Nitto-denko Corporation

Takashi Nishinohama

Masayuki Yamamoto

Yasuji Kaneshima

Norio Mori

Atsushi Ogawa

A cutter blade movably in a radial direction of a wafer is pressed for biasing to an outer circumferential edge of the semiconductor wafer. Simultaneously, the pushing biasing force of the cutter blade is controlled constant with automatic regulation corresponding to a traveling speed variation of the cutter blade, so that effect of a centrifugal force that works at the time of rotating travel of the cutter blade may not vary a pushing biasing force of the cutter blade. As a result, a contact pressure of the cutter blade to the outer circumferential edge of the semiconductor wafer is maintained stable.

Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape

In a method for allowing a cutter blade to relatively travel along an outer periphery of a semiconductor wafer to cut a protective tape joined to a surface of the semiconductor wafer in conformity with an outer shape of the semiconductor wafer, the cutter blade is allowed to relatively travel along the outer periphery of the semiconductor wafer with a positioning notch provided on the outer periphery thereof. The cutter blade is rotationally turned at the fore half of the notch recessed on the outer periphery of the semiconductor wafer during the relative travel of the cutter blade in such a manner that its blade tip is directed toward the center of the wafer. In contrast, the cutter blade is rotationally turned at the rear half of the notch in such a manner that its blade tip is directed toward the outer periphery of the semiconductor wafer.

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Kameyama, Japan

Takashi Nishinohama