Senju Metal Industry Co., Ltd.

Takashi Nauchi

Hideki Nakamura

Toshihiko Mutsuji

Ryoichi Suzuki

Shinichi Nomoto

Tetsuya Okuno

Isamu Sato

Issaku Sato

Kazuya Kitazawa

Akira Takaguchi

In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.

Method for discharging fluid

Fluid discharge device

A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece corresponding to a discharge part with the fluid. The air in the workpiece is removed in advance, thereby filling the workpiece with the discharged fluid. A fluid discharge device in which, at one end of a discharge head, a suction port for sucking air in the mask on the workpiece, and a fluid discharge device having a discharge nozzle formed thereon for discharging the fluid are formed is used.

Fluid discharge device, fluid discharge method, and fluid application device

Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection headfor supplying molten solder has a nozzlebrought into contact with a mask with openings that is disposed over a substrate. After completing a supply operation, the injection headis forcedly cooled by heat transfer from a cooling unitthrough a heater unitwhose operation has been stopped. Molten solderin the cooled injection headdoes not drool from the nozzlewhen the injection headmoves up.

Solder bump forming method and apparatus

Solder wires are conveyed from insert openings for allowing the solder wires to be inserted toward discharge openings from which the solder wires are discharged and the solder wires project. The projecting wires are cut with first cutting blades and the solder wires inserted into the insert openings are cut with second cutting blades. This enables fixed cutting stress on a portion of the solder wires to be cut with the first cutting blades and a portion of the solder wires to be cut with the second cutting blades at the same time to prevent deformation of the cut surface of the cut solder wires. Solder columns having a column shape and having a uniform length along a conveying direction thereof can be manufactured.

Method for manufacturing solder column, apparatus for manufacturing solder column, and solder column

An apparatus for aligning and dispensing a plurality of solder columns in an array. The apparatus includes a vibrator and an elongated alignment plate supported on the vibrator. The alignment plate includes a plurality of longitudinal guide grooves. A transparent cover is secured on the alignment plate and shaped to cover part of the guide grooves. A parts feeder is operatively associated with the alignment plate to feed solder columns over the upstream end of the alignment plate. The solder columns are received in the guide grooves and fed toward the downstream end of the alignment plate while the alignment plate is vibrated by the vibrator. The solder columns are arranged in an array within the guide grooves so that a vacuum pickup tool may readily capture the cylindrical body of the solder columns.

Apparatus for aligning and dispensing solder columns in an array

A solder reflow furnace includes piping to supply an inert gas into the furnace to maintain an inert gas atmosphere within the furnace and a cooling zone provided next to a main heating zone. The cooling zone is provided with a gas cooling device in which printed circuit boards after soldering are cooled by an inert cooling gas which is in turn cooled indirectly by air outside the furnace so that air is prevented from flowing into the furnace.

Solder reflow furnace

A reflow furnace has a tunnel through which a conveyor for printed circuit boards passes. A plurality of pairs of panel-type blowers capable of blowing hot gas are disposed in the tunnel. The two panel-type blowers in each pair are disposed opposite one another above and below the conveyor. Each panel-type blower has an inlet and a discharge port. The discharge ports of opposing panel-type blowers partially overlap one another in the longitudinal direction of the furnace. When a printed circuit board is present between a pair of panel-type blowers, gas discharged from the discharge ports simultaneously heats both sides of the printed circuit board.

Growing community of inventors

Tokyo, Japan

Takashi Nauchi