Fujitsu Corporation

Renesas Electronics Corporation

Tonen Chemical Corporation

Jp Steel Plantech Co.

Takashi Nakayama

Toshiaki Suzuki

Kazuyoshi Watanabe

Toshimichi Maki

Norio Ao

Ryuji Yamaguchi

Yasuhiro Sato

Hideaki Mizukami

Hirotsugu Kubo

Takao Kuno

Sotoyuki Kitagawa

Teruo Tatefuku

A semiconductor device includes a first semiconductor and second semiconductor chips mounted over a package substrate. The first semiconductor chip includes a plurality of first bonding pads which are arranged along one side of the first semiconductor chip. The second semiconductor chip includes a plurality of second bonding pads and at least one third bonding pad. The second bonding pads are arranged along one side of the second semiconductor chip and for coupling respectively to the first bonding pads by wire-bonding coupling. The at least one third bonding pad is for enabling relay coupling of a corresponding second bonding pad to at least one predetermined first bonding pad which is arranged along the second bonding pads and included in the first bonding pads without crossing another wire in the wire-bonding coupling.

Semiconductor device

An emulation processing method causing a computer including a first and a second processor to execute emulation processing, the emulation processing method includes: calculate a next instruction address next to a received instruction address, and transmit, to the second processor, the calculated instruction address and instruction information read out on the basis of the calculated instruction address, transmit, to the first processor, a first instruction address that is an instruction address included in an execution result of executed processing, and execute processing based on the instruction information received from the first processor, when a second instruction address that is the instruction address received from the first processor is identical to the first instruction address, and read out instruction information on the basis of the first instruction address and execute processing based on the instruction information read out, when the second instruction address is not identical to the first instruction address.

Information processing device and emulation processing program and method

The present invention provides an arc-melting apparatus which attains extremely high efficiency by preheating scraps using exhaust gas from the melting chamber. The arc-melting apparatus needs for no device to carry and supply an iron source to a melting chamber, which makes it possible to preheat the next charge. The arc-melting apparatus has a melting furnace which melts scraps, a preheating shaft connected directly to an upper part of one side of the melting furnace, an arc electrode for melting scraps in the melting furnace, a bucket for supplying scraps to the preheat shaft so as to continuously maintain scraps in the melting furnace and in the preheating shaft, a tapping portion having a tapping hole, being projected outward from the melting furnace and a tilting device for tilting the melting furnace on a side of the tapping portion. The tapping portion is arranged at an orthogonal direction to the direction of the supplied cold iron source. The preheating shaft of the melting furnace and the tapping portion have a distance between the mutual part, so that scraps do not flow out on a the tapping hole side.

Apparatus for arc-melting cold iron source and method thereof

The cross-linkable, foamable polyolefin resin composition capable of forming foams with excellent mechanical properties and heat resistance is made of (a) 30-80 weight % of a propylene-ethylene random copolymer having an ethylene content of 1.5-6 weight %; (b) 10-60 weight % of a propylene-ethylene random copolymer having an ethylene content of 0.2-1.0 weight %; (c) 10-60 weight % of a linear low-density polyethylene; and (d) 1-30 parts by weight, per 100 parts by weight of the above resin components, of a foaming agent.

Cross-linkable, foamable polyolefin resin composition

Growing community of inventors

Kawasaki, Japan

Takashi Nakayama