward the support.

Semiconductor device

A semiconductor device includes: a semiconductor layer; first and second vertical MOS transistors provided in the semiconductor layer; a metal layer in contact with and connected to an entire back face of the semiconductor layer; and a support bonded to the back face side of the metal layer via a conductive adhesive. In a plan view, the support is larger in area than the semiconductor layer and encompasses the semiconductor layer. A thickness of the support is greater than a thickness of the semiconductor layer. In a cross-sectional view of the semiconductor device including a center of the semiconductor layer and an outer periphery of the semiconductor layer in the plan view, a semiconductor chip resulting from excluding the support and the conductive adhesive from the semiconductor device is in a curved shape projecting in a direction away from the support.

Glue stick

A dispenser with a transfer head includes a feeding roller placed within a case provided with an opening, and supporting a transfer tape T so as to be capable of being fed; a take-up roller for taking up a base material tape that has been used to transfer; a transfer roller for transferring a transfer agent; an interlocking mechanism for rotating the feeding roller and the take-up roller in an interlocking manner; a holding member provided on the opening side in a front/back direction so as to be capable of moving forward and backward; and a rotational frame for supporting the feeding roller, the take-up roller and the transfer roller, wherein when a pressing force is applied to the case while the holding member abuts against a surface to be transferred P, the transfer head is relatively projected, and moved on the surface P with pressing thereto so that the transfer agent can be transferred.

Dispenser with transfer head

Coating film transfer tool

Growing community of inventors

Osaka, Japan

Takashi Ohashi