Sony Corporation

Oki Electric Industry Co., Ltd.

Hitachi-High-Technologies Corporation

Other

Oki Semiconductor Co., Ltd.

Honda Motor Co., Ltd.

Ricoh Company, Ltd.

Massachusetts Institute of Technology

Azbil Corporation

Osram Ag

Hitachi Vantara Corporation

Minigrip LLC

Takashi Noguchi

Setsuo Usui

Yuji Ikeda

Dharam Pal Gosain

Mitsuo Soneda

Hiroyuki Miwa

Takayuki Gomi

Hideo Yamagata

Yasuhiro Kanaya

Kazumasa Nomoto

Makoto Terui

Hirokazu Ejiri

Shigeru Kanematsu

Tohru Ogawa

Katsuyuki Kato

Tatsushiro Hirata

Hiroaki Anmo

Rafael Reif

Yoichi Negoro

Takeyoshi Koumoto

Norikazu Ouchi

Kenji Atsuumi

Andrew J Tang

Julie Tsai

Yasuo Tanaka

Hisao Hayashi

Akio Machida

Yoshifumi Mori

Masafumi Kunii

Minoru Sugawara

Yasushi Shimogaichi

Takaji Ohtsu

Yoshiyuki Tajima

Koji Kamoshida

Naomi Ishii

Takefumi Ohshima

Yuji Yamanaka

Toshikazu Maekawa

Takeshi Matsushita

Katsumi Kawano

Hirokazu Takenaka

Kensuke Masuda

Masaki Takano

Hajime Yagi

Nobuhiro Yokoi

Jonathan Westwater

Hideharu Nakajima

Shigeru Yano

Yuji Hayashi

Shigetoshi Sameshima

Toshiharu Suzuki

Kohji Oshikiri

Noriyuki Kawashima

Akira Maekawa

Miyako Nakagoe

Toshimichi Nishimura

Hiromitsu Kato

Kenichi Taira

Michio Negishi

Hideyuki Matsumoto

Yutaka Tandai

Takayuki Noda

Koji Tomita

Masahiro Machida

Tamao Ishikawa

Norikazu Ohuchi

Takeshi Denda

Shigeki Kurihara

Yayoi Shitara

Yasuhiro Tomii

Shohei Matsumura

Tatsuya Tokunga

Kazuhiko Okuzawa

Yuichi Deushi

Toru Hiraga

Satoshi Hashidume

Yuzo No

An interface module connected to a storage controller and relaying communication between a host and the storage controller. The host and the storage controller use different communication protocols, include computing cores and a memory. At least one of the computing cores is a IO core in communication with the host, each of the IO cores has a virtual queue in the memory and the IO core is configured to execute a reception process of converting communication data including a command to the storage controller outputted by the host into a storage interface command and store the communication data in the virtual queue. The IO core executes a sending process for sending to the host by converting to communication data takes out a storage interface command from the virtual queue, and in same session, same IO core performs the reception process and the transmission process.

Interface module that allows for communication between devices with different communication protocols

An information processing device includes: a processing unit that executes sound processing, the sound processing including at least one of recording electronic meeting information and reproducing the recorded electronic meeting information, the electronic meeting information including sound of an electronic meeting in which a user boarding a mobile body participates; a reception unit that accepts selection of whether or not to set external sound as a target of the sound processing by the preprocessing unit, the external sound being output in the mobile body based on a function different from a function of the electronic meeting; and a processing control unit that causes the processing unit to execute the sound processing in accordance with the selection accepted by the reception unit.

Information processing device, information processing method, and storage medium

A display device mounted on a vehicle includes a display including a first region that displays a first image based on first image information in response to detection of a request for display of a vehicle outside image, and a second region that displays a second image based on second image information. The device receives first image information generated by a first device; receives, from a second device, second image information that is image information of a vehicle outside image; and simultaneously displays the first image and the second image in a case where the first image information is received within a predetermined time after the second image information is received, and displays the second image in a case where the first image information is not received even when the predetermined time elapses.

Display device and control method therefor

An engineering device is provided with a link information storing portion that stores link information indicating a linked control program, from among existing control programs that are running in a controller, which operates in coordination with a new control program, and a restart notifying portion that sends to the controller, as a restart control program that is to be restarted at the same time as the new control program, the linked control program of the new control program, specified by the link information, at the time of a downloading process for the new control program.

Engineering device, engineering system, and download processing method

A farmland management system includes an information detection unit configured to acquire information relating to a crop being cultivated, a storage unit configured to store crop registration information for estimating a growth condition of the crop, a growth estimation unit configured to refer to the crop registration information and estimate the growth condition of the crop based on the information relating to the crop and the crop registration information, and a display unit configured to display the growth condition estimated by the growth estimation unit.

Farmland management system and farmland management method

Precise prediction of the state of congestion in an automatic analysis system and adjustment of timings and the order of take-in and take-out of specimens in each of devices prevent increase in TATs of urgent specimens. A device management server for instructing each device to take in or take out specimens in each device determines the current position of each specimen, estimates the staying time of each specimen in one of regions by simulating the operation of each device assuming an initial state in which each specimen is at the current position, causes the simulation unit to perform a simulation, and corrects the timings or order of take-in and take-out of one or more other specimens so that each of the staying times in one of the regions do not exceed a corresponding allowable staying time in the region.

Automatic analysis system and device management server

There is provided a sample test system which can execute a prior process for a specific sample in consideration of priorities and process progresses of a plurality of samples processed in the sample test system. The sample test system includes a sample-test-device management server, when a specific-sample prior process request containing a specific sample ID and a prior-process-request level identification code is accepted from a sample access system, which selects a specific-sample prior-process-policy determination table based on the prior-process-request level identification code attached to the specific-sample prior process request, which determines a specific-sample prior process policy based on the specific-sample prior-process-policy determination table and a process state of the sample, which specifies a sample ID regarding the specific sample ID, and which transmits the specific-sample prior process policy to a sample-test-device group

Sample-test-device management server, sample test device, sample test system, and sample test method

A management server of a sample inspection system includes sample processing information generated on the basis of inspection request data, facility data, a simulation execution portion and a window generation portion for generating a monitor window. The inspection request data contains a priority, an order time, a required time and inspection items and the sample processing information contains an inspection start time and an inspection estimate finish time. The monitor window has a work area in which the samples represented by sample bars parallel to the abscissa are arranged in a vertical direction and a past record and a future schedule are allocated to this abscissa with the present time as the base. The sample bars display a simulation execution portion for executing simulation on the basis of the inspection start time, the inspection estimate finish time and a delay time. The management server displays the simulation result.

Sample inspection system and operating method for management server thereof

A discharge lamp configured to suppress temperature increases in the electrode on the opening part side of a reflective mirror is described. The discharge lamp includes an F electrode and an R electrode having shapes before forming the melt electrodes that satisfy at least one of the following conditions (a) to (c): (a) The diameter of the core wire of the F electrode is d, and the diameter of the core wire of the R electrode is d, then d&#x3e;1.2&#xd7;d; (b) The wire diameter of the coil of said F electrode is d, and the wire diameter of the coil of the R electrode is d, then d&#x3e;1.2&#xd7;d; (c) the number of windings of the coil of the F electrode is nf, and the number of windings of the coil of the R electrode is nr, then nf&#x3e;1.2&#xd7;nr.

Discharge lamp with a reflective mirror with optimized electrode configuration

There is provided an evaluation object pattern determining apparatus capable of determining local patterns to be evaluated. The apparatus is for use in a pattern evaluating system storing patterns of a LSI chip as CAD data, picking out coordinates of local patterns whose process margin is small from the CAD data by way of simulation and assisting observation of the local patterns produced in a fabrication line. The apparatus includes a risk level map creating section for creating risk level maps in which risk areas are disposed. The risk area is assigned with a risk level obtained by digitizing that the risk area is an area whose process margin is smaller than other areas. The apparatus also includes a superimposition processing section for superimposing the coordinates of the local patterns with the risk level map to pick out the coordinates of the local patterns located within the risk area.

Evaluation object pattern determining apparatus, evaluation object pattern determining method, evaluation object pattern determining program and pattern evaluating system

A method for forming a Field Effect Transistor (FET) within a strain effect semiconductor layer is disclosed, whereby the source and drain of the FET are formed only in the strain effect silicon layer. The FET may be formed as a gate electrode of a p-channel type field effect transistor, and a gate electrode of a n-channel type field effect transistor on the silicon layer which has the strain effect through a gate insulating film. The sources and drains of p- and n-type diffusion layers are then formed in the silicon layer having the strain effect, on both sides of the gate electrode.

Method of forming N-and P- channel field effect transistors on the same silicon layer having a strain effect

A fabricating method for a semiconductor device includes forming a heat spreading material on rear surface of the semiconductor wafer. The semiconductor wafer has a plurality of device areas and scribe lines which are arranged between the device areas. After the heat spreading material is formed on rear surface of the semiconductor wafer, the semiconductor wafer is separated at the scribe lines.

Method for fabricating a semiconductor device having a heat radiation layer

An array of electrically conductive members, formed around the edges of a semiconductor device or chip, penetrate from one major surface of the device to the other major surface. In an area located inward of this array, a multiplicity of thermally conductive members also penetrate from one major surface to the other major surface. The semiconductor device can be manufactured from a semiconductor wafer by creating holes that penetrate partway through the wafer, filling the holes with metal to form the electrically conductive members and thermally conductive members, and then grinding the lower surface of the wafer to expose the ends of the electrically conductive members and thermally conductive members before dicing the wafer into chips. The thermally conductive members improve heat dissipation performance when semiconductor chips of this type are combined into a stacked multichip package.

Semiconductor device, stacked structure, and manufacturing method

A processing instrument with configurable processing conditions makes it possible to simplify operations, prevent operation errors, and reuse, without modification, installed software having a track record in operation. An operation terminal includes a research work processing section with software having a track recording in operation that provides a function which receives processing conditions from an input section, a function which executes processing according to processing conditions, and a function which displays results of the processing. A fixed processing condition database stores fixed processing conditions set to a predetermined values. A routine work processing section includes a function for receiving variable processing conditions that are a part of the processing conditions from the input section, a function for creating the processing conditions necessary for the operation terminal by combining the variable and fixed processing conditions, and a function for displaying the result of the processing from the research processing section.

Processing instrument and processing instrument system

The invention of the present application provides a heat radiation structure of a semiconductor device, and includes a substrate having, on a surface thereof, a first area on which the semiconductor device is mounted, and a second area which surrounds the first area. The semiconductor device has a first surface and a second surface opposite to the first surfaces, and is formed with a plurality of terminals provided on the first surface. The semiconductor device is mounted on the substrate in such a manner that the first surface is opposite to the surface of the substrate. A first heat radiating film is formed on the second area of the substrate, and a second heat radiating film is formed on the second surface of the semiconductor device, with the second heat radiating film being spaced apart from the first heat radiating film.

Heat radiation structure of semiconductor device, and manufacturing method thereof

Growing community of inventors

Tokyo, Japan

Takashi Noguchi