Tanaka Kikinzoku Kogyo K.k.

Ultizyme International Ltd.

Takashi Nishimori

Masaaki Kurita

Toshinori Ogashiwa

Yukio Kanehira

Koji Sode

Yuki Ueda

Wakako Tsugawa

A method for measuring a glycated protein in a sample, the method comprising (1) a step of allowing a sample in which a degradation product has been generated from a glycated protein by a protease to react with an oxidoreductase in the presence of an electron mediator to generate a reduced electron mediator; and (2) a step of detecting the reaction state in the step (1) by an electrochemical technique using an interdigitated electrode.

Method for measuring glycated protein using interdigitated electrode

A transfer substrate for transferring a metal wiring material to a transfer target including a substrate, at least one metal wiring material formed on the substrate, at least one coating layer formed on a surface of the metal wiring material, and an underlying metal film formed between the substrate and the metal wiring material, in which the metal wiring material is a compact formed by sintering metal powder such as gold powder having a purity of 99.9 wt % or more and an average particle size of 0.01 &#x3bc;m to 1.0 &#x3bc;m, and the coating layer is a predetermined metal such as gold or an alloy having a different composition from that of the metal wiring material and has a total thickness of 1 &#x3bc;m or less, and the metal underlying film is made of a predetermined metal such as gold or an alloy. The transfer substrate can lower heating temperature on the transfer target side.

Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate

The present invention provides a transfer substrate for transferring a metal wiring material to a transfer-receiving object, the transfer substrate comprising a substrate, at least one metal wiring material formed on the substrate and an underlying metal film formed between the substrate and the metal wiring material, wherein the metal wiring material is a molded article prepared by sintering, e.g., gold powder having a purity of 99.9% by weight or more and an average particle size of 0.01 &#x3bc;m to 1.0 &#x3bc;m and the underlying metal film is composed of a metal such as gold or an alloy. The transfer substrate is capable of transferring a metal wiring material to the transfer-receiving object even at a temperature for heating the transfer-receiving object of 80 to 300&#xb0; C.

Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate

Growing community of inventors

Kanagawa, Japan

Takashi Nishimori