Kabushiki Kaisha Toshiba

Technology Research Association for Future Additive Manufacturing

Ricoh Company, Ltd.

Crestec Corporation

Takashi Obara

Mitsuo Sasaki

Hiroshi Ohno

Yuji Sasaki

Kazuyuki Masukawa

Tadahito Fujisawa

Koji Hashimoto

Takeshi Miyazaki

Yuko Kono

Satoshi Tsuno

Hideyuki Ohyi

Yoshiaki Asao

Toshiya Kotani

Naotada Okada

Kimio Miseki

Takeshi Ito

Nobuhiro Komine

Hiromitsu Mashita

Motoyuki Sato

Takashi Nakazawa

Tetsuo Sakai

Hideki Nozaki

Takaki Hashimoto

Yasutomo Shiomi

Yasuhiro Akiyama

Takehiko Isaka

Motoshige Kobayashi

Tomohiko Yamada

Go Obara

Ai Furubayashi

A machining apparatus that need not exchange a processing nozzle when changing a shaping condition, and increases the use efficiency of a material. The processing nozzle that performs processing by ejecting a processing material towards a molten pool formed on a process surface by an energy line includes a cylindrical inner housing that incorporates a path through which the energy line passes, and ejects the energy line from one end. The processing nozzle also includes a cylindrical outer housing that incorporates the inner housing, and has an inner surface tapered in the ejection direction of the energy line ejected from the inner housing. The processing nozzle also includes a slide mechanism that changes, along the energy line, the relative position of the outer housing with respect to the inner housing.

Processing nozzle, processing head, machining apparatus, and control method and control program of processing nozzle

An optical processing head capable of reducing the energy loss at the time of optical processing is disclosed. The optical processing head includes a first optical element that converts light emitted by a light source into first parallel light, a second optical element that is arranged downstream of the first optical element and converts the first parallel light into first divergent light, a third optical element that is arranged downstream of the second optical element and converts the first divergent light into second parallel light, and a fourth optical element that is arranged downstream of the third optical element and converts the second parallel light into convergent light which is condensed on the processing surface side.

Optical processing head, optical machining apparatus, and control method and control program of optical processing head

An optical processing nozzle that homogeneously supplies a fluid to a processing surface in optical processing. The optical processing nozzle includes a beam path that is arranged so that a beam can pass through the beam path towards a processing surface in order to perform processing using a beam guided from a light source, and a channel structure that is arranged around the beam path and is configured to eject a fluid towards the processing surface. The channel structure includes an inflow port through which the fluid flows, at least two passage holes through which the fluid flowing from the inflow port passes, a channel that guides the fluid from the inflow port to the passage holes, and an ejection port from which the fluid having passed through the at least two passage holes is ejected toward the processing surface.

Optical processing nozzle and optical machining apparatus

An optical processing head capable of downsizing an apparatus while increasing the shaping accuracy of optical processing is disclosed. The optical processing head performs processing while moving, in a predetermined moving direction on a processing surface, an optical spot formed by condensing light emitted by a light source. The optical processing head includes an optical element that condenses light emitted by the light source to generate the optical spot of a shape elongated in the moving direction of the optical spot. Part of the optical spot is set as a processing region, the front side and/or rear side of the processing region in the moving direction is set as a pre-heating region and/or post-heating region, and a processing target object before and/or after processing in the region is heated.

Optical processing head, optical machining apparatus, and optical processing method

An optical processing head that detects a trouble of an optical processing head that will be generated at the time of optical processing before the trouble occurs is disclosed. The optical processing head that performs processing by condensing, on a process surface, a ray emitted by a light source for processing includes a cylindrical housing that surrounds a ray for processing emitted by the light source for processing, a ray emitter for inspection that is incorporated in the cylindrical housing and arranged outside the path of the ray for processing, and a light receiver that is incorporated in the cylindrical housing, arranged outside the path of the ray for processing, and receives a ray for inspection emitted by the ray emitter for inspection. The contamination of the inner surface of the cylindrical housing or the concentration of a scattering object flowing into the cylindrical housing is inspected by using a signal acquired from the light receiver.

Optical processing head, optical processing apparatus, and control method and control program of optical processing apparatus

Ejection and stop of a powder flow are switched while maintaining a once generated steady flow without stopping it. A processing nozzle includes a supply source of a fluid containing a powder, a first channel through which the fluid supplied from the supply source passes, a second channel that supplies the fluid to an ejection port of the nozzle, a third channel that releases the fluid outside the nozzle, and a switch that causes the first channel and the second channel to communicate with each other when supplying the fluid to the ejection port, and causes the first channel and the third channel to communicate with each other when not supplying the fluid to the ejection port.

Processing nozzle and optical machining apparatus

This specification discloses an optical processing head including a light guide portion that guides, to a process surface, a ray for processing. The light guide portion is further configured to guide, to the process surface, a ray for inspection different in wavelength from the ray for processing. The optical processing head further includes an inspection portion that inspects the state of the process surface based on reflected light of the ray for inspection reflected by the process surface. With the optical processing head, the state of the process surface can be easily inspected even during optical processing.

Optical Processing head, optical processing apparatus, and control method and control program of optical processing apparatus

According to one embodiment, there is provided a mask set including a first mask and a second mask. The first mask includes a first device pattern and a first mark pattern. The first mark pattern is used for an inspection of a position of the first device pattern on a surface of the first mask. The second mask is used to perform multiple exposure on a substrate together with the first mask. The second mask includes a second device pattern and a second mark pattern. The second mark pattern is used for an inspection of a position of the second device pattern on a surface of the second mask. The second mark pattern includes a pattern corresponding to a pattern obtained by inverting the first mark pattern.

Mask set, fabrication method of mask set, manufacturing method of semiconductor device, and recording medium

According to one embodiment, a resistance change memory includes resistance change elements, vias and sidewall insulating layers, the elements and the vias provided alternately in a first direction and a second direction orthogonal to the first direction, and the sidewall insulating layers provided on sidewalls of the elements. The elements are provided in a lattice pattern having a constant pitch. A thickness of each of the sidewall insulating layers in a direction orthogonal to the sidewalls is a value for contacting the sidewall insulating layers each other or more to form holes between the sidewall insulating layers. The vias are provided in the holes respectively.

Resistance change memory and method of manufacturing the same

According to an aspect of the present invention, there is provided a mask pattern data generation method including: a first step of obtaining a mask data representing from a design pattern by performing a process simulation with a process parameter having a first value; a second step of obtaining a finished pattern from the mask data by performing the process simulation with the process parameter having a different value; a third step of verifying whether a dimensional error therebetween is within an allowable range; and a fourth step of: if the dimensional error is within the allowable range, determining the mask pattern data; and if the dimensional error is not within the allowable range, repeating the above steps by updating the process parameter until the dimensional error becomes within the allowable range.

Mask pattern data generation method, mask manufacturing method, semiconductor device manufacturing method, and pattern data generation program

An electron beam recording apparatus is disclosed that records information onto the surface of a sample by using an electron beam. The electron beam recording apparatus includes an electron source that irradiates the electron beam, a magnetic detector that is configured to move onto and out of an irradiation axis and acquires magnetic information on the irradiation axis, a convergence position control part that calculates a convergence position correction amount for correcting a convergence position of the electron beam with respect to the surface of the sample based on the magnetic information, and a convergence position adjusting part that adjusts the convergence position of the electron beam with respect to the surface of the sample. The convergence position control part causes the convergence position adjusting part to adjust the convergence position of the electron beam with respect to the surface of the sample based on the convergence position correction amount.

Apparatus for recording information onto surface using electron beam

An electron beam applying apparatus includes: a thermal field emission type electron source emitting an electron beam; an electrostatic lens disposed immediately below the electron source and acting as a condensing electrode for condensing the electron beam in a first angular aperture emitted by the electron source in a second angular aperture smaller than the first angular aperture; a condenser lens disposed on a downstream side of the electrostatic lens and condensing the electron beam condensed in the second aperture angel by the electrostatic lens in a crossover point; and an objective lens disposed on a downstream side of the condenser lens and condensing the electron beam condensed in the crossover point by the condenser lens on the surface of the material.

Electron beam applying apparatus and drawing apparatus

A photo mask formed with patterns to be transferred to a substrate using an exposure apparatus, the photo mask comprising a pattern row having three or more hole patterns surrounded by a shielding portion or a semitransparent film and arranged along one direction, and an assist pattern surrounded by the shielding portion or semitransparent film and having a longitudinal direction and a latitudinal direction, the assist pattern being located at a specified distance from the pattern row in a direction orthogonal to the one direction, the longitudinal direction of the assist pattern being substantially parallel with the one direction, the longitudinal length of the assist pattern being equivalent to or larger than the longitudinal length of the pattern row, the assist pattern being not transferred to the substrate.

Growing community of inventors

Yokohama, Japan

Takashi Obara