Sharp Kabushiki Kaisha Corporation

Takashi Nukii

Shigeo Nakabu

Masaru Iwasaki

Katunobu Awane

Keiji Yamamura

Shuhei Tsuchimoto

Satoshi Nishigaki

Akiteru Rai

Hiroshi Matsubara

Yasunobu Tagusa

Atsushi Yoshinouchi

Hirokazu Yoshida

Masataka Itoh

Ryusuke Kita

Yuzi Matsuda

Katsunobu Awane

Yuji Matsuda

A method for mounting a semiconductor device wherein a semiconductor device on which connection electrodes are formed is connected to a circuit board on which electrodes are formed in positions corresponding to the connection electrodes of the semiconductor device, the method including steps of applying an adhesive on a connection face of the semiconductor device to the circuit board or that of the circuit board to the semiconductor device, aligning the electrodes in positions corresponding to each other with the semiconductor device opposed to the circuit board, partially curing the adhesive in portions other than the electrodes, electrically evaluating the connection of the semiconductor device to the circuit board, and curing the uncured adhesive.

Method for mounting a semiconductor device

A liquid-crystal panel includes a plurality of thin-film transistors. Terminal electrodes associated with gate bus lines which connect the gate electrodes of the thin-film transistors include a layer that is made of an electrode material used for the gate electrode, and a transparent conductive coating formed on the layer. This structure produces a stable connection at the terminal electrode of the gate electrode providing the liquid-crystal panel with excellent display qualities and a high reliability.

Terminal electrode structure of a liquid crystal panel display

A method for connecting circuit boards in which a first circuit board having first electrodes is superposed on a second circuit board of which second electrodes are formed in positions corresponding to the first electrodes so that the first and second electrodes are electrically connected with each other, the method comprising a first step of applying a photocuring adhesive on the first electrodes and the residual regions of the first circuit board on which the first electrodes are not formed, a second step of irradiating light from a surface opposite to the surface of the first circuit board on which the first electrodes are formed to cure the photocuring adhesive on the residual regions of the first circuit board on which the first electrodes are not formed, a third step of adhering particles which are conductive at least on outer peripheral surfaces to the first electrodes by means of the uncured photocuring adhesive, and a fourth step of superposing the first circuit board to which the particles are adhered on the second circuit board to electrically connect the first and second electrodes with each other through the particles, provided that the first electrodes are opaque and the first circuit board is light-transmissive.

Method for connecting circuit boards

A connection construction is provided for connecting a first conductor provided on a first member such as a semiconductor driving device to a second conductor provided on a second member such as a liquid crystal display device driven by the semiconductor driving device, the connection construction including a conductive adhesive deposited on the first conductor, a conductive particle bonded with the conductive adhesive and partly protruding toward the second conductor disposed opposite thereto, and an electrically insulating adhesive for bonding the first member to the second member with the conductive particle contacting the second conductor. The first conductor and the second conductor are electrically connected via the conductive particle, and the first member and the second member are mechanically connected with the electrically insulating adhesive. Thus, a semiconductor driving device (LSI) is, for example, directly connected to a transparent substrate of a liquid crystal display device. Also, when an electrically insulating adhesive is used for bonding the conductive particle, the conductive particle is bonded to contact the first conductor.

Connection construction and method of manufacturing the same

A contact-type image sensor comprising a light source that illuminates the manuscript to be read; photodetectors that convert the light reflected by the manuscript into an electrical signal; a substrate that is disposed between the photodetectors and the manuscript, a bundle of optical fibers being buried in the substrate; and wiring electrodes that are disposed on the top surface of the substrate corresponding to the light-emitting face of the bundle of optical fibers and that are disposed on the light-receiving surfaces of the photodetectors, wherein the photodetectors are disposed in such a manner that the light-receiving surfaces of the photodetectors face the light-emitting face of the bundle of optical fibers, the wiring electrodes disposed on the photodetectors being electrically bonded to the wiring electrodes disposed on the substrate.

Contact-type image sensor

A method for making a semiconductor device of a type comprising at least first and second semiconductor circuit units, which method comprises the step of forming a plurality of connecting electrodes on an upper surface of each of at least first and second semiconductor substrates; forming an electrically insulating layer entirely over the upper surface of each of the first and second substrates so as to cover the respective connecting electrodes; partially removing the insulating layer on each of the first and second substrates to permit the respective electrodes to be exposed to the outside; forming metal studs on the first substrate in contact with the electrodes so as to protrude outwardly of the respective insulating layer to complete the first semiconductor unit and forming solder deposits on the second substrate in contact with the respective electrodes on such second substrate to complete the second semiconductor unit; combining the first and second semiconductor units with the metal studs in the first semiconductor unit aligned respectively with the solder deposits in the second semiconductor unit; and heating the resultant assembly to allow the solder deposits to be melted with the associated metal studs consequently immersed into the melted solder deposits thereby to accomplish a firm interlock between the electrodes on the first and second substrates.

Method of making a hybrid semiconductor device

A method for manufacturing a contact type one-dimensional image sensor, which includes the step of providing a light receiving element portion composed of one or more of Group II-VI compounds semiconductor containing Cd on a substrate, and also providing a matrix wiring portion on the same substrate as that of the light receiving element portion, and the method is characterized by the step of forming an insulating layer for the formation of the matrix wiring portion in such a manner as to cover the light receiving element portion.

Method of manufacturing contact type one-dimensional image sensor

A substrate for wiring an electrical component with an external circuit, comprises a base plate for accommodating the electrical component therein, a first insulation layer made of an organic material formed on the base plate, a first wiring formed on the first insulating layer, a second insulation layer made of an organic material formed on the first wiring, a second wiring formed on the second insulation layer, the second wiring being coupled to the electrical component, the base plate, the first insulation layer, the first wiring, and the second insulation layer being bent at the marginal edges thereof, in which portions of the first wiring on the bent portions are made of a material having a low temperature of recrystallization.

Metal-based organic film substrate

A substrate for wiring an electrical component in an electrical circuit comprises a base substrate, a first insulating layer of an organic material formed over the base substrate, a wiring member formed on the first insulating layer, coupled to the component, a second insulating layer of an organic material formed over the first insulating layer, and a terminal member on the first insulating layer and appearing from the second insulating layer, connected to the wiring member. A third insulating layer of an organic material may be interposed between the first and the second insulating layers, carrying a second wiring member connected to the first wiring member.

Thin assembly for wiring substrate

A display module comprises a display device for displaying visual information, an electrode disposed on the display device, a circuit board for carrying wiring lines connected to circuit elements for driving the display deivce, and a conductive elastomer body for connecting the wiring lines and the electrode, the conductive elastomer body being placed between the electrode and a curled edge a flange of the circuit board. In a specific form, the display device is a liquid crystal display cell.

Thin structure of display panel

A high-insulation adhesive sheet is formed on a metal substrate. Bottom conductors are formed on the high-insulation adhesive sheet. A high-insulation organic layer is formed on the high-insulation adhesive sheet and the bottom conductors, and top conductors are formed thereon. The high-insulation organic layer is tightly attached to the metal substrate via the high-insulation adhesive sheet. The bottom conductors and the top conductors are communicated to each other via through holes formed in the high-voltage organic layer.

Growing community of inventors

Nara, Japan

Takashi Nukii