Shin-Etsu Polymer Co., Ltd.

Takashi Nogami

Toshiyuki Kawaguchi

Kazuhiro Suzuki

Junya Ishida

Kenro Takizawa

Koichi Nei

The present invention provides a resin film for a film capacitor making it possible to obtain the excellent heat resistance, materialize a reduction in a size of the film capacitor and an increase in a capacity thereof and satisfy a reduction in a thickness of the film and a high voltage resistance thereof. In a manufacturing method in which an extruding equipmentis charged with a molding materialto extrude a filmfor a film capacitor from a T dice, in which the above extruded filmfor a film capacitor is interposed between plural rolls in a receiving deviceand cooled and in which the above cooled filmfor a film capacitor is wound on a winding tubeof a winding device, 100 parts by mass of a polyetherimide resin is blended with 1 to 10 parts by mass of a fluorocarbon resin to prepare the molding material; the above molding materialis extruded through a filterhaving apertureswhich are 0.5 to 6 times or less as large as an average thickness of the filmfor a film capacitor, which is provided between the extruding equipmentand the T dice; and a thickness of the filmfor a film capacitor is controlled to 10 &#x3bc;m or less.

Method for manufacturing resin film for thin film-capacitor and the film therefor

The inventive electroconductive adhesive comprises a resinous matrix, as a dispersing medium of conductive particles, of a polyester-based urethane resin admixed with a masked isocyanate compound as the curing agent. By virtue of the masking of the isocyanate reactivity of the curing agent, the adhesive composition is stable during prolonged storage under a hot temperature or high-humidity condition but can exhibit curing activity when the adhesive is heated at a temperature at which the isocyanate reactivity can be restored.

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Saitama, Japan

Takashi Nogami